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Proto
Construction of first working designs.
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product
Cloud Edition
HES-DVM Proto
HES-DVM Proto CE is the Cloud Edition of Aldec’s HES-DVM software product used for design compilation and partitioning into multi-FPGA prototyping platforms. It is available in Amazon AWS Marketplace as an Amazon Machine Image (AMI) built upon the Amazon Linux image as a base with preinstalled Aldec HES-DVM software. The HES-DVM Proto CE combines Electronic Design Automation software for design partitioning and compute platform scalability of Amazon Elastic Compute Cloud (Amazon EC2).
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product
Automatic Cleaning and Calibration
Knick Elektronische Messgeräte GmbH & Co. KG.
Fully automatic process monitoring in combination with the analysis measuring system Protos and the retractable housings SensoGate or Ceramat. Highly accurate measurements even under difficult process conditions such as high pressure, high temperatures and high levels of impurities.
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product
ETX® Reference Carrier Board in ATX Form Factor
ETX-Proto
The ETX-Proto is an ETX Reference Carrier Board in standard ATX form factor. Together with the ETX module of your choice and off-the-shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification. The ETX concept has a great many advantages over full custom designs. It reduces engineering complexity, lowers the threshold for total project quantity and last but not least brings your product to the market in no time.
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Mainframe or -E Expansion Chassis - Control up to 16 Modules with up to 8 Relays per Module
LXA/128-MF
These Chassis control up to 16 modules with up to 8 relays per module. A large variety of different switch modules are available to build almost any configuration. Modules are available to build matrix or mux configurations or discrete relay modules. Input detection modules, output driver modules and proto board modules allow custom systems for almost any application. LEDs on the front panel show switch and power status. A thumbwheel manual control is optional.
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product
Surface Mount-to-DIP JEDEC SOT-25, SOT-23A-6 Adaptor
1110748
Surface Mount to DIP Adapter for SOT-25, SOT-23A-6. Allows for breadboarding or substitution of microgate SOT-23A-6 and SOT-25 IC and transistor packages into .100 [2.54] pitch proto boards or PC boards. Solder masked top-side pads allow user to hand solder devices directly to topside of adapter with fewer problems of solder bridging. Longer male bottom pins are available at special request for easy use of probe clips. Large topside pads allow for soldering test pins, jumpers, etc. to top of adapter.