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Wafer Sorter and Inspection
SolarWIS Platform
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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kSA Emissometer
The kSA Emissometer is designed to quickly and easily generate high-resolution diffuse and specular reflectance and total emissivity maps of MOCVD carriers. Carrier emissivity variation means temperature non-uniformity, which can lead to reduced device yield and possibly complete growth run failure. With the kSA Emissometer, emissivity changes can be tracked to determine carrier end-of-life, without wasting growth runs. The kSA Emissometer also detects unwanted residual deposits after baking, and easily identifies carrier surface defects, scratches, microcracks and pits that are not visible to the eye.
