Showing results: 151 - 154 of 154 items found.
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KLA-Tencor Corp
KLA’s advanced process control and process enabling solutions support integrated circuit manufacturing. Using KLA’s comprehensive portfolio of defect inspection, review, metrology, patterning simulation, in situ process monitoring and data analytics systems, IC manufacturers can manage yield and reliability throughout the chip fabrication process - from research and development to final volume production. SPTS provides deposition process solutions for insulating materials and conducting metals that cover a range of chip manufacturing process steps. IC manufacturers use KLA's array of products and solutions to help accelerate their development and production ramp cycles, to achieve higher semiconductor die yield and improved IC quality, and to improve overall profitability in the IC manufacturing process.
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Libra Industries
Libra offers our customer a full suite of support services to help manage your product across the entire product life cycle. One of the most important aspects of our partnership with our customers is a robust supply chain management solution. We have spent decades building our partnerships with our valued suppliers, to offer you an extensive supply chain you can rely on. Over the years, Libra has invested heavily in systems and sophisticated data analytics, to intelligently manage that supply chain and link it to you product and schedule requirements. At the front end of your product’s life cycle, we offer rapid prototyping, full NPI support and strong DFx capabilities, to assist in making your product cost effective, quality driven and highly manufacturable. We also offer a full suite of RMA and warranty support services to support your product through its entire life cycle.
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KLA-Tencor Corp
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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ICO500-518 -
Axiomtek Co., Ltd.
The ICO500-518 featuring flexible I/O expansion, sufficient storage and network capability is well-suited for transportation, public utility, smart building, solar energy, as well as factory automation fields. By bundling Axiomtek’s intelligent AMS software solution for device monitoring and remote management, the ICO500-518 is able to implement environment signal monitoring, edge analytics and remote device management in the IIoT world. It has also passed the EN 50121-4 certified for railway applications. The rugged high computing edge gateway has scalable CPU options with the 7th gen Intel® Core™ i7/i5/i3 (codename: Kaby Lake-U) or Celeron® processors and supports one DDR4-2133 SO-DIMM slot for up to 16GB of system memory. The ICO500-518 features basic benefits whether low latency or cost efficiency; moreover, offering much more other advantages for IIoT applications. It not only supports multiple OT communication protocols that can significantly reduce the effort required to collect data from different field devices, but also provide local intelligence to allow operators respond faster to events that happen at the remote site and minimizes latency between edge devices and the cloud server. Also, with TPM 2.0, this IIoT edge gateway provides tailored levels of security depending on the application needs. Axiomtek’s ICO500-518 has two optional plug-in I/O module slots and four different types of I/O modules to meet different customization requirements. An integrator can choose from four available I/O modules including an 8-port GbE LAN module; 8-port isolated RS-232/422/485 module; 4-port isolated RS-232/422/485 with one isolated DIO (8-in/8-out) module; 8-port isolated CANbus 2.0A/B module to customize the ICO500-518 to fit its specific project requirements. Additionally, the ICO500-518 offers flexible communication options - two full-size PCI Express Mini Card slots and one external SIM card slot for 4G/3G, GPS, LoRaWAN, Wi-Fi and Bluetooth connections. Furthermore, it supports swappable 2.5-inch SATA drive and external CFastTM card to provide sufficient storage capability. For withstanding harsh operating conditions, this IP40-rated embedded box PC offers an extended operating temperature range of -40°C to 70°C, a wide range DC input of 12V to 48V with OVP, UVP, OCP, RPP power protection, and up to 3G vibration endurance.
