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Design For Test

test facilitated in a product's design.

See Also: DFT, BIST


Showing results: 796 - 810 of 1406 items found.

  • Digital Multimeters

    Triplett Test Equipment & Tools

    compact digital multimeter with a backlit LCD display. It offers a large variety of measurement features including AC/DC Voltage, DC Current, Resistance, Continuity, Diode Test, Transistor hFE, and Temperature. The rubberized boot provides impact and drop resistance in a sleek ergonomic design, and the user-friendly Auto Power Off feature helps maximizes battery life. The Model 1101-B is well suited for a variety of commercial and residential applications such as security, home theater, electrical, HVAC installations and more. Includes test leads with alligator clips, Type K bead probe and battery (9V).

  • UHS II Protocol Analyzer and Exerciser

    PGY-UHS II SD/SDIO - Prodigy Technovations Pvt. Ltd.

    UHS II Protocol Analyzer (PGY-UHS II SD/SDIO) is the Protocol Analyzer with multiple features to capture and debug communication between host and design under test. PGY-UHS II SD/SDIO UHS II Protocol Analyzer is the most feature rich comprehensive Protocol Analyzer available to capture and debug UHS-II protocol data. PGY-UHS-II Protocol Analyzer supports FD156 and HD312 data rate. The innovative active probe has minimum electrical loading on device under test (DUT) and captures protocol data without affecting the performance of DUT.

  • AUTOMATED SAFETY AND COMPLIANCE

    DMC, Inc.

    DMC's test and measurement system offerings include designs and development of Automated Safety, Compliance, and Benchmark Testing. These serve interests of commercial product certification, including fire hazards, safety and signaling, lighting, building safety, energy, and hazardous location testing. These also serve interests of product and technology benchmarking, including brand quality protection, consumer quality, and energy efficiency. Test systems have been developed by DMC to support many standards, including UL (Underwriters Laboratories), Consumer Reports, Intertek, Energy Star, and EN / CEN European Standards.

  • Laser Diameter Measuring Instrument

    RC-078 - Rinch Industrial Co.,Limited

    The RC-078 Laser Diameter Instrument is a high accuracy one without contacting designed on the basis of the laser scan measuring principle. The 2-dimension measuring mode is applied to the instrument, and the 2-way laser beam is in the positive cross design in the measuring field, thus effectively eliminating testing errors caused by work piece shocks. It is special suitable for real-time measurement of the production field, and widely used in the test of round wire materials such as communication cables, optical cables, co-axial cables and power cables, and the test of various kinds of other round work piece diameters.

  • Wafer Probe Loadboards/PIB

    Dynamic Test Solutions

    DTS has a full line of standard PIBs for all major tester platforms. Custom PIB designs can accommodate any test head, prober and manipulator configuration, including probe card changers, overhead direct dock setups and cable interfaces. DTS wafer test loadboards are compatible with a variety of pogo pin interface towers. All PIBs are constructed with impedance control, precision matched line lengths, full power and ground planes and both analog and digital resources to provide high quality signal integrity directly to the device.

  • Current Compression Flexure Testing Machine

    CST-300/200 - Jinan Testing Equipment IE Corporation

    The Compression and Flexure Testing Machine is mainly designed for compression and bending tests of cement & mortar specimens. The Compression and Flexure Tester for Current can finish compression and flexure tests automatically by one-key action . Computer & software are also adopted to make the operation even easier. With new design and advanced technology, the series of Compression and Flexure Testing Machine have more advantages in appearances operation & applications. The Compression and Flexure Tester for Cement is an ideal tester for quality control at industrial & mineral enterprises, teaching in high schools, and technology researching al scientific industries.

  • Thermal Test Boards

    Thermal Engineering Associates, Inc.

    TEA offers a series of thermal test boards for package characterization and design comparison that conform to to the JEDEC JESD51 standards. The board family, referred to as the TTB-1000 series, consists of two different standard sizes designed to cover a wide range of package sizes. These boards, also referred to as test coupons, provide a well defined mounting environment, will withstand temperatures to 125 oC, and have lead lands terminated in eyelets to allow for hand-wired connection to the board edge contacts. The board mates with a dual 18-pin, 3.962 mm (0.156") pitch edge-card connector.

  • Portable Hardness Tester

    Sinowon Innovation Metrology Manufacture Ltd.

    ◆ Metal shell, nice appearance design.◆ Available to save 2000 groups test results.◆ Support hardness conversion among HRC, HRA, HRB, HV, HB, etc, can convert 2 different scales simultaneously.◆ 4” LCD to display hardness result, conversion results, Max, Min,Mean value;◆ Support blue tooth printer, with RS232 to connect computer for software running;◆ Can test all kinds of metal which more than 5kg;◆ Indicating error ±5HLD, conform standard ASTM A956;◆ Support 7 types of impact devices.

  • IP X5, X6 - Walk-In Rain Test Chamber

    ACMAS Technologies Pvt. Ltd.

    WEIBER designs and manufactures standard as well as customized water spray test chamber for evaluating various automotive, electrical and electronics items under water, rain or shower conditions. The chamber interrogates the performance of parts when subjected to water droplets.The system is based on the IP X5, X6 specification requirements, and can also accomplish individual automaker’s tests, as well as electrical-enclosure tests.Our system uses multiple control solenoids to vary the water's spray volume/pressure. A holding tank prepares the water to the desired temperature, if required. A pump ensures the water is delivered in the proper pressure range.

  • FPGA Image Processing (IP) Development Kit

    ProcVision - Gidel

    Gidel’s Vision Pro Development Kit is an optimal solution for developing,validating, demonstrating and evaluating Image Processing (IP) andpipeline designs on FPGA.The suite is designed to provide a complete and convenient envelop enablingthe developer to focus strictly on the proprietary image processingdesign. The entire Vision Pro flow is within a single FPGA, independentof the final target application(s). The Vision Pro flow is composedof a pipeline that streams simulated data to the user image processingdesign under test (DUT) and then captures the design’s output streamfor displaying, storing, analysis and/or co-processing on host software.The entire process is performed on a single FPGA without the need foradditional peripheral connectivity or tools.Vision Pro suite is plug-and-play enabling the developer to begin at oncethe IP design development and validation. A simple design example providesthe developer immediate hands-on familiarization with the systemflow and supporting tools. The final design can be ported to any IntelFPGA device or other vendors’ devices (FPGA or ASIC) by replacing basiclibraries. To significantly reduce compilation time, initial design developmentmay be on a small FPGA device and later compiled for the targetdevice(s). The target implementation may use any FPGA board. For a fullImaging/Vision system solution, Gidel offers a number of off-the-shelfgrabbers and FPGA accelerators that are designed to utilize these imageprocessing blocks and Gidel Imaging Library (GIL).

  • Automated Thermal Stress System

    ATSS Series - Thermotron Industries

    Thermotron's Automated Thermal Stress Systems (ATSS) facilitate extremely rapid product temperature change rates in a space-saving, self-contained design that accelerate a Thermal Stress test. Thermotron's ATSS chambers meet the latest MIL-STD 883E and MIL-STD 202F thermal shock specifications as well as JEDEC and IPC test methods. ATSS chambers are capable of the following: Rapid thermal shocking, Accelerated product stressing, Controlled thermal cycling in a self-contained, compact design. With separate hot and cold zones, the Automated Thermal Stress System was designed with a patented retractable product transfer carrier that makes full use of the available working volume in both temperature zones for increased product loading and throughput. The product transfer carrier reduces the overall height requirements of the chamber and is made as light as possible to minimize thermal loading restraints. Thermotron ATSS chambers can be used as part of most commercial reliability and quality control programs, helping to determine:

  • FPGA PXIe High-Performance Digital I/O Card

    GX3700e - Marvin Test Solutions, Inc.

    The GX3700e is a user configurable, FPGA–based, 3U PXI Express card offering 160 digital I/O signals which can be configured for single-ended or differential interfaces. The card employs the Altera Stratix III FPGA, which can support SerDes data rates up to 1.2 Gb/s, digital I/O clock rates of 700 MHz, and features over 45,000 logic elements and 1.836 Kb of memory. The GX3700e is supplied with an integral expansion board providing access to the FPGA’s 160 I/Os. Alternatively, users can design their own custom expansion cards for specific applications - eliminating the need for additional external boards which are cumbersome and physically difficult to integrate into a test system. The design of the FPGA is done by using Altera’s free Quartus II Web Edition tool set. Once the user has compiled the FPGA design, the configuration file can be loaded directly into the FPGA or via an on-board EEPROM.

  • Drop Test Machine

    Shanghai Linpin Instrument

    Single-wing Drop Test Machine Simulate the drop conditions of packaged products when different faces, edges and corners fall to the ground from different heights, thus to understand the damage of the product and evaluate the drop height and impact resistance that the packaging materials can endure while falling down, so as to improve and optimize package design according to actual conditions of the product and national standard range.

  • Oscilloscopes

    Tektronix, Inc.

    8 out of 10 engineers around the world trust Tektronix to help them debug and test tomorrow's designs faster. With the broadest portfolio of digital oscilloscopes available, the richest set of product features, the most extensive analysis capability and our award-winning service and support, Tektronix has the right oscilloscope to meet your needs. Learn more about the different types of oscilloscopes available.

  • Force Sensors

    TE Connectivity Ltd.

    TE Connectivity (TE) designs and manufactures force sensors for applications that require high performance or unique packaging, including electro-mechanical flight control, test and measurement and ultra-low cost OEM load cells for medium to high volumes. Based on our proprietary piezoresistive silicon strain gage (Microfused) technology, our sensors combine durability and long-term stability in extremely low cost packages.

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