Showing results: 196 - 210 of 1435 items found.
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FlexXray
FlexXray has developed leading, certified technology and processes to use advanced x-ray technology to inspect products specifically for food companies. Although they look like a TSA line at the airport, our systems are highly customized machines and processes built specifically to find contaminants like metal, glass, wood, stone, plastic, and rubber in food products of all types. What we do is find needles in haystacks – but the needles we find are even smaller than needles in a haystack. In fact, FlexXray can find contaminants down to 0.8mm or smaller.
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AutoWafer Pro™ -
Sonix Inc.
AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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LIGHTnPS -
Unity Semiconductor SAS
• Best in class throughput• High surface sentivity• Full haze characterization• High lifetime / low CoO solid state laser• Advanced Automatic Defect Classification
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LOTOS -
KoCoS Messtechnik AG
LOTOS automatic measuring systems can measure the full outer contours or individual areas of any measurement object quickly and precisely, irrespective of the shape, and test them for imperfections. The three-dimensional, non-contact measurement is carried out using optical measurement sensors with accuracy in the μm range. The result is a representation of the measurement object as a 3D model. Powerful, intuitive software allows the measurement results to be assessed extremely quickly.
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Denshijiki Industry Co., Ltd.
Using the "leakage magnetic flux" phenomenon generated from the scratches, the magnetic powder (or fluorescent magnetic powder) of the ferromagnetic material scattered on the surface by magnetizing the specimen is adsorbed to the scratch. Observe this and detect scratches.
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Sidartec
We have available with us diverse array of Vision System. These systems are based on high-end technologies and meet the requirements of diverse sectors. Further, our systems are an epitome of quality and available at economical prices. Details of different systems.
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MultiScan MS5800 -
Evident Scientific
Eddy current testing is a noncontact method used to inspect nonferromagnetic tubing. This technique is suitable for detecting and sizing metal discontinuities such as corrosion, erosion, wear, pitting, baffle cuts, wall loss, and cracks in nonferrous materials.
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ASML
Our HMI e-beam solutions help to locate and analyze individual chip defects amid millions of printed patterns.
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Vision Engineering Inc.
Digital stereo 3D imaging is a unique, advanced, stereo image presentation system designed to provide fully interactive real time natural 3D viewing and visualisation with outstanding depth perception.
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Rapiscan Systems
In a world where threats continue to evolve and concealment techniques become more sophisticated, our customers are facing more complex, difficult missions than ever.
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7940 -
Chroma ATE Inc.
Chroma 7940 wafer chip inspection system is an automated inspection system for postdiced wafer chip inspection.
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INSPECTRA® IR Series -
Toray Engineering Co., Ltd.
An infrared internal defect inspection system has been added to the INSPECTRA® series.It is now possible to inspection with both infrared and visual light in one system.
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TR7500 SII -
Test Research, Inc.
Featuring a large FOV 3-CCD color camera and four angled cameras, the TR7500 SII automated optical inspection offers double the scanning speed of TR7500 with identical inspection performance in an inline solution. The system is capable of high performance inspection at resolutions ranging from 10 to 15 µm, utilizing TRI' hallmark on-the-fly Dynamic Imaging technology for powerful pre/post reflow inspection without generating vibration associated with stop-and-go systems.
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