Showing results: 256 - 263 of 263 items found.
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Data Patterns Pvt. Ltd.
VXI stands for VME eXtensions for Instrumentation. It is an open standard first developed by five leading Test and Measurement companies in 1987 to standardise a backplane capable of developing open, interchangeable instrument modules that could be used to build Automatic Test Equipment (ATE).Data Patterns designs and markets a wide range of VXI modules, some of which are listed below. Due to the use of the latest technologies, Data Patterns VXI modules offer the highest I/O density available in the industry today.Further enhancements of functional capabilities are achieved by the use of VXI IP carriers and VXI M Module carriers. This extends standard functions available from Data Patterns in these mezzanine architectures to the VXI platform.
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3U PMC Carrier -
PCI EmbeddedComputer Systems
This conduction cooled 3U CompactPCI single slot PMC provides an active interface between the CompactPCI bus (backplane) and a PCI Mezzanine Card (PMC). This product addresses the needs of aerospace, military, and rugged applications. It contains a thermal heat frame made of aluminum that fits together with conduction cooled PMC modules. Conduction cooling conducts heat away from the hot spots of the board and transfers the heat to the card edges and to the system chassis. No active ventilation is necessary inside of the system, which means the boards are sealed from the environmental influences found outside of the chassis. The heat frame and integrated wedge locks for the conduction cooling stiffens carrier and PMC module enabling the board to resist high shock and vibration.
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6U PMC Carrier -
PCI EmbeddedComputer Systems
This conduction cooled 6U CompactPCI dual slot PMC provides an active interface between the CompactPCI bus (backplane) and a PCI Mezzanine Card (PMC). This product addresses the needs of aerospace, military, and rugged applications. It contains a thermal heat frame made of aluminum that fits together with conduction cooled PMC modules. Conduction cooling conducts heat away from the hot spots of the board and transfers the heat to the card edges and to the system chassis. No active ventilation is necessary inside of the system, which means the boards are sealed from the environmental influences found outside of the chassis. The heat frame and integrated wedge locks for the conduction cooling stiffens the carrier and PMC module enabling the board to resist high shock and vibration.
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EXC-1553PMC/Px(S) / EXC-1553ccPMC/Px(S) -
Excalibur Systems, Inc.
MIL-STD-1553, conduction cooled, interface board. Supports up to 4 multi function channels.The EXC-1553PMC/Px(S) and EXC-1553ccPMC/Px(S) are multi-channel (up to four) MIL-STD-1553 interface boards for PCI Mezzanine Card compatible computers.Multi Function:Each channel operates simultaneously as a Bus controller and/or multiple (up to 32) Remote Terminals, or as a Triggerable Bus Monitor. In addition, error injection (BC and RT modes) and error detection (all modes) are supported on each channel.Single Function:Each channel operates either as a Bus Controller, Remote Terminal, or Bus Monitor.NOTE: PxS is NOT compatible to the MCH family of cards.The EXC-1553PMC/Px(S) and EXC-1553ccPMC/Px(S) are supplied with C drivers, including source code, and Merlin+ Windows software.
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FMC431 -
Sundance Multiprocessor Technology Ltd.
The FMC431 is a dual 1 Gigabit Ethernet FPGA Mezzanine Card with two RJ45 connectors available on the front panel. Compliant with the VITA 57.1 standard the FMC431 offers a High Pin Count connector but is compatible with FPGA carrier cards with Low Pin Count connectors. The Ethernet interface (1000BASE-T) is either implemented using RGMII (Low Pin Count compatible) or SGMII (High Pin Count compatible). The FMC431 also offers the option to stack an additional FMC over it. Any of the 4DSP FMC that use LVDS and single ended signaling only can be mounted over the FMC431, thus offering users with the ability to build a complete data acquisition, waveform generation and communication solution while using a single FMC site on an FPGA carrier card. The FMC431 is an ideal solution to bring Ethernet connectivity to an FPGA based system and ensure reliable external communication.
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MIC-6330 -
Advantech Co. Ltd.
Based on the Intel® Xeon® E3 Lv5 and Lv6 embedded platform, the MIC-6330 builds on the success of Advantech’s 6U VPX boards, and is the first 3U VPX product launched by Advantech. Together with the Intel® processor, the MIC-6330 offers intense computational ability in a very compact form factor. The MIC-6330 provides configurable connectivity (up to four ports) of PCI Express via the backplane to the highest performance mainstream peripherals and I/O cards, and vast I/O functions for extended interconnectivity and controllability. The MIC-6330 meets various computing needs, including vPro™ and workstation capabilities, by using the Intel® CM236/CM238 PCH. The MIC-6330 offers high storage capacity at up to SATA 6Gbps transfer speed. Four USB2.0 ports and one USB 3.0 port to the backplane fulfill requirements for extra I/O ports or storage, up to 5Gbps data rate. Four GbE ports (two ports configurable as SERDES) support system level IP connectivity, and the UART interfaces (RS-232/422/485 selectable) can be leveraged as an interface to legacy devices and consoles. Like Advantech’s 6U VPX products, the MIC-6330 supports multiple displays, and the maximum resolution of the MIC-6330 is 4K, empowered by the Intel® integrated graphics engine. The MIC-6330 also offers a High Definition Audio to the backplane interface for media demands. With the standard ruggedized convection cooled heatsink or the optional air-cooled heatsink, the MIC-6330 is tailored for harsh environmental applications and adaptable to various chassis designs. The industrial NAND Flash, and the soldered onboard DDR4 ECC memory chips are appropriate for a variety of vehicle applications for the maximum reliability. The MIC-6330 is sophisticated and suitable for various purposes. An onboard X8D XMC site with PCIE x8 gen.3 connectivity can host high speed offload or I/O mezzanines for project-specific applications. For applications that need the maximum expandability, the XMC interface can be modified to add another DisplayPort and the 2 more UART. The optional front I/O module facilitates the development and qualification process, and also enables the possibility of the front panel access.
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MIC-3396 -
Advantech Co. Ltd.
Using 4th generation Intel® Core™ i3/i5/i7 processors based on 22nm process technology supporting up to four cores / eight threads at 2.4GHz and 6MB last level cache, the MIC-3396 blade boosts computing performance deploying the latest virtualization, techniques and CPU enhancements. Onboard soldered low voltage DRAM (1.35V) with ECC support and optional memory expansion via an SODIMM socket extend the memory to a maximum of 16GB supporting the most demanding applications in high performance or virtualized environments. Dual channel design and memory speeds up to 1600MT/s along with increased cache size and cache algorithms guarantee maximum memory performance. Combined with the powerful Intel® QM87 chipset, the 4th generation Intel® Core™ processors offer improved I/O performance by leveraging 5GT/s DMI and 3rd generation PCIe interfaces. An onboard XMC/PMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines such as the MIC-3666 dual 10GE XMC card. With SATA-III support and up to 7Gbps I/O. the latest enhancements in storage technology such as high speed SSDs or traditional HDDs can be used on the MIC-3396. Five gigabit Ethernet ports based on Intel® GbE controllers for front and rear,including two PICMG 2.16, ensure best in class network connectivity The processor’s integrated enhanced graphics engine (Iris) offers twice the performance over previous generations. With triple independent display support, the MIC-3396 is an ideal fit for demanding workstation applications. RASUM features integrated in the CPU and chipset combined with PICMG 2.9, IPMI-based management make the MIC-3396 a highly available and reliable computing engine. The RIO-3316 RTM module supports one PS/2 connector with both keyboard and mouse ports, one USB 3.0, two USB 2.0 ports, two RS-232 ports, two SATA ports, two DVI ports, and two Gigabit Ethernet ports. In case of the SATA disk drives and SATA RAID support of the QM87 do not meet performance and reliability requirements, the RIO-3315 SAS version supports a 4-port SAS controller with RAID and fail over support.
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MIC-6314 -
Advantech Co. Ltd.
The MIC-6314 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ embedded platform with increased cache size and efficiency, as well as instruction set improvements. The MIC-6314 provides two configurable PCIE x 8 ports in the VPX data plane and two PCI Express ports x8 lanes in the VPX expansion plane to enable the highest performance available in the 6U VPX form factor compute intense applications. These PCIE interfaces offer high speed up to PCIE gen. 2 (5Gb/s) throughput, low latency, scalable, error recoverable deterministic interconnectivity to the mainstream peripherals and I/O cards such as DSP and FPGA cards. The PCIE widths and ports on the data plane and the extension plane of MIC-6314 is user configurable, which make MIC-6314 capable to replace the PCIE switch blade in a small system. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6314 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. Tailored for harsh environments, the MIC-6314 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternated optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a SSD socket is also available for a cost-efficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6314 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The Intel® next generation graphics engine Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using VGA and 2 DVI ports on MIC6314. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. A PCIEinterface is reserved for the optional M.2 high speed storage.Besides the modern M.2 storage, three SATA III one SATA II and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485selectable) can be leveraged to interface to legacy devices and consoles.
