Showing results: 61 - 69 of 69 items found.
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Zenith UHS -
Koh Young Technology
High-speed full 3D AOI that brings about a revolution in SMT process management Industry-leading speed for full 3D measuring inspection equipment skill solutions- Only solution in the industry to set inspection criteria according to IPC-610 standards- Performs defect diagnosis through measurement-based data and eliminates the causes of possible errors- Powerful 3D solder joint inspection
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Advantech Co. Ltd.
Designed to function as the intelligent edge for manufacturing equipment, IPC-seires is an ultra-compact modular system equipped with 2/4 PCIe/PCI slots for integrating diverse add-on cards, such as I/O cards, motion cards, vision cards, and GPU cards to support machine control and vision applications, or provide artificial intelligence for automated optical inspection (AOI) operations.
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ECAT-4XMO -
ADLINK Technology Inc.
The ECAT-4XMO is EtherCAT slave module with high-speed position comparison trigger and encoder single redriver function, helping machine and equipment builders to use multiple triggers simultaneously for AOI, glue dispensing, display tests, and storage assembly applications. Additionally, the ECAT-4XMO has 4-axis motion control with bridge function between EtherCAT and non-EtherCAT. Advanced motion control functions help machine and equipment builders to increase their motor selection portfolio, like leaner, step, servo, direct drive, and AC motors, making it ideal for a variety of automation industry applications.
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Terotest Systems Ltd.
Flying probe testers work by In-circuit testing the board via a number of moving test probes. They have the advantage over traditional In-circuit testers of not requiring a dedicated "bed of nails" test fixture thus reducing the price for each different board being tested. However, modern Flying Prober testers offer so much more than just In-circuit testing. They enable the user to combine In-circuit, AOI, Functional, Device Programming and Boundary Scan testing, in one test system.
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Columbia Elektronik AB
Testing is more than just finding defects on Printed Circuit Boards. It is also about how to predict defects before they occur. True economy can only be achieved when you see testing as an integrated part of manufacturing. To achieve this we provide Advanced Diagnostic Tools and Electronic Manufacturing Systems (EMS) that integrate testing with design, manufacturing and repair. Columbias expertise covers all aspects of PCB and sub-assembly production testing utilizing a full range of modern technologies: SPI, AOI, ICT, functional analog/digital testing and flying probe testing.
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CEM881 -
Axiomtek Co., Ltd.
The CEM881 COM Express Type 6 compact form factor module is powered by the latest 14nm 5th generation Intel® Core™ i7/i5/i3 or Celeron® processor with low 15 Watt TDP. The advanced computer-on-modules CEM881 provides advanced processing and high graphics performance combined with cool and efficient operation. With one onboard 4 GB extended temperature DDR3L chip, and one 204-pin SO-DIMM DDR3L socket supporting up to 8 GB, the extremely small SoC module boosts its fabulous computing performance, industrial grade wide temperature, and seismic design. The rugged and powerful CEM881 is an ideal solution for graphics-intensive and rich I/O applications such as telecommunication, medical imaging, transportation, Internet of Things-related, automated optical inspection (AOI), digital signage, gaming machines, military, and networking.
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AMP-204C/AMP-208C -
ADLINK Technology Inc.
ADLINK"s new AMP-204C/AMP-208C DSP-based 4/8-axis advanced pulse-train motion controllers incorporate up-to-date floating-point DSP and FPGA technology, enabling high pulse output and encoder input frequency up to 6.5 MHz and 20 MHz respectively. Leveraging ADLINK" s Softmotion technology, the AMP-204C/AMP-208C offer impressive comprehensive and application-oriented motion functionality to reduce development time while maintaining superior throughput and accuracy. Superior synchronous motion control performance combines with point-table function integrating multi-dimensional interpolation, such as 3D linear/circular/spiral interpolation with enhanced trajectory and velocity planning, for contouring applications in semiconductor, display and conventional manufacturing industries. The AMP-204C/AMP-208C also support PWM control with three different control modes for frequency or duty cycle, benefiting laser engraving/marking/cutting applications. Moreover, hardware-based position comparison and trigger output are applicable in AOI applications.
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AX92320 -
Axiomtek Co., Ltd.
The AX92320 supports PCI Express x4 lane, two or four independent Gigabit 802.3at (PoE, Power-over-Ethernet) compliant Ethernet ports and GigE Vision camera compliance. The PCI Express x4 frame grabber can provide up to 30 watts at 54 VDC power to port which allows power to be supplied to connected PoE-based devices, such as GigE Vision cameras in machine vision systems. The intelligent GigE Vision card also supports IEEE 1588 (precise time protocol), enabling synchronization with multi-camera acquisition. Combining IEEE 1588 and PoE function, the card utilizes a single Ethernet cable for power, data, and synchronization. Furthermore, it supports jumbo frames up to 9.5KB. The AX92320 is ideal for PoE applications such as automated optical inspection (AOI), factory automation, and PC-based surveillance systems.
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KLA-Tencor Corp
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
