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Warpage
unwanted bend in a flat or straight surface.
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Warpage Metrology System
TableTop Shadow Moiré (TTSM)
Measure warpage of substrates up to 300mm x 310 mm (a 300mm wafer or two JEDEC trays) with the entire measurement taking less than two seconds. Whether individual parts or a JEDEC tray of multiple parts, the TTSM provides an ultra-fast and highly accurate measurement at room temperature that is suited for tabletop use.
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Thermal Warpage Measurement Tool
PS600S
The TherMoir PS600S is a metrology solution that utilizes the shadow moir measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for samples up to 600 mm x 600 mm. With time-temperature profiling capability, the TherMoir PS600S captures a complete history of a sample's behavior during a user-defined thermal excursion.
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Thermal Warpage Metrology Tool
AXP 2.0
The TherMoiré® AXP 2.0 is a modular metrology solution that utilizes the shadow moiré measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 400 mm x 400 mm. With time-temperature profiling capability, the TherMoiré® AXP 2.0 captures a complete history of a sample’s behavior during a user-defined thermal profile.
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Wafer Thickness, TTV, Bow and Warpage
ALTO-TTV FAMILY OFFERS THE SPEEDY MEASUREMENT OF WAFER GEOMETRY PARAMETER, MORE IMPORTANTLY, WE CAN AUTOMATE THE TOOL TO HANDLE FROM THIN WAFERS TO PERFORATED, WARPED, BUMPED, AND TAPE-FRAMED WAFERS. OPTIONAL SORTER AND SHIPPING JAR UNPACKING FUNCTION AVAILABLE.
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Thermal Warpage and Strain Measurement Tool
PS200S
The TherMoir PS200S is a metrology solution that utilizes the shadow moir measurement technique combined with automated phase-stepping to characterize out-of-plane displacement forsamples up to 150 mm x 200 mm. With time-temperature profiling capability, the TherMoir PS200S captures a complete history of a sample's behavior during a user-defined thermal excursion.
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Reflow Simulator & Warpage Measurement System
SRS-2
Observe and measure the curving and warping of electronic parts and boards due to thermal stress, using actual reflow conditions.
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Digital Image Correlation System for Complete 3D Warpage, Thermal Expansion, and Strain Analysis of Materials and Components in the Heating and Cooling Phase
Q-400 TCT
The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.
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Testing and Measurement
AkroMetrix provides a variety of products to help you identify and evaluate warpage: For warpage measurements along a production line or at room temperature, AkroMetrix has developed the LineMoiré Production Level Automated Flatness Inspection System. If you need to measure warpage and flatness during pre-defined temperature profiles, AkroMetrix's TherMoiré In-Process Warpage Measurement Systems may fit your requirements.
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Akrometrix Software Suite
Studio Platform
Akrometrix Studio is an advanced set of integrated software modules that work together to run all Akrometrix equipment. The Studio software suite takes users from profile creation, through warpage measurement, temperature profiling, analysis of warpage data, and reporting seamlessly. Studio software users will have nearly the same experience in working with different Akrometrix measurement technologies and different Akrometrix measurement tools.
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Leadframe Inspection Machine
IV-L200
The IV-L200 is a leadframe inspection machine ideal for measuring leadframe dimension and pitch. Aside from identifying leadframe warpage, it is also used to detect bent or skewed leads as well as surface defects such as scratch, ink, and contamination, among others.
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Lithography System
JetStep S3500
The JetStep S3500 panel lithography system is designed specifically for advanced packaging panel production. The system incorporates advanced features that address requirements for panel-level packaging, such as die shift due to placement accuracy or subsequent processing steps, CTE mismatch, panel warpage and panel handling.
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Wafer Sorter and Inspection
SolarWIS Platform
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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3D SPI Series
MS-11e
- Exclusive15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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3D SPI Series
MS-15
- Exclusive 15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
