Showing results: 4051 - 4065 of 7317 items found.
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RG-100PV -
NAPSON Corp.
*Measurement system for thin film on substrate samples for multi-points measurement*Even pitch and random pitch for Max.1,000 points*2-D/3-D square mapping software for even pitch
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CRN-100 -
NAPSON Corp.
*Ultra-High range sheet resistance measurement for 10E+9 ~ 10E+15 ohm/sq without contacting*Mapping program software;*1. Arranged in a multipoint pattern measurement is programmed*2. 2-D & 3-D mapping software*Easy operation by Windows 7 system software*Measurement data base link with Excel via CSV format file*Unaffected by contact resistance
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NC-10 (NC-20) -
NAPSON Corp.
*Easy operation and data processing by PC*No damage measurement by non-contact eddy current method*Replaceable probes by meas. range (*Second or more probe is for the option)*1 point measurement of center position*5 types of model for each measuring range*Temperature correction for silicon wafer function
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NC-6800 -
NAPSON Corp.
*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Number of cassette station can be changed by customers request*Eddy current method for resistivity, Electric capacitance method for wafer thickness*Temperature correction for silicon wafer function
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NC-3000R -
NAPSON Corp.
*High accuracy measurement system for large diameter wafer*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Compact design of Two-stage by measuring area and transfer area*Number of cassette station can be changed by customers request Option : Add wafer flattness measurement system(FLA-200)
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NC-700 -
NAPSON Corp.
*Inline measurement module for moving substrates such as PET film, glass or paper*Continuous measurement(~24h) in Roll to Roll with OFF-SET FREE capability system*Various applications from the research and development to the production line
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NC-600 -
NAPSON Corp.
*Non-stop and non-contact sheet resistance measuring of thin film on glass runs through on conveyer*1 to 10 number of probe by sizes of glass is attachable*Glass collision prevention function*Continuous test data report to the host computer
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NC-80MAP -
NAPSON Corp.
*Possible to measure wide range of sheet resistance by installing Max. 4 probes*Min. 7 mm position from edge can be measured*User programable measurement pattern & programmable measuring pattern
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EC-80 -
NAPSON Corp.
*Easy operation and compact design*Auto-measurement start by inserting a wafer under the probe*Easy set up to measurement condition by JOG dial*5 types of model for each measuring range
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PVE-80 -
NAPSON Corp.
*No damage measurement by non-contact Pulse-Voltage excitation method*Easy to measure & carry around, Removable stage plate*Easy operation and data processing by PC with Software*Measurement result can shown by 3 types of measurement unit (Sheet resistance[Ohm/Sq], Electric conductivity[S/cm], Electrical conduction[S])*Pulse-Voltage excitation method : Pat. No.5386394 Joint development with Chiba Univ.
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EC-80P (Portable) -
NAPSON Corp.
*Auto-measurement start by probe head contacting to sample*3 measurement modes for wafer resistivity, bulk resistivity and sheet resistance*Easy set up to measurement condition by JOG dial*5 types of model for each measuring range*Resistivity probe can be changed by sample’s resistivity range
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HF-100DCA -
NAPSON Corp.
*Global standard model for the lifetime test of silicon bulk*JIS direct current anodizing method*Data processing by digital oscilloscope and PC with software
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NC-110 (NC-110PV) -
NAPSON Corp.
*Possible to measure sheet resistance without contact by Max. 3 types of probes*Suitable for production line and tranceportation system*Connect to host PC by LAN to send measurement command and data
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HF-90R -
NAPSON Corp.
*Silicon bulk, Prismatic shape (JIS code), Ingot condition*Non-contact photoconduction vibration decay method*Data processing by digital oscilloscope and PC with software
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DUORES -
NAPSON Corp.
Easy to measure sheet resistance & carry aroundReplaceable hand-held probes for Non-destructive & Contact type