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- TEAM SOLUTIONS, INC.
product
HandyScope HS6-DIFF With SafeGround & SureConnect: 1 GS/s, 250MHz BW, 4 Channel (256MS/ch), USB Differential Digital Storage Oscilloscope, Spectrum Analyzer, Voltmeter, Transient Recorder
HS6-DIFF-1000XMSG-W5
- 1GS/s sampling and flexible resolution of 8-16 bit.- Four input channels up to 250 MHz analog bandwidth- Highly accurate 1 ppm time base- DC Accuracy of 0.25 % and 0.1 % typical- Very fast 200 MSamples per second USB streaming Data logger- Spectrum analyzer with 32 million bins- Optional SureConnect connection test on all channels- Up to 256 MSamples memory per channel
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Memory Test Software
Teradyne’s customers count on us for our Near Device Under Test (DUT) technology that gives memory device manufacturers a guaranteed performance advantage. A brief description of dynamic memory and storage memory devices will highlight why device manufacturers depend on Teradyne’s memory test solutions.
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Memory Test System
T5833/T5833ES
T5833 system is a cost-efficient, high-volume test solution capable of performing both wafer sort and final test of DRAM and NAND flash memory devices. Amid surging sales of mobile electronics, DRAMs, NAND flash memories and multi-chip packages (MCPs) — the main device types used in smart phones and tablets — are quickly evolving toward higher speeds and greater device capacity. Internet and cloud servers also are driving demand for faster, higher-capacity ICs. Yet the cost of testing today's wide array of memory devices is an obstacle for chipmakers, which urgently require solutions that can deliver high functionality, high performance and low cost of test (COT). Advantest's new, multifunctional T5833 memory test system meets these needs, delivering both wafer sort and final test capabilities for a full range of memory devices, including LPDDR3-DRAMs, high-speed NAND flash memories and next-generation non-volatile memory ICs.
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Memory Test System
T5230
T5230 memory test system for NAND/NVM devices adopts a combined array architecture to achieve best-in-class cost-of-test performance for wafer test, including wafer-level burn-in (WLBI) and built-in self-test (BIST). The system can perform on-wafer test of 1,024 memory devices per test head in parallel, delivering high productivity and enabling floor space savings of up to 86%. Multiple test cells are connected per system controller in the T5230, allowing independent wafer test of each test cell. The test cells can be stored in a general multi-wafer prober while minimizing the test cell floor space, and the tester can be docked with probers in both linear and multi-stack configurations. For functional tests at a maximum test rate of 125MHz/250Mbps, the T5230 assures high timing accuracy, repeatability, and failure detection capability.
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Memory Burn-In Test
The N3500 is Neosem Technology’s fourth generation memory test system. Specifically designed for Flash Components and Flash Cards, the N3500 tester-on-a-board architecture targets the broadest range of DUT technologies in various form factors and packages. Each Tester Board (or “Blade”) contains 288 I/O pins and 32 DPS supplies.
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Memory Test System
T5511
Offering Multi-functionality and Industry's Top Test Speed of 8Gbps.
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Memory Test System
T5831/T5831ES
High-productivity tester achieves low cost-of-test by performing massive parallel testing of NAND Flash and MCPs for SSDs and mobile applications
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Memory Test System
T5851/T5851ES
The T5851 system is designed to provide a cost-effective test solution for evaluating high-speed protocol NAND flash memories including UFS3.0 universal flash storage and PCIe Gen 4 NVMe solid-state drives (SSD), both of which are expected to be in high demand for the LTE 5G communications market.
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Memory Test System
T5830/T5830ES
Highly flexible tester which has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories
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Memory Test Systems
T5503HS2
Semiconductor memories are in high demand to meet the needs of fast-growing end markets such as portable electronics and servers. It has been forecasted that applications ranging from mobile devices and data centers to automobiles, gaming systems and graphics cards will consume an estimated 120 billion gigabits of DRAM capacity. To meet this market demand, new generations of memories with data-transfer speeds of 6.4 Gbps and higher are being developed. Advantest’s second-generation T5503HS2 tester is designed to handle these ultra-high-speed memory ICs.
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Memory Test System
T5835
The new T5835 has full testing functionality, from package testing to high-speed wafer testing, for any memory ICs with operating speeds up to 5.4 Gbps, including all next-generation memories from NAND flash devices to DDR-DRAM and LPDDR-DRAM. It can handle 768 devices simultaneously for final package-level testing. It additionally features functions such as an enhanced programmable power supply (PPS) for advanced mobile memories, and a real-time DQS vs. DQ function to improve yield.
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High-Speed Memory Test Solution
UltraFLEX-M
The UltraFLEX-M builds on the advanced test technology and architecture of the proven UltraFLEX test system to ensure high test quality at the lowest cost of test for high-speed memory devices.
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Parallel Memory Test Solution
Magnum2
Teradyne’s Magnum 2 test system delivers high throughput and high parallel test efficiency for high performance non-volatile memories, static RAM memories and logic devices.
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Flash Memory Test System
T5830
T5830 memory tester, the latest member of its T5800 product family, optimized for testing a wide range of flash memory devices used in mobile electronic devices. The highly flexible T5830 tester has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories.
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DDR4 Pro Memory Test Adapter
This memory test adapter for the RAMCHECK LX includes an extraordinarily rugged test socket for many thousands of insertion/removal cycles.
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Ultra-high Performance Solution for Memory Device Test
Magnum EPIC
Teradyne’s Magnum EPIC is a high-performance test solution for latest generation DRAM devices. These devices are key enablers for technologies like 5G, AI, cloud computing, autonomous vehicles, AR/VR and applications with high definition graphics.
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High Throughput 1 ns Pulsed IV Memory Test Solution
NX5730A
Precise and fast characterization of new memory, such as spin transfer torque magneto resistive random access memory (STT-MRAM) from DC to high-speed pulsed IV measurement on silicon wafers Apply accurate and high-speed pulsed voltages (down to 1 ns pulse) to magnetic tunnel junction (MTJ) for STT-MRAM and precisely measure the resistance of MTJ Perform all typical MTJ characterization tests in one solution10 to 100 times faster cycle test, such as a bit error rate test (BERT)Capture and visualize MTJ switching waveforms clearly during the writing pulse Dedicated solution with Keysight Technologies’ technical expertise
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EFT Module for Teststand
The Electronics Functional Test (EFT) Module for TestStand provides out-of-the-box tools to speed up development of automated tests for electronic assemblies including PCBAs, subassemblies and final assemblies. Test engineers can develop, deploy and execute test sequences quickly and efficiently with minimal custom code development for a shorter time-to-solution.
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Test Solutions
Our range of test solutions is far reaching, comprised of off-the-shelf test instruments and interfaces, standard automated test systems, and custom solutions for test, simulation, and training. Put our E2E focus and experience to work for you with these solutions: automated test equipment, maintenance trainers, and test management software.
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Tactical Radio Test Set
CTS-6010
The CTS-6010 brings an entire test bench to your front lines. Enable your technicians to detect equipment faults and verify operational capabilities at the I- and O-levels, saving valuable diagnostic time and cost.
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PCI Express 5.0 Test Platform
Teledyne LeCroy’s PCI Express 5.0 Test Platform is part of a suite of tools that facilitates complete protocol testing of PCI Express devices up to and including version 5.0. The latest feature of the Teledyne LeCroy Test Platform is the addition of an integrated interposer, which eliminates the need for an external interposer. This innovation simplifies setup with fewer connection points and outboard devices, making analysis easier and more reliable than ever. In addition to using the Test Platform with the Exerciser, the user can connect two of their own devices and use the Test Platform as a PCIe 5.0 backplane and as an interposer to capture protocol traffic between the systems.
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PCIe 5.0 Test Platform
PXP-500A
The Teledyne LeCroy PXP-500A Test Platform provides a convenient means for testing PCIe 5.0 cards with a self-contained portable and powered passive backplane. The PXP-500A provides power required for both cards under test.
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ARINC 818 Tester
iWave 3U VPX High-Speed Video/Data Processing Card is a rugged standalone module in the 3U VPX form factor, aimed for the high-speed data, video processing, and display applications is ideal for military, defense, and aerospace applications requiring an optimal balance of performance and power efficiency. iWave 3U VPX High-Speed Video/Data Processing Card is implemented using Xilinx Kintex-7 device architecture and has I/O interfaces including High speed 16 channels of transceiver interfaces capable of operating up to 6 Gbps data rate, Gigabit Ethernet, RS232, RS422, PCIe interface, Built-in health monitoring circuits, HDMI input, and output interfaces
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Automatic Test System
Automatic Test system is the ultimate solution for power electronic testing. The system includes a wide range of hardware choice such as AC/DC Sources, Electronic Loads, DMM, Oscillate Scope, Noise Analyzer and Short /OVP Tester. This flexibility combined with its open architecture software platform-PowerPro III, gives users a flexible, powerful and cost effective test system for almost all types of power supply testing.
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SoC Test System
Specifically designed for high-throughput and high parallel test capabilities to provide the most cost-effective solution for fabless, IDM and testing houses. With the full functions of test capability, high accuracy, powerful software tools and excellent reliability, 3650-EX is ideal for testing consumer devices, high-performance microcontrollers, analog devices and SoC devices.
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Semiconductor Test System
TS-960e
The GENASYS Semi TS-960e PXI Express Semiconductor Test System is an integrated test platform that offers comparable system features and capabilities found in proprietary ATE systems. Available as a bench top system or with an integrated manipulator, the TS-960e takes full advantage of the PXI architecture to achieve a cost-effective and full-featured test solution for device, SoC and SiP test applications.
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VLSI Test System
3380P
The 3380D/3380P/3380 test system have 4 wires HD VI source and any-pins-to-any-site high parallel test (multi-sites test) functions (512 I/O pins to test 512 ICs in parallel) that can meet the upcoming higher IC testing demands.
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VLSI Test System
3380D
The 3380D/3380P/3380 test system have 4 wires HD VI source and any-pins-to-any-site high parallel test (multi-sites test) functions (256 I/O pins to test 256 ICs in parallel) that can meet the upcoming higher IC testing demands.
