Showing results: 556 - 570 of 582 items found.
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Fairview Microwave Inc.
Fairview Microwave’s line of coaxial RF probes and RF PCB probe positioner are ideal for use with chip evaluations, signal integrity measurements, coplanar waveguide, substrate characterization, gigabit SERDES and test fixture applications. The RF coaxial probes provide return loss better than 10 dB and a maximum operating frequency of 20 GHz. The probes have a 3.5mm female interface, a pitch of 800 or 1500 micron and they can be cable-mounted. They feature gold-plated contacts and can be used by hand, with or without a probe positioner. Compliant coaxial GSG (or GS) pogo pins allow for a broad range of probing angles. The RF PCB probe positioner can hold coaxial probes, has articulated joints and delivers multi-axis positioner control. This positioner also boasts a magnetic mounting plate with on-off positioner switch.
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PEM010 -
Pasternack Enterprises, Inc.
The PEM010 is a highly integrated millimeter wave transmitter that covers the 60 GHz global unlicensed spectrum allocations packaged in a standard waveguide module. Transmitter architecture is a double conversion, sliding IF with wide bandwidth capability through the up-conversion chain from baseband to carrier. The I/Q interface accepts analog baseband signals which provides for flexibility in design and applications. The baseband input optionally supports FSK/MSK modulation for non-coherent applications. The transmitter incorporates a complete waveguide interface with low-loss transition between the chip and the WR15 waveguide port. The integrated package is small and lightweight, with a simple to use multi-pin ST4 connector for power, reference clock, digital control port and baseband signals. Either of two reference clocks can be used for setting 540 MHz or 500 MHz channel spacing.
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CRY5520 -
Hangzhou JiGao Electroacoustical Science and Technology Co.,Ltd
CRY5520 audio frequency sweep signal generator, adopts single chip microcomputer to control frequency sweep, digital and analog combination, stable performance. It has extremely low distortion, sine wave output, small distortion, good stability, and the frequency range covers the entire audio frequency domain . It is especially suitable for pure audio sound inspection of speakers and headphones. It can work in two modes of logarithmic frequency sweep and manual frequency modulation. The starting point, end point and frequency sweeping time of the frequency sweep can be set arbitrarily. The manual frequency modulation can be divided into coarse and fine adjustment, which can quickly and accurately adjust the frequency.128 × 64 dot matrix liquid crystal display is used to display frequency and voltage values simultaneously, with synchronous output.
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Teledyne Defense Electronics
Teledyne Advanced Electronic Solutions assembles and tests a variety of complex circuit card assemblies (CCAs) using leading edge, advanced technology assembly automation. We specialize in low-volume, high-mix assembly of highly complex CCAs.- RF, analog, high-speed and digital circuits on rigid-flex and Cu core substrates- Typical lot sizes from 3 to 300 pieces- 4 high speed, flexible SMT lines- Production processes for components from 0201 chips to large grid-array components and connectors- 100% solder paste, automated optical, and x-ray inspection- Forced air convection reflow with inert atmosphere option- Special processes for RF assemblies (filters, shields, etc)- BGA underfill, conformal coating, etc.- Selective and wave solder pin-thru-hole processes- CCA and component bonding processes
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RC-088 -
Rinch Industrial Co.,Limited
This instrument is a special equipment for measuring the reflectivity of rearview mirror (or similar product) of motor vehicle. The product composes intelligent measuring instruments, optical integrating sphere, parallel lamp, standard light source, constant current source etc. It is easy to operate，it can measure the reflectivity quickly and accurately. On instrument structure, it adopts standardized modulation design. It takes latest single chip as its digital central processing element. After the measuring signal is converted by modulus, CPU will do some computation and compensation. The instrument can display the reflectivity of device which is measured in rear time. It operates simply and quickly, the indication is direct and accurate. It’s good for quality examination &control in the production scene as well as laboratories. This product has the convenience &quick demarcation way, can meet requirement of different occasion. It is applicable for measuring light reflection on mirror and not mirror parts.
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OSA202C -
Thorlabs, Inc.
Thorlabs' Optical Spectrum Analyzers (OSAs) perform highly accurate spectral measurements. Compatible with fiber-coupled and free-space light sources, these compact benchtop instruments suit a wide variety of applications, such as analyzing the spectrum of a telecom signal, resolving the Fabry-Perot modes of a gain chip, and identifying gas absorption lines. Many commonly available OSAs use grating-based monochromators, which have slow acquisition times due to the need to mechanically scan the grating and average out noise at each wavelength. Thorlabs' OSAs acquire the spectrum via a Fourier transform using a scanning Michelson interferometer in a push/pull configuration. This approach dramatically improves the acquisition time, enables a high-precision wavelength meter mode with 7 significant figures and ±1 part-per-million accuracy, and allows the included software to provide robust statistical analysis of the acquired spectra, as explained in the Design tab.
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OSA201C -
Thorlabs, Inc.
Thorlabs' Optical Spectrum Analyzers (OSAs) perform highly accurate spectral measurements. Compatible with fiber-coupled and free-space light sources, these compact benchtop instruments suit a wide variety of applications, such as analyzing the spectrum of a telecom signal, resolving the Fabry-Perot modes of a gain chip, and identifying gas absorption lines. Many commonly available OSAs use grating-based monochromators, which have slow acquisition times due to the need to mechanically scan the grating and average out noise at each wavelength. Thorlabs' OSAs acquire the spectrum via a Fourier transform using a scanning Michelson interferometer in a push/pull configuration. This approach dramatically improves the acquisition time, enables a high-precision wavelength meter mode with 7 significant figures and ±1 part-per-million accuracy, and allows the included software to provide robust statistical analysis of the acquired spectra, as explained in the Design tab.
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KLA-Tencor Corp
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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CM22303 -
LinkedHope Intelligent Technologies Co.,Ltd.
CM22303 uses Intel® 7th generation Kaby Lake-Y platform and Core M Ultra low-power SoC processors, and integrates the full functions of CPU, GPU and South/North Bridge on a single chip. The processor provides powerful computing and display performance with dual-core and four threads configuration. Its turbo frequency can boost up to 3.6 GHz and the display output resolution can be up to 4K. CM22303 has an amazing thermal design power consumption of only 4.5W (TDP) and can be used for a variety of high-performance fanless designs. SPI BIOS is designed on board to support dual-channel low voltage on board memory (up to 16GB), Gigabit Ethernet, TPM module and other functions. With high-performance and low power consumption, it can be widely used in the field of low power embedded systems. Meanwhile, CM22303 adopts COM Express standard and is compatible with Type10 pin out definition, and also provides rich peripheral interfaces such as USB3.0/2.0, PCIe, SATA, HD Audio etc.
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AIM GmbH
AIM’s PANAVIA test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core design with one processor for real time bus protocol support, massive memory and IRIG-B time code encoder/decoder functions are standard. AIM delivers versions of our modules with extended temperature range and conformal coating. With 8 Tx and 8 Rx channels per module, functions include autonomous transmit sequencing, continuous clock and data transmissions, host controlled double buffering, programmable interrupts, data selection on specific tag identifier, selectable triggers on data and/or tags with full protocol error injection/detection, real time bus recording and time stamping to ensure your bus integrity. Each module is delivered with a Board Support Package (BSP) comaptible to the legacy PCI and cPCI hardware modules.
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PRO RACK ATE -
Qmax Test Technologies Pvt. Ltd.
Pro-Rack is a cost effective ATE System, which comes with Modular Structure provision option to improvise and enhance much instrumentation based on the user’s requirements. Basically it is designed to cater to the needs of PCB test and repair depots, keeping in mind the changing PCB technology and the challenges in testing them off-line. It can provide complete PCB test and diagnostic functions for any kind of PCB including the latest very high density complex PCBs with high pin count PQFP, FPGA VLSI chips. AC /DC parametric tests enables testing of the DC parametric of device pins on the edge connector for input bias current, Fan out capacity ,Tri-state leakage currents, AC parametric measurements such as Input / Output Propagation delay Rise time / Fall time to further enhance fault coverage. Pro-Rack is designed with VPC Mass Interconnect adapter with 16 bit fixture ID interface to the UUT through simple clips and probes or through card edge or through a bed of nail test fixture.
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Analog Devices Inc.
Isolated LVDS (low voltage differential signaling) devices couple differential signals applied to the LVDS receiver inputs across the isolation barrier to the outputs on the other side and re-transmits the bit stream or clock as LVDS. Analog Devices' drop-in LVDS isolators offer designers robust, high speed differential signaling for point-to-point and multidrop applications. Extending iCoupler® chip scale transformer technology for ultrahigh speed data encoding, these LVDS isolators support a a data rate of up to 2.5 Gigabits per channel for a total bandwidth of 10 Gbps. In contrast to expensive fiber implementations, deserialized links over standard digital isolators or optocouplers, and design-intensive bespoke solutions using transformers or high voltage capacitors, ADI Gigabit Digital LVDS isolators offer the only integrated comprehensive, high performance isolation at 10 Gbps. High performance galvanic isolation for applications include analog front-end (AFE), processor to processor serial communication, or video and imaging data (such as HDMI isolators) as well as isolation between boards, or at a cable interface for LVDS or CML signal chains.
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SAMPULSE20x2 -
Furaxa, Inc.
The SAMPULSE20x2 is a demonstration board for the Furaxa SiGe3 30GHz sampler/pulser IC. The SIGe3 IC is a dual channel sampler pulser chip, and the SAMPULSE20x2 demonstration board contains two 2.4mm combined TDR input/output connectors, one to each sampler/pulser channel in the IC. The SiGe3 IC's two sampler outputs are then sent to to two SMA jacks, the first outputting the sample taken on the rising edge of the sampler clock, and the second containing the sample taken on the falling edge of the sampler clock. The sampler clock input, which must be a square wave, may be set to any frequency from 5MHz to 1GHz, causing the board take two pairs of samples (one on each clock edge) at rates from 5 million to 1 billion per second. A pulser clock input, which may be set to any frequency from 5MHz to 2GHz, and MUST be a square wave (preferably differential) with rise time under 100pS, causes the board to produce concurrent pulses on both of the SiGe3's I/O pins, which produce near-concurrent pulses at the two 2.4mm sampler/pulser TDR input/output connectors.
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Xeltek
※ Four Pick & Place nozzles, Eight socket pressing actuators and 2 tape feeders※ High throughput up to 2400UPH※ Embeded with eight ultra-high speed programmers SuperPro / 7500, each with up to 4 sockets, totally 32 sockets. Throughput 60 times higher than SuperPro / SB01 for eMMC devices※ Supports over 80,000 devices from over 300 IC manufacturers※ Supports tray, tape and tube input and output. Supports laser and ink marking※ Short change-over time※ Intelligent s/w cuts learning curve and setup time, makes task management an easy job※ Compact sizeHigh throughput：4 nozzles, 8 independent socket pressing actuators and 2 tape feeders. Up to 2400 UPH for devices with programming time less than 50 sec. Throughput 0.6 to 60 times higher than SuperPro/SB01, especially higher for large capacity devices like eMMC, NAND /NOR FLASH,SPI FLASH. Suitable for both small and large capacity devices. Prog. Time (S) 50 60 120 180 240 300 UPH (unit per hours) 1600 1600 840 560 420 336 Accurate positioning：Equipped with high performance servo system, precise CCD cameras and vision algorithm for device alignment and sockets / pick & place spots positioning.High performance programmers： 8 ultra-high speed universal gang programmers SuperPro/7500 resident. Each with up to 4 sockets, totally up to 32 sockets in the system. Supports up to 100,000 devices from over 300 IC manufacturers and growing.Varied I/O devices：Supports tray, tape and tube input and output. Supports laser and ink marking. Supports packing conversion and can work as a packing conversion machine alone.Short change-over time：I/O devices and socket adaptor are easy to be changed when programming task need to be changed. Socket positioning can be performed automatically. Projects can be loaded automatically with barcode scanning.Powerful and intelligent software：Setup data saved for next operation, log file and statistic reports for quality and yield traceability, flexible sockets prohibition strategy promises high yield rate for unattended operation, graphical user interface cuts learning curve, prevents chip over-lapping by socket checking before chip placing.Remote Control：Remote project loading, quality monitoring, volume control, file security.
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CM22301 -
LinkedHope Intelligent Technologies Co.,Ltd.
CM22301 uses Intel® sixth-generation Skylake platform and Core M low-power SoC processors, and integrates the full functions of CPU, GPU and South/North Bridge on a single chip. The processor provides powerful computing and display performance with dual-core and four threads configuration. Its turbo frequency can boost up to 3.1GHz and the display output resolution can be up to 4K. CM22301 has an amazing thermal design power consumption of only 4.5W (TDP) and can be used for a variety of high-performance fanless designs. CM22301 supports up to 16GB dual-channel low-voltage DDR3L memory populated onboard, and up to 64GB on-board solid state disk silicon, as benefit the development of ruggedized products for harsh environment applications.As defined by VITA 59 specification, CM22301 provides up to 6 PCIe lanes, enabling flexible functionality expansions, such as NICs, DAQs, video capture and so on. Meanwhile, CM22301 also provides up to date computer interfaces like GbE, SATA3, USB3.0/2.0, HD Audio, etc. CM22301 uses the same 220pin board-to-board connector and Type10 pin out definition as COM Express.
