Showing results: 181 - 193 of 193 items found.
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InSight X3 -
Spectra-Physics
Spectra-Physics’ new InSight® X3™ is the third generation of Spectra-Physics’ industry leading InSight platform, specifically designed for advanced multiphoton microscopy applications. Based on patented technology1, InSight X3 features a broad 680 nm to 1300 nm continuous, gap free tuning from a single source, nearly double the tuning range of legacy Ti:Sapphire ultrafast lasers. InSight X3 delivers high average and peak power levels across the tuning range, including critical near infrared wavelengths above 900 nm for deepest penetration in-vivo. With Spectra-Physics’ integrated patented DeepSee™, the industry standard dispersion pre-compensator, the short pulses are optimally delivered through a microscope to the sample for maximum fluorescence and penetration depth. InSight X3 also has exceptional beam pointing stability, beam quality and output power stability, as well as fast wavelength tuning, making it ideal for microscopy.
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AIM GmbH
AIM’s PANAVIA test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core design with one processor for real time bus protocol support, massive memory and IRIG-B time code encoder/decoder functions are standard. AIM delivers versions of our modules with extended temperature range and conformal coating. With 8 Tx and 8 Rx channels per module, functions include autonomous transmit sequencing, continuous clock and data transmissions, host controlled double buffering, programmable interrupts, data selection on specific tag identifier, selectable triggers on data and/or tags with full protocol error injection/detection, real time bus recording and time stamping to ensure your bus integrity. Each module is delivered with a Board Support Package (BSP) comaptible to the legacy PCI and cPCI hardware modules.
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Data Patterns Pvt. Ltd.
One of the world's leading architectures for high reliability electronics applications is the VME platform.The VME standard is managed by the VME bus International Trade Association, VITA.Embedded computing's most successful bus standard, VME bus, shows no signs of slowing down as it maintains it's position as the industry's de facto standard into the 21st century. The foundation of VME's longevity, namely it's steady rate of technological evolution combined with a commitment to backward compatibility with legacy hardware and software, has been the linchpin of it's popularity for nearly twenty-five years. Today, innovative enhancements to the standard, through the VME Standards Organisation (VSO), continue to improve VME bus' speed, performance and reliability, strengthening it's position as the ideal solution for today's increasingly stringent commercial, industrial and military system requirements (Source: VITA).Data Patterns has implemented a number of standard VME boards, driven by Customer needs for Processor and I/O requirements in this platform. Today, standard modules are available covering the needs of:
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Patton Electronics Co.
A Media Gateway is a networking device that provides valuable and essential functions for organizations, service providers, and network operators. When interconnecting traditional time-division-multiplexed (TDM) telephony systems with modern voice-over-internet protocol (VoIP) systems, a VoIP media gateway works by providing protocol conversion (translation) and interoperability between the two network technologies. Also known as an IP media gateway or SIP media gateway, the device converts a traditional analog plain-old-telephone-system (POTS) voice signal or related digital telephony signals such as T1, DS3, STM1 or OC3 into packets for transmission over a data network such as the Internet, private IP Network or a corporate LAN. When the legacy system is based on digital integrated services digital network (ISDN) technology, the device may be called a digital VoIP gateway or ISDN media gateway. Some manufacturers combine gateway functionality with WAN-access (internet-access) capability into a single device or network appliance. Such a dual-purpose device may be known as an access media gateway.
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MB Dynamics Inc.
Electrodynamic shaker systems and amplifiers from MB Dynamics help to support a wide range of general-purpose vibration test requirements. The electrodynamic shaker systems are offered in a variety of force ranges, from 100N (25 lbf) to 22kN (5,000 lbf). The innovative design of MB Dynamics PM-Series electrodynamic shakers incorporates permanent magnet technology and the voice coil principle to create vibration. These heavy-duty electrodynamic shakers feature a robust design for maximum reliability, with end-users reporting a useful service life of 10, 25 or even 40 years! The shakers come in five unique sizes, with peak sine force ratings of 100 N, 200 N, 500 N, 1000 N and 2000 N; or, 25 lbf, 50 lbf, 100 lbf, 250 lbf and 500 lbf. The MB Dynamics C40HP electrodynamic shaker outputs 22 kN or 5,000 lbf peak. The C40HP is a part of the legacy C-Series of shakers, which have served as the foundation for today’s modern electrodynamic vibration test equipment industry.
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TDS AND MRC -
AMPOL Technologies Ltd.
AMPOL's TDS and MRC-150 are complete legacy solutions that can record and analyze flight data from a number of sources. These solutions are especially useful in the air for flight-test and integration phases, as well as on the ground for pre-flight tests. The TDS is a complete solution for recording and analysis of telemetry data from multiple sources. Installed on a fighter jet's wingtip, in an air-to-air missile pod, the TDS's airborne unit is sealed and has a removable, solid-state Flash disk for storage of recorded data. The system can operate either autonomously, with no outside intervention, or manually, from the cockpit. The TDS solution also includes software for off-line data analysis at the ground station. The MRC-150 is a complete solution for recording and analysis of four MIL-STD-1553 buses and one H009 bus on-board an F-15 fighter jet. Installed in the aircraft's equipment bay, the MRC-150 can either be operated autonomously, with no outside intervention, or manually, via the cockpit. The MRC-150 has already been used in hundreds of flights since its debut in 1998.
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Teledyne LeCroy
Ethernet, arguably the most common communication protocol on the planet, continues to spread into new markets and incorporates new protocols; it presents today’s Ethernet engineers with host of new test and validation challenges. Specifically, the increasing adoption of lossless Ethernet standards like FCoE, RoCE, and NVMf and increases in the line-rates of Ethernet from 10GbE and soon to 100Gb/s to name a few.These new physical and logical communications standards have exposed legacy test tools as outdated and incomplete for Ethernet product developers and the ecosystem. Teledyne LeCroy is addressing these needs by leveraging our extensive experience in high-speed serial data analysis tools currently used by many of the same companies developing products for NAS, SAN, LAN, and other high-speed protocol environments.The SierraNet Family of Ethernet test platforms provides best in class traffic capture, analysis, and manipulation for testing physical link characteristics and application operations. SierraNet is designed for addressing today’s high-speed storage and communications network problems and compliments other tools offering industry leading visibility and utility.
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Universal Encoder 3 -
Seismic Source Co.
*Compatibility - UE3 is 100% compatible with the Force 3 system. Boards can be used as spares for the Force 3 system*Reference Flexibility - Multiple Digital and Analog References*GPS Discipline - GPS timing and assures starts on even sample boundaries for all continuous recording systems*Multiple Radio Support - UE3 can connect simultaneously to 4 High Speed TDMA radios. These multiple high speed radios assure reliable and efficient communication to all of the vibrator units used in High Production Vibroseis Mode*Digital Radio Support - UE3 supports the latest Digital Radios*Analog Radio Support - UE3 also supports legacy analog radios*Ethernet Radios Support - The UE3 includes support for low-power VHF-Ethernet radios. These radios have good speed and work well in many applications*Digital Radio Sims - Digital Radio Similarities are now available for UE3 and Force 3 or VibPro HD vibrator controllers*External USB Port - Use USB thumb drive to offload data from remotely operated UE3 units
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ABB Ability -
ABB Ltd.
ABB Ability mobile gas leak detection system uses ABB’s patented Off-Axis Integrated Cavity Output Spectroscopy (OA-ICOS) technique which has a sensitivity and precision more than 3000 times greater than legacy methods. This enables identification of leaks several hundred feet away from the source. Current traditional leak detection technology is slow, laborious and costly. Operators walk on foot near the pipeline with hand-held sensors making paper-based reports.This is slow and can lead to dangerous leaks being missed or not identified in a timely manner. ABB’s Ability mobile gas leak detection system delivers a low cost per leak solution with low false positives. Reporting includes mapping of the leaks available via a mobile app and measurements as Cloud-based service. The system consists of ABB’s Methane/Ethane Analyzer, a GPS, a sonic anemometer and proprietary leak detection software that presents real-time geospatial maps of multiple gas concentrations in real time. The software’s sophisticated leak detection algorithm combines the system’s measurements of gas concentrations (CH4, C2H6), local coordinates (GPS) and local wind velocity (sonic anemometer) to estimate the location of the leak. Readings are stored in the device and can be transmitted in real-time to the cloud for centralized monitoring.
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LS-11-F -
Lumistar Inc.
The LS-11-F portable FM test transmitter is designed for checkout and troubleshooting of telemetry receiving systems operating with FM modulation. For applications with any of the ARTM modulations (Tier 0, Tier I, or Tier II), please refer to the LS-11-M Data Sheet. Complete ground stations including the antenna with LNA, RF down-converter, IF receiver, bit synchronizer, and PCM decommutator can be tested and bit error tests performed. The design allows secure links to be tested with an external encryptor. The Test Transmitter contains an internal PCM Data Simulator and Pseudorandom patterngenerator that operates in a BERT mode. The device provides simulated clock and data (without transmitter enabled) and accepts external data for modulating the internal transmitter. Complete setup can be achieved locally through the keypad and two-line LCD display or remotely through the USB Interface. Operational parameters include the PCM format parameter database information (frame sync patterns, wavewords, etc…), pre-modulation filter selection, transmitter carrier frequency, transmitter deviation, and output power level. Output power can be selected from approx. -60 to +5 dBm in 5 dB steps. The Test Transmitter contains a LiFePO4 Battery (Lithium Iron Phosphate), which provides higher energy density at ¼ the weight of legacy lead-acid batteries. The unit also provides an internal battery charger and will operate for up to twelve hours on battery power having received on a full charge.
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Express-TL -
ADLINK Technology Inc.
ADLINK’s Express-TL COM Express Type 6 Basic size module is based on the 11th Gen Intel® Core™, Xeon® W and Celeron® 6000 processor, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With a combined 8 cores, 16 threads, and up to 128GB memory, the Express-TL brings uncompromised system performance and responsiveness to your solution. Featuring brand new Gen 12 Intel® UHD Graphics and Intel® AVX-512 Vector Neural Network Instructions (VNNI), the Express-TL provides AI inferencing performance as much as 3X higher compared to previous generation non-VNNI platforms. The integrated Gen 12 Intel® UHD Graphics core can be configured to support one 8K independent display or four 4K independent displays (HDMI/DP/eDP). In addition, legacy display interfaces such as LVDS and analog VGA are still supported as build options. Key features for today’s applications are support for 2.5 GbE and USB 3.2 with transfer rates of up to 10Gb/s that can transfer image data from cameras faster than previous generation products. Combined with 8 processor cores at 25W TDP, Intel® AVX-512 VNNI, Intel® OpenVINO™ toolkit and Intel® UHD Graphics, the Express-TL is well suited for AI at the edge applications (AIoT/IoT).
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MIC-6330 -
Advantech Co. Ltd.
Based on the Intel® Xeon® E3 Lv5 and Lv6 embedded platform, the MIC-6330 builds on the success of Advantech’s 6U VPX boards, and is the first 3U VPX product launched by Advantech. Together with the Intel® processor, the MIC-6330 offers intense computational ability in a very compact form factor. The MIC-6330 provides configurable connectivity (up to four ports) of PCI Express via the backplane to the highest performance mainstream peripherals and I/O cards, and vast I/O functions for extended interconnectivity and controllability. The MIC-6330 meets various computing needs, including vPro™ and workstation capabilities, by using the Intel® CM236/CM238 PCH. The MIC-6330 offers high storage capacity at up to SATA 6Gbps transfer speed. Four USB2.0 ports and one USB 3.0 port to the backplane fulfill requirements for extra I/O ports or storage, up to 5Gbps data rate. Four GbE ports (two ports configurable as SERDES) support system level IP connectivity, and the UART interfaces (RS-232/422/485 selectable) can be leveraged as an interface to legacy devices and consoles. Like Advantech’s 6U VPX products, the MIC-6330 supports multiple displays, and the maximum resolution of the MIC-6330 is 4K, empowered by the Intel® integrated graphics engine. The MIC-6330 also offers a High Definition Audio to the backplane interface for media demands. With the standard ruggedized convection cooled heatsink or the optional air-cooled heatsink, the MIC-6330 is tailored for harsh environmental applications and adaptable to various chassis designs. The industrial NAND Flash, and the soldered onboard DDR4 ECC memory chips are appropriate for a variety of vehicle applications for the maximum reliability. The MIC-6330 is sophisticated and suitable for various purposes. An onboard X8D XMC site with PCIE x8 gen.3 connectivity can host high speed offload or I/O mezzanines for project-specific applications. For applications that need the maximum expandability, the XMC interface can be modified to add another DisplayPort and the 2 more UART. The optional front I/O module facilitates the development and qualification process, and also enables the possibility of the front panel access.
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MIC-6314 -
Advantech Co. Ltd.
The MIC-6314 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ embedded platform with increased cache size and efficiency, as well as instruction set improvements. The MIC-6314 provides two configurable PCIE x 8 ports in the VPX data plane and two PCI Express ports x8 lanes in the VPX expansion plane to enable the highest performance available in the 6U VPX form factor compute intense applications. These PCIE interfaces offer high speed up to PCIE gen. 2 (5Gb/s) throughput, low latency, scalable, error recoverable deterministic interconnectivity to the mainstream peripherals and I/O cards such as DSP and FPGA cards. The PCIE widths and ports on the data plane and the extension plane of MIC-6314 is user configurable, which make MIC-6314 capable to replace the PCIE switch blade in a small system. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6314 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. Tailored for harsh environments, the MIC-6314 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternated optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a SSD socket is also available for a cost-efficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6314 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The Intel® next generation graphics engine Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using VGA and 2 DVI ports on MIC6314. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. A PCIEinterface is reserved for the optional M.2 high speed storage.Besides the modern M.2 storage, three SATA III one SATA II and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485selectable) can be leveraged to interface to legacy devices and consoles.
