Showing results: 451 - 465 of 582 items found.
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e-CAM130_CUMI1820_MOD -
e-con Systems Inc.
e-CAM130_CUMI1820_MOD is a 13MP MIPI Camera Module. This small form factor 13MP camera module comes with S-Mount lens holder. It is based on AR1820HS – an 18MP CMOS Image sensor from Aptina™ / ON Semiconductor® and has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs all the Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images and video and the optional MJPEG compression. Though the AR1820HS is an 18MP image sensor, the e-CAM130_CUMI1820_MOD supports only up to 13MP resolution.
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CEM880 -
Axiomtek Co., Ltd.
The CEM880 COM Express Type 6 basic module features 5th generation Intel® Core™ processor (H-processor line), one onboard 4 GB extended temperature DDR3L chip, and one 204-pin SO-DIMM DDR3L socket supporting up to 8 GB. With outstanding computing performance, low power consumption, wide temperature range, and seismic design, the rugged basic-size SoM (system on module) drives Internet of Things innovation and is ideal for graphics-intensive and rich I/O applications such as telecommunication, medical imaging, digital signage, gaming machines, military, and networking.
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Cadence Design Systems
A major new challenge at 20nm/14nm is the requirement for extra masks (double patterning technology, or DPT) to make existing lithography work at this advanced node. Read 20 questions on 20nm - a Q&A document. Escalating data volume and denser, more complex chips are testing the limits of traditional routing architectures. Even the slightest perturbations in the design flow can cause dramatic swings in design integrity. Engineers face a predictability crisis riddled with silicon failures, performance degradation, and prolonged design schedules. And new process and design innovationshigh-k metal gate, SOI, 3D-IC packagingare intensifying the pressures of adoption and rapid deployment.
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CD74HC4067 -
SparkFun Electronics
This is a breakout board for the very handy 16-Channel Analog/Digital Multiplexer/Demultiplexer CD74HC4067. This chip is like a rotary switch - it internally routes the common pin (COM in the schematic, SIG on the board) to one of 16 channel pins (CHANxx). It works with both digital and analog signals (the voltage can't be higher than VCC), and the connections function in either direction. To control it, connect 4 digital outputs to the chip's address select pins (S0-S3), and send it the binary address of the channel you want (see the datasheet for details). This allows you to connect up to 16 sensors to your system using only 5 pins!
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ChipCHECK -
Gastops
Gastops specializes in advanced fluid sensing and analysis systems specifically designed and developed for critical equipment condition monitoring applications.ChipCHECK offers the fastest way of making on-site equipment maintenance decisions. It is a field deployable analyzer designed for rapid on-site identification of equipment lube oil. This automated maintenance decision-support tool employs innovative laser spectroscopic technology, which enables on-site analysis of microscopic chip debris. ChipCHECK provides the maintainers with quick, reliable, and conclusive information, including the total number of particles, and the size, shape, and specific alloy classification for each individual particle on the sample.
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Inframet
Imaging electronic sensors sensitive in visible, near infrared, short wavelength infrared spectral bands that generate two dimensional electronic images have found mass applications in industry, defense, security, science, environmental protection, medicine etc. Imaging sensors sensitive only in VIS/NIR range are almost exclusively silicon chips manufactured using a series of technologies: CCD, CMOS. ICCD, EMCCD, EBAPS, sCMOS in color or monochromatic versions. Color VIS/NIR sensors are sensitive to light only in visible range when monochromatic VIS/NIR sensors are sensitive up to about 1000nm.
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ROM-5820 -
Advantech Co. Ltd.
The Advantech ROM-5820 stands as a state-of-the-art SMARC 2.1 Computer-on-Module, incorporating the robust NXP i.MX95 System-on-Chip (SOC). This SOC features an impressive configuration, with up to six Arm Cortex-A55 cores, accompanied by a dedicated Cortex-M7 and M33 real-time processor, and an added Neural Network accelerator. The ROM-5820 provides extensive connectivity options, including USB 2.0, USB 3.2 Gen1By1, 10 Gigabit Ethernet, MIPI-CSI, PCI Express, as well as both a dual-channel LVDS and a 4-lane MIPI-DSI Display interface. These remarkable features position the ROM-5820 as an exceptional choice for a wide variety of embedded applications.
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TS9000 Family -
Advantest Corp.
The TS9000 series leverages Advantest's industry-leading terahertz analysis technology and expertise amassed over our decades as a global leader in semiconductor test equipment. This system provides a new high-speed, high-precision solution for measurement and analysis tasks including IC chip mold thickness and IC package / printed board wiring quality, which existing methods cannot measure adequately.
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Abaco Systems Inc
The VP430 is 3U VPX RF processing system featuring the transformational Xilinx® Zynq® Ultrascale+™ RF system-on-chip technology (RFSoC). The ZU27DR device used on the VP430 includes eight integrated analog-to-digital converters at 4GSPS, eight digital-to-analog converters at 6.4 GSPS, a user-programmable FPGA fabric, and multi-core Zynq ARM® processing subsystem.
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MKS Instruments
MKS RF Power Generators provide reliable solid state power for thin films processing equipment. They are vital components of semiconductor fabrication systems, which produce the integrated circuits (ICs) or chips required by modern computers and electronic equipment. MKS RF Generators, combined with our Impedance Matching Network and our V/I Probe form a complete RF Delivery System.
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400-02 -
Srico, Inc.
Srico’s optical voltage probe uses advanced, proprietary optical chip technology to achieve precise, interference-free measurement. Our sensor and optical fibers are made of dielectric materials. This facilitates a high degree of isolation between the voltage test point and the instrumentation system ⎯ at a safe distance of 100 meters and more. This system senses, measures, and transmits electrical data very accurately.
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HELIOS -
Diamond Systems Corp
Helios is a low power, mid-range performance PC/104 form factor single board computer combining a highly integrated CPU with Diamond Systems’ renowned high-accuracy data acquisition circuitry on a single board, reducing size and cost while increasing ruggedness. Helios utilizes a Vortex integrated single chip CPU operating at 800MHz or 1GHz, and 256MB of DRAM soldered on-board.
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Seismic Source Co.
*GPS accuracy for time break collection and source equipment locations.*32-bit, high speed, ADC chip for lower noise and increased accuracy for signatures.*Operates independently of crew, including observer and shooter or operators.*Can be used with any Vibrator Control System.*Great for monitoring rental equipment and operators.*Provides accurate start times that can be used with any nodal recording system.
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104-DIO-48E -
Acces I/O Products, Inc.
The circuits use an 82C55A PPI with mode 0 supported. Ports A, B and C are buffered with 74ABT245 transceivers and pulled up to 5V. The optional 82C54 has three-sixteen bit down-counters within one chip. These counters are useful for making frequency outputs, measuring frequency of square waves, pulse width outputs, pulse width measurements etc. Software drivers are provided on CD.
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N2115A -
Keysight Technologies
The N2115A DDR4 BGA Interposers are soldered in between the DRAM and PC board or DIMM raw card where the DRAM would normally be soldered. They are designed with the PCB or DIMM foot print on the bottom side and the DRAM footprint on the top side. The signals from the memory controller chip and DRAM are then passed directly to the top side of the BGA probe adapter where they can be accessed with the oscilloscope probes.
