Showing results: 1 - 13 of 13 items found.
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NXE systems -
ASML
NXE lithography systems are used in high-volume manufacturing of advanced Logic and Memory chips. The first systems to use ASML’s novel 13.5 nm EUV light source, they print microchip features with a resolution of 13 nm, which is unreachable with deep ultraviolet (DUV) lithography. Chipmakers use our NXE systems to print the highly complex foundation layers of their 7 nm, 5 nm and 3 nm nodes. Read about how EUV lithography went from imagination to reality.
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EXE systems -
ASML
EXE, or ‘High NA’, systems are the latest generation in EUV lithography. With a numerical aperture (NA) of 0.55, their innovative new optics provide higher contrast and print with a resolution of just 8 nm.
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ASML
Using extreme ultraviolet (EUV) light, our NXE and EXE systems deliver high-resolution lithography and make mass production of the world’s most advanced microchips possible
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Electrogrip Company
Lightweighted and low-expansion chucks with 10nm active-area flatness are required in EUV lithographic tools. These chucks also have low outgassing and low particle generation.
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HORIBA, Ltd.
HORIBA Scientific holographic lamellar gratings exhibit ultra-low grooves roughness and unique efficiency uniformity making them ideal for Synchrotron, Free Electron Laser (FEL), EUV or Soft X-ray light sources.
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EQ-10 -
Energetiq Technology, Inc.
The EQ-10 is a compact, easy-to-use, reliable, and cost-effective EUV light source, based on Energetiq's proven Electrodeless Z-pinch™ technology using Xenon gas. The EQ-10 EUV source is uniquely suited for metrology and research applications.
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SOPHIA® XO -
Teledyne Princeton Instruments
SOPHIA® XO offers high-sensitivity (>95% QE) and high-speed for the widest range of VUV and x-ray detection, with thermoelectric cooling up to -90℃ and high frame rates. With a rotatable, industry-standard CF flange and high-vacuum seal design the software-selectable gains and readout speeds make this camera well suited for UHV applications.
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HASO EUV -
Imagine Optic
Imagine Optic's HASO EUV wavefront sensor, developed in conjunction with LOA and the SOLEIL synchrotron, is the only device of its kind available that offers you the extreme precision and direct measurement functionality needed for today's demanding laboratory and industrial applications.
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KLA-Tencor Corp
KLA’s patterning simulation systems use advanced models to explore critical-feature designs, manufacturability and process-limited yield of proposed lithography and patterning technologies. Our patterning simulation software allows researchers to evaluate advanced patterning technologies, such as EUV lithography and multiple patterning techniques, without the time and expense of printing hundreds of test wafers using experimental materials and prototype process equipment.
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ASML
Chips are made up of many layers stacked on top of one another, and it’s not necessarily the latest and greatest immersion lithography machines that are used to produce these layers. In a given chip, there may be one or two more complicated layers that are made using an EUV lithography machine, but the rest can often be printed using ‘older’ technology such as dry lithography systems. This is certainly more cost-effective for customers, since these older machines are less expensive to purchase and maintain. Read about how dry lithography systems are enabling progress.
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ASML
Immersion systems are the workhorses of the industry. Our latest NXT machines have shown the ability to run in excess of 6,000 wafers per day, with an average five percent productivity increase over 12 months, supporting our customers' value requirements. We continue to innovate our immersion systems to meet the requirements of future nodes, benefiting from commonalities in R&D with our EUV program, while ensuring the platform’s extendibility through System Node Enhancement Package upgrades. Thanks to these packages, any NXT system can be upgraded to the latest technology.
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McPherson, Inc.
Solar blind detector for operation in the 1 to 180 nanometer region. It is encased in a vacuum tight housing for vacuum operation. The Model 425 is ideal for measurements in the Extreme and Vacuum UV (EUV and VUV) where the solar blind feature eliminates potential interference from long wavelength ultraviolet and visible light. It may be operated in pulse-counting mode or DC. The CEM is also available with coatings like Cesium Iodide or Magnesium Fluoride to enhance response in different energy regions.
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Aerotech, Inc.
Aerotech has a long history of engineering and manufacturing motion systems and components for high precision wafer processing, scanning electron microscopy (SEM), wafer bumping, 450 mm wafer manufacturing, lithography equipment and advanced laser micromachining. We also specialize in systems and components for vacuum applications, such as EUV lithography. So whether you need off-the-shelf wafer bumping components or a custom-engineered SEM system manufactured and tested to exacting specifications, Aerotech can provide the optimal solution for your application.
