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Interconnects
Links between systems, networks,nodes, equipment, devices, components and circuits.
See Also: Mass Interconnect, Connectors, Cable Assemblies, Interfaces
- Virginia Panel Corporation
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Signal, Contact, ITA, QuadraPaddle, 5 Amp, 22-24 AWG
610138109
Primary mating contact 610138216. (May mate with other ITA contacts, as well.)Available in twin-female, crimp/solder, twin male, and wire-wrap design, QuadraPaddle contacts are engineered for flexible interconnect options. Rated at 5 amps continuous (1250 VAC) with a 2-ounce insertion force, QuadraPaddle contacts provide 4 reliable points of contact per pin, outstanding electrical performance, and low mating force.
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CompactPCI Boards
*CompactPCI (cPCI) boards are 3U or 6U boards connected via a passive PCI (Peripheral Component Interconnect). Up to 8 boards can be connected together in a segment. Segments can be connected through bridges. *They are grouped into four categories: CPU, Communication, Input/Output, PMC carrier.
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Connectors
Optimized Super SMA Connectors feature a 32 GHz operating frequency, leading the market in precision reflection (VSWR) performance. MegaPhase, with its team of design experts, drives innovation in RF/Microwave connectors and improvement of interconnects supporting aerospace, satellite, military and telecommunication applications. These connectors are Space Qualified.
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Couplers Combiners And Splitters
Smiths Interconnect supplies waveguide couplers, combiners and splitters for a variety of space, defense and air defense radar applications. These devices are designed to complement our waveguide isolators and terminations.
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Differential Picosecond Pulse Generators
PicoSource PG900 Series
The fast-transition pulse can stimulate a transmission path, device or network with a broad spectrum signal in a single instant. Such a pulse is very useful for many of the high-speed broadband measurements that we need to make; for instance in time-domain reflectometry, semiconductor test, gigabit interconnect and port test and in radar.
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Electromagnetic Simulation Software
Wave3D CMD
Wave3D CMD 'command-line' controlled suite of tools is designed for large-scale parametric modeling of electromagnetic phenomena using High-Performance Computing (HPC) facilities and Cloud computers. The package utilizes the same computational engine based on MLFMA aided Moment Method solution of the Surface-Volume Integral Equation as the Wave3D CAD package. Method of Moment analysis with multilayered media Green's function enables efficient analysis of wide range of 3D planar applications such microstip antennas, microwave circuits, and interconnects.
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Environmentally-sealed plastic connector
REP Series
Smiths Interconnect’s REP series is easy to use for quick mating. The REP panel and cable connectors are a highly cost-effective interconnect system, which solves the constant need for simple and reliable connector solutions in rail applications.
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Flexible Waveguide
Flann offers a number of solutions for flexible waveguide interconnect including waveguide-coaxial-waveguide and semi rigid. Traditional flexible waveguide solutions are available on request.
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G2- 2 Module Solution
The G2 offers the reliability of VPC interconnect technology in a compact, high-density two-module package. While simultaneously engaging a wide range of interconnect options in multiple configurations, the G2 provides a rapid alternative to repeated connect and disconnect of individual leads and connectors in a rugged, reliable system.
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Heavy Duty Modular Connector
HyperMod Series
Smiths Interconnects’ heavy duty, modular, rectangular HyperMod Series is available with a variety of contacts, special shells for harsh environments and special high creepage/clearance modules. The series conforms to DIN 43652 standards and is NF F61-030 railways approved.
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High density, ESA approved PCB connector
KMC Series
Smiths Interconnect's KMC series is an ESA qualified, high density board to board and board to wire interconnect available in multiple configurations from 26 to 162 positions
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High density PCB connectors
MHD/MDD/MDP Series
Smiths Interconnect's MHD/MDD/MDP series is an ESA qualified, high density board to board and board to wire interconnect available in up to 400 positions, with available insulators to accommodate coax and power contacts.
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Interconnect Adapter, C-Size, Double Slot, 4 Module Positions
510109118
Interconnect Adapters funnel wiring from modules to a VXI card. The adapter has removable side, top and bottom plates. Connector cover plates and cable clamps are ordered separately.
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Interconnect Adapter, C-Size, Single Slot, 2 Module Positions, Clamp Style
510109179
Interconnect Adapter, C-Size, Single Slot, 2 Module Positions, Clamp Style
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ITA, S6, 6 Module, With Protective Cover
410122100
The S6 ITA Frame has a powder coated finish adding an extra layer protection against the elements. It is an integral part of this rugged Mass InterConnect system. The S6 ITA has module positions screened on top for ease of module placement. Protective Cover included.
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Mass Interconnect
Mass interconnect is a way of connecting test instrumentation to a device under test (DUT). To put it simply, mass interconnect is a very large plug and socket which connects your device under test to your test instrumentation without the mess and hassle of having to connect each signal separately.
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Mil-C-24231 Connector
100 Series
The Teledyne DGO 100 Series connectors are designed, manufactured and tested in accordance with the stringent requirements of Mil-C-24231 and used primarily in Navy dry mate submersible interconnect applications.
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Mini Modular, High Density Connector System
H Series
The modular design of the Smiths Interconnect H Series allow custom configurations from standard off-the-shelf components without the cost and lead-time of custom tooling. The H Series offer a variety of designs to meet specific customer needs for extreme high density signal, power, and coaxial interconnect solutions.
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Module Solution
G2 - 2
The G2 offers the reliability of VPC interconnect technology in a compact, high-density two-module package. While simultaneously engaging a wide range of interconnect options in multiple configurations, the G2 provides a rapid alternative to repeated connect and disconnect of individual leads and connectors in a rugged, reliable system.
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Network Delay Emulator
BGP Network Delay Emulator. The Border Gateway Protocol or BGP is at the core of the modern Internet. Large corporate and government enterprise networks are increasing their use of BGP to interconnect different administrative and country specific regions
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Optical Connectors
Radiall's full range of optical interconnect solutions includes standard interfaces, optical termini, optical connectors and custom optical assemblies and subsystems. Suitable for harsh environments and designed for demanding applications where reliability and high performance are required, our cost-effective optical connectors are adapted to the specific requirements for the telecom, industrial, aerospace and defense markets.
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PCB Connectors
HDLP Series
Smiths Interconnect's HDLP series is a low profile, high density interconnect with integral sealing
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PCB Connectors
HPH Series
Smiths Interconnect's HPH series is a high density interconnect available up to 303 contacts with multiple hardware choices and backpotting option
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PCIe Adapter for XMC
PCIe8LXMCX2
Embedded applications frequently require real time processing coupled with special purpose IO. With the PCIe8LXMCX2´s two positions a PrXMC can be matched with another XMC to make a high bandwidth processing node. The PrXMC can communicate with the host for set-up, and then use the switch to interconnect with the special purpose IO card.
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PCI Express
PCIe
PCI Express (PCIe) has become the leading interconnect technology to succeed the Peripheral Connect Interface (PCI) architecture. The PCI Express(PCIe) architecture retains the PCI usage model and software interfaces for investment protection and smooth development migration. The technology is aimed at multiple market segments in the computing and communication industries, and supports chip-to-chip, board-to-board and adapter solutions. PCI Express 5.0 currently runs at 16GT/s or 32Gbps per lane in each direction, providing a total bandwidth of 128GBps in a 16-lane configuration which is the largest size in use.
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Powered VXS Crates
VXS - "VME-bus switched serial" is the new ANSI / VITA 41 standard which combines the 32-bit parallel VME-bus with high speed switched serial interconnect fabrics in order to increase the data transfer bandwidth to several GB/s.
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Pressure Balanced, Oil-Filled Hose
PBOF
Pressure Balanced, Oil-Filled (PBOF) hose assemblies from Teledyne ODI are designed and qualified to accepted industry standards. The double-walled hose design incorporates inner and outer elastomeric barriers with fiber reinforcements to withstand the demands of long performance life requirements in deep ocean interconnect and distribution applications. The hose is filled with non-conductive silicone oil, which acts as a pressure compensator and dielectric. The electrical and/or optical conductors are loosely housed within the oil-filled assembly.
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Probe Positioners (Probe Manipulators)
PacketMicro offers a broad ranges of probe positioners to allow designers to guide standard oscilloscope/TDR/RF/microwave probes onto the small geometries of fine-pitch interconnects, SMD packages, MCMs, hybrids and ICs.
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Receiver, 9025 VXI, 25 Module, C-Size Interlocking
310104127
This 25 module VXI Receiver allows use of 12 pre-wired interconnect adapters. It hinges down for direct access to the instruments and is equipped with a locking handle to ensure all contacts are engaged. A standard integrated microswitch shuts off power when the ITA disengages from the receiver.
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Robust Modular Rectangular Connectors
B Series
Smiths Interconnect addresses the industry’s need for reliable, low cost interconnections with the rectangular modular connectors B Series. B Series incorporates the highly reliability Hypertac® hyperboloid contact which provides optimum performance in harsh conditions such as extreme mechanical shock and high mating cycles.
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ScanWorks Boundary-Scan Test
ScanWorks Boundary-Scan Test
The Boundary-Scan Test (BST) Development Software is one of the several configurations of the ScanWorks boundary-scan (JTAG) test and on-board programming environment. Test engineers can quickly develop interconnect tests and device-programming actions for use on first prototype board to accelerate the board bring-up process. Then tests can be exported for use in manufacturing and repair facilities.
