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Scanning Acoustic Microscopy (CSAM)
Scanning Acoustic Microscopy, also known as C-SAM or Acoustic Micro Imaging or AMI, outstanding benefit is its ability to find hidden defects within assemblies and materials that can occur during manufacturing or environmental testing. Defects such as delaminations, voids and cracks can be identified and analyzed more effectively using Acoustic Microscopy than with any other inspection method.Unlike other non-destructive techniques such as X-Ray and Infrared Imaging, Acoustic Microscopy is highly sensitive to the elastic properties of the materials it travels through. Because of this, the ability of Acoustic Microscopy to find and characterize these physical defects is clearly superior. Typical applications include production control, failure analysis, and product development.Through the use of ultra-high frequency ultrasound, C-SAM non-destructively finds and characterizes physical defects—such as cracks, voids, delaminations and porosity— that occur during manufacturing, environmental testing or even under normal component operation. Because of the unique aspects of the technology, AMI can locate these defects better than any other inspection method.
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SAM Premium Line
PVA TePla Analytical Systems GmbH
The SAM Premium Line combines acoustic microscopy and optical microscopy. It enables the scanner to be combined with both an inversion as well as a reflected-light microscope. The technology used in the SAM Premium Line is based on a core platform that employs the latest production and research technology. The individual systems are characterized by high throughput, high flexibility and a wide scanning range. They can be expanded to suit customer requirements and specified for the most diverse applications.
