Showing results: 871 - 885 of 888 items found.
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Bruker Corporation
rom the very compact FTIR spectrometer to the world’s highest resolution: Bruker offers the industry's largest selection for demanding routine and High End FTIR research application including the new and unique verTera cw THz functionality.Process monitoring with FTIR / FT-NIR process spectrometers.A complete line of Near Infrared Spectrometers to fit all your needs, including Process Monitoring.FTIR Microscopy and Raman Microscopy and Spectral Imaging for high sensitivity at high spatial resolution.High spectral resolution, high performance Raman and FT-Raman spectrometers for advanced routine solutions.FTIR Gas Analyzers for the fully automated and high precision real-time monitoring of gas compoundsImaging Remote Sensing systems for analysis of gases, liquids and solids.CryoSAS semiconductor material quality control for photovoltaic and electronics industry.OPUS, the "all-in-one" IR and Raman spectroscopy software consists of a suite of software packages that cover both standard and specialized applications.ONET, software for the setup, administration and control of large FT-NIR spectrometer networks.
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Ceres T 640 Series -
Xenics
The Ceres T 640 series is based upon the Dione 640 OEM thermal imaging core with 640×480 pixels and 12 µm pixel pitch and NETD of less than 50 mK. The camera offers superior on-board thermographic performance (accuracy, stability) in the temperature range up to 400 °C.The Ceres T 640 camera outputs full frame images at 60 Hz via either a CameraLink or GigE Vision interface – all GenICam compliant.The compact size and excellent thermographic stability and accuracy, and GenICam compliant interfacing allow for easy integration in demanding industrial thermography applications.The camera offers one standard option of lens and thermal calibration pack.The compact Ceres T 640 series find application in process monitoring, medical and scientific and advanced research.Benefits & Features• Compact size and high-performance• Superior on-board thermographic performance (stability, accuracy)• GenICam compliant• Uncooled operation
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KLA-Tencor Corp
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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FLIR T865 -
Teledyne FLIR
The FLIR T865 thermal imaging camera is a non-contact inspection tool with 180° rotating optical block that allows users to safely and comfortably assess the condition of critical electrical and mechanical equipment in utility and manufacturing applications. With advanced features including unmatched temperature measurements down to -40°C, accuracy as good as 1°C/1%, 1-Touch Level/Span contrast enhancement, and laser–assisted autofocus, you'll get highly accurate temperature measurements every time. Pair the T865 with a 6 FOV IR lens to perform inspections on small targets from long distances. The on-board Inspection Route system helps you record temperature data and imagery in a logical sequence for faster troubleshooting and repair. The T865 also features FLIR Ignite for automatic uploading of images directly from the camera to the cloud for easy, secure storage and sharing. Adding a FLIR T865 camera to a condition monitoring/predictive maintenance program can help reduce maintenance costs, improve system efficiency and reliability, and prevent downtime due to outages.
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CEM500 -
Axiomtek Co., Ltd.
The CEM500, a COM Express Type 6 basic module, is based on the 14 nm Intel® Xeon® processor E3-1505M v5 and 6th generation Intel® Core™ i7/i5/i3 processor (codename: Skylake-H) with Intel® CM236/QM170/HM170 chipset. The outstanding Intel® Gen 9 HD Graphics enables the CEM500 driving multiple 4K displays without the need of a discrete graphics card. Two DDR4-2133 SO-DIMM supporting up to 32 GB system memory capacity and four SATA-600 with RAID 0, 1, 5, and 10 are available. Additionally, the rugged COM Express computer-on-module Type 6 supports an industrial operating temperature range of -40°C to 85°C for applications in extreme harsh environment. With its full solid, outstanding computing performance and low power consumption design, the CEM500 is targeted at telecommunication, medical imaging, digital signage, gaming machines, military, human machine interface, industrial automation controllers and IIoT applications.
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Northern Digital Inc.
The 3D Guidance® electromagnetic tracking solution delivers exceptional performance and value for OEM image-guided interventional and therapy systems and medical trainers that require real-time navigation tracking capabilities. The 3D Guidance solution tracks 6DOF sensors that can be embedded into OEM instruments such as ultrasound probes, rigid and flexible scopes, and laparoscopic tools. Continuous in-vivo tracking is maintained through difficult anatomy, even when sensors are out of sight. Low latency and fast update rates ensure the most subtle tool movements are instantly tracked and visualized within the OEM host interface. The 3D Guidance solution is available in the driveBAY™ and trakSTAR™ configurations, as based on the Electronics Unit. The trakSTAR is a standalone desktop unit that connects to a direct power source. The smaller driveBAY fits inside the drive bay of a computer, OEM imaging cart, or medical trainer/simulator, using the host’s power supply. Both share the same tracking accuracy and reliability. The ready-to-use configuration facilitates cost-effective integration and speeds time to market.
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VDU-100 Series -
Systems Engineering & Management
SEMCO'S tactical military products have been developed in response to the requirement for near real-time, high-quality, encrypted video and sensor data capture, transmission and distribution in support of covert and overt military operations. These products provide for unprecedented audio-video and data communications from warrior-to-warrior as well as from warrior-to-command. Transmission modes include tactical and handheld radios, wireless and wired LAN, SATCOM, wireless Mesh, and Cellular, with full motion video capability in as low as 125 Kbps bandwidth. Video resolution, bandwidth and frame rates are adjustable, with high quality video frames capable of being transmitted in bandwidths as low as 9 Kbps. These products include video recording, with both local and remote download capability, as well as remote video enhancement, pan, tilt and zoom control, and multiple NTSC/PAL camera and imaging device interfaces. With administrative and password control, these products provide for unlimited remote viewing on PCs, Androids, iPhones and iPads anywhere in the world.
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CAPA13R -
Axiomtek Co., Ltd.
The CAPA13R is powered by the onboard AMD RYZEN™ Embedded V1807B/V1605B processor with Radeon™ Vega graphics. The 4K embedded board is well-suited for graphics-intensive applications such as medical imaging, video surveillance, 3D simulators, optical quality control, digital signage, kiosks/POI, thin clients, and more. The integrated AMD RadeonTM RX Vega graphics with support of DirectX 12 and OpenGL 4.5 marks the cutting edge of embedded graphics. The CAPA13R can deliver truly impressive user experiences and outstanding 3D graphics quality through two HDMI, one DisplayPort and one LVDS interfaces. Its onboard CPU is attached on the rear side of the board, which can aid with heat dissipation and offers flexibility for easy system integration and minimum maintenance. Moreover, the CAPA13R offers multiple expansion interfaces with one M.2 Key E slot for wireless modules and one M.2 key B slot for storage cards. One 260-pin SO-DIMM socket on the CAPA13R supports up to 16GB of DDR4-2400 (V1605B) and DDR4-3200 (V1807B) memory. The system has a +12V DC power input.
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CEM510 -
Axiomtek Co., Ltd.
The CEM510 is based on the Intel® Xeon® E3 and 7th generation Intel® Core™ i7/i5/i3 processors with Intel® CM238/QM175/HM175 chipset. The 125 x 95 mm system-on-module was designed for graphics-intensive applications over the Industrial IoT, including industrial control, medical imaging, digital signage, and gaming machines. The embedded module is equipped with dual 260-pin DDR4-2133 SO-DIMM slots with up to 32GB system memory. Its wide operating temperature range of -40°C to +85°C strengthens the adaptability of various harsh conditions. For evaluation and development purposes, Axiomtek also has the CEB94011, a carrier board designed to operate with the CEM510 for additional I/O and expansions interfaces. Integrated with Intel® Gen 9 graphics, and with the support of DX12.0, OCL 2.0 and OGL 4.3, the module presents excellent graphics performance with resolution up to 4K (3840 x 2160 @ 30 Hz). Three independent displays are supported through LVDS and three DDI ports supporting HDMI, DisplayPort, and DVI (one DDI supporting optional VGA).
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Analog Devices Inc.
Isolated LVDS (low voltage differential signaling) devices couple differential signals applied to the LVDS receiver inputs across the isolation barrier to the outputs on the other side and re-transmits the bit stream or clock as LVDS. Analog Devices' drop-in LVDS isolators offer designers robust, high speed differential signaling for point-to-point and multidrop applications. Extending iCoupler® chip scale transformer technology for ultrahigh speed data encoding, these LVDS isolators support a a data rate of up to 2.5 Gigabits per channel for a total bandwidth of 10 Gbps. In contrast to expensive fiber implementations, deserialized links over standard digital isolators or optocouplers, and design-intensive bespoke solutions using transformers or high voltage capacitors, ADI Gigabit Digital LVDS isolators offer the only integrated comprehensive, high performance isolation at 10 Gbps. High performance galvanic isolation for applications include analog front-end (AFE), processor to processor serial communication, or video and imaging data (such as HDMI isolators) as well as isolation between boards, or at a cable interface for LVDS or CML signal chains.
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Thorlabs, Inc.
Thorlabs' Scientific-Grade Cameras are specifically designed for microscopy and other demanding applications. The Zelux™ CMOS cameras have small footprints and provide cost-effective solutions for general-purpose imaging applications. Kiralux® cameras have CMOS sensors with high quantum efficiency in a compact housing and are offered in monochrome, color, NIR-enhanced, and polarization-sensitive versions. Our polarization-sensitive CMOS camera is ideal for materials inspection, flaw detection, and other advanced techniques using polarization. The Quantalux® monochrome sCMOS cameras are fast frame rate imagers that combine high dynamic range with extremely low read noise for low-light applications. They are available in either a passively cooled compact housing or a hermetically sealed TE-cooled housing. We also offer scientific CCD cameras with a variety of features, including versions optimized for operation at UV, visible, or NIR wavelengths; fast-frame-rate cameras; TE-cooled or non-cooled housings; and versions with the sensor face plate removed. An intuitive software package, API and SDK for developers, and third-party software support provide options for custom system control and image acquisition.
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FLIR T560 -
Teledyne FLIR
Troubleshoot hot spots, find hidden faults, and confirm repairs quickly with the ergonomic, high-resolution FLIR T560. This 640 × 480 (307,200 pixel) thermal imaging camera has a bright 4" LCD and a 180° rotating lens platform, so you can easily and comfortably diagnose electrical or mechanical issues, even in hard-to-reach areas. Advanced on-camera measurement tools such as 1-Touch Level/Span, plus laser-assisted autofocus, ensure you’ll record accurate temperature measurements every time. With on-board FLIR Inspection Route mode, you can download and run survey plans to your camera from FLIR Thermal Studio Pro (with FLIR Route Creator plugin). Together these systems will help you record temperature data and imagery in a logical sequence for faster troubleshooting and repair. The T560 also features FLIR Ignite for automatic uploading of images directly from the camera to the cloud for easy, secure storage and sharing. The purchase of a T560 camera includes a 3-month subscription to FLIR Thermal Studio Pro and FLIR Route Creator.
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CA92001B -
UC Instruments, Corp.
UCINSTRUMENTS CA92001B C band optical spectrum analyzer module is a spectral engine for Process Analytical Technology applications. The OSA module acts as a stand-alone spectral engine, imaging and measuring a wide range of vapors, liquids and solids through transmission and diffuse reflection in a rapid non-destructive process. Leveraging our proprietary Micro-Optic technology, UC INSTRUMENTS’ C band OSA module features the following characteristics: (1) compact; (2) light-weight; (3) low power consumption; and (4) wide wavelength coverage. These characteristics of UC INSTRUMENTS’ compact OSA engines are suitable for a variety of handheld, portable or bench-top OSA/spectrometer applications. Equipped with a state-of-the-art internal wavelength reference, the OSA module is capable of precisely measuring optical spectrum. Because it does not require an expensive InGaAs detector array, the compact OSA module is a cost-effective alternative to other grating-based OSA/spectrometer engines. The OSA communicates with a PC or an instrument motherboard via an USB interface. UCINSTRUMENTS’ OSA module platform can be installed or co-packaged into existing NIR OSA/spectrometers as a cost-efficient alternative to other scanning optical engines.
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CEM511 -
Axiomtek Co., Ltd.
The CEM511, a new COM Express Type 6 Compact form factor module, is powered by the latest 7th generation Intel® Core™ i7/i5/i3 processor (Kabylake-U) for high-performance applications. The palm-sized CEM511 is packed with a variety of rich features including low power consumption, industrial wide temperature range support and impressive graphic processing capability. The COM Express® Type 6 Compact module supports two DDR4-2133 SO-DIMM sockets with a maximum system memory capacity of up to 32GB. It has a rugged design with an extended operating temperature range from -40°C to +85°C (-40°F to +185°F) to satisfy different harsh environment demands. The system on module also delivers outstanding computing, graphics and media performance through its Intel® Gen 9 graphics engine, DirectX 12.0, OCL 2.0, OGL4.3 features and 4K resolution (4096 x 2160 @ 30 Hz) support. Therefore, the power efficient CEM511 is designed for graphics-intensive applications over the Industrial IoT, including industrial control system, medical imaging, digital signage, gaming machines, military, and networking.
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CEM521 -
Axiomtek Co., Ltd.
The CEM521 is powered by the latest 8th generation Intel® Core™ i7/i5/i3 processor or Intel® Celeron® processor 4305UE (codename: Whiskey Lake-U). It is suitable for harsh operating conditions with an extended operating temperature range of -40°C to +85°C (-40°F to +185°F). The 4K-ready system on module was designed for graphics-intensive Industrial IoT applications including industrial control system, medical imaging, digital signage, gaming machines, military, and networking. The palm-sized CEM521 is packed with a variety of rich features including low power consumption, industrial temperature support and high graphic processing capability. The COM Express Type 6 compact module supports two DDR4-2400 SO-DIMM sockets for up to 64GB of system memory. The power-efficient CEM521 is also integrated with Intel® Gen 9 graphics and supported with DX12.0, OCL 2.0 and OGL 4.3 for excellent graphics performance with a resolution of up to 4K (4096 x 2160 @ 30 Hz). It offers three independent display support through one LVDS, one VGA and one DDI ports for HDMI/DisplayPort.
