Showing results: 391 - 405 of 723 items found.
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3682-2 -
VECTOR Electronics and Technology, Inc.
44 Gold plated edge contacts (22 each side)on 0.156"(3.96mm) centers.Interleaved buses pattern on wiring side only solder- coated for user convenience.Bus outline silkscreened on component side to facilitatecomponent placement. Mounts DIPs with 0.3”, 0.4” & 0.9” lead spacing. Unclad test point area at top of board Row and column legends provided
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Exensio -
PDF Solutions
Exensio, our enterprise-wide Big Data platform, analyzes and reports critical data generated across the semiconductor ecosystem. The solution also provides tools and immediate information for foundries to rapidly adjust their equipment for higher yields and reduced variability. By providing actionable information to rapidly identify and resolve manufacturing issues, Exensio provides a competitive edge to semiconductor and fabless companies and foundries.
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TÜV SÜD Japan
International companies, official bodies, municipal councils, non-profit organisations and cultural institutions all have to safeguard the software that maintains their competitive edge. Should a problem occur, they need to prevent their software from losing value and causing major disruption to their business operations. To do this, they have to be able to access their software source code. Which is where software escrow comes into play.
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DPA Components International
To offer a complete Turn-Key Solution requires the ability to source both leading edge high density and older die/wafer products. DPACI has factory direct access to Static Ram, Flash and DRAM Die/Wafer. For obsolete parts, DPACI can assist you with sourcing or recommend an upgrade. DPACI has access to roadmaps, data sheets and die maps to assist you with your choices.
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9956 -
Technobox, Inc.
The Technobox XMC-to-PCI Express adapter with Rear I/O support permits use of a standard VITA 42.3 air-cooled XMC or VITA 20 conduction-cooled XMC in the smallest possible edge finger PCI Express form factor. The length of the adapter is the length of the XMC and 10 mm mezzanine stacking height is supported. The height is a standard PCI Express board and is not the low-profile version.
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MFG-3005 -
MCH Instruments Co.,Ltd.
*Frequency range: 0.1Hz~5MHz*Output waveforms: Sine ,triangle, square, positive and negative pulse, positive and negative ramp*Output impedance: 50Ω±10%*Output Amplitude: Not less than 20Vp-p(open circuit)*DC voltage: 0~±10V continuously adjustable*Symmetry range: 90:10—10:90*Rising edge of square: Less than 100ns
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Integrated Dynamics Engineering
This includes Passive and Active vibration isolation modules. Our vast number of advanced solutions – from compact Passive LC series to the TCN Active series expanding to the cutting edge most advanced in vacuum NGI series – provide options for every difficult application issue that exists today. Since seismic vibrations tend to be random, all frequencies need to be addressed.
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Naprotek, LLC.
SemiGen's Inductor Coils are manufactured using our thin film process on quartz substrates. The precision photolithography and non-chemical etching process provides clean edges to assure uniformity from coil to coil. By using quartz and applying a polyimide coating we produce a device that eliminates the need for conformal coating or staking. Inductors can be epoxied down with nonconductive epoxy and the wire bonded for connection.
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Analog Devices Inc.
Analog Devices’ leading edge buffered multiplexers are designed in single, dual or triple independent channels with two inputs (2:1) or four inputs (4:1) and are offered in standard plastic packages, as well as in space saving LFCSP packages. These multiplexers are very high speed primarily useful for switching video and RF signals with either 50 ohms or 75 ohms systems.
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Integrated Dynamics Engineering
IDE, with the most vibration isolation and EMI cancellation systems in use today, is no stranger to nanotechnology. For over twenty years, IDE has been addressing the special needs of research environments with advanced isolation solutions. IDE’s influence and global reach can be seen in the most cutting edge labs pushing physical boundaries to extremes in advanced materials, surface science, microbiology and more.
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EasySim® -
Pronk Technologies Inc.
The new and improved EasySim® arrhythmia simulator fits in the palm of your hand! The ultra-portable (6.6″ x 2.4″ x .5″), ultra-lightweight (10 oz.) remote control will place you on the leading edge of medical education technology. The highly intuitive design features 48 direct-access keys in a remarkably easy to use format. No codes to memorize! No fuss to set up!
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E4417A -
Keysight Technologies
20 M sample/s per second sampling rate for reliable continuous and single shot measurements on wide bandwidth signals Time-gated and free run power measurements Free Analyzer Software software for complete pulse and statistical analysis, software is located In the Library8 pre-defined wireless configurations (GSM, EDGE, NADC, iDEN, Bluetooth, IS-95 CDMA, W-CDMA and cdma 2000)
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Keysight Technologies
When you need to measure advanced S-parameters with a fast, low-cost and easy-to-use test solution, the Digital Interconnect Test System gives you a significant edge. It provides a full 32-port vector network analyzer (VNA) configured within a single PXI chassis – ideal for high-speed cable testing. And lets you test any linear passive interconnect faster and easier, including backplanes, connectors and PCBs. Sharpen your edge with Keysight’s Digital Interconnect Test System that enables signal integrity characterization of multiport interconnect products.
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063-502 -
ELMA Electronic, Inc.
ProSys-5102 is a compact application ready platform with a powerful CPU for various industrial uses, as process control, security, digital signage, IoT edge points and more. The large amount of I/Os enables connectivity for most applications.
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Shanghai Linpin Instrument
Single-wing Drop Test Machine Simulate the drop conditions of packaged products when different faces, edges and corners fall to the ground from different heights, thus to understand the damage of the product and evaluate the drop height and impact resistance that the packaging materials can endure while falling down, so as to improve and optimize package design according to actual conditions of the product and national standard range.