Showing results: 481 - 495 of 631 items found.
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Ansys Corporation
Multiphysics Analysis Solutions for Chips and 3D IC Systems. Ansys cloud-native solutions provide unparalleled capacity to speed up completion times for even the largest finFET integrated circuits (IC) and 3D/2.5D multi-die systems. These powerful multiphysics analysis and verification tools reduce power consumption, improve performance and reliability, and lower project risk with foundry-certified golden signoff verification.
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Romer -
Attotech Co., Ltd.
A first in the world of portable measuring arms: The ROMER Absolute Arm features absolute encoders and is therefore the first measuring arm which does not require referencing before measurement. When the arm is turned on, it’s ready to go.Quality control, inspection, on-machine verification, reverse engineering, virtual assembly or 3D modelling. Wherever these needs arise, you will find the ROMER Absolute Arm. Much more than just a metrology tool, its value lies in its versatility.Portability, stability, light weight and high-performance laser scanners make the ROMER Absolute Arm an all-purpose 3D measurement, analysis and digitising tool that can be used by anyone, anywhere and with minimum training.Unlike many metrology devices, the ROMER Absolute Arm does not require warm-up time or initialization, thanks to a stable carbon fiber structure and industry leading Absolute encoders. Simply take the measuring arm to the part, switch it on and start measuring.
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VXTRACK -
Creaform Inc.
The C-Track dual-camera sensor is a complete portable 3D measurement solution that offers probing inspection and dynamic measurement capabilities. It is fitted with high-quality optics and special lighting, enabling it to measure all reflectors within its operating space. The probing stylus is very useful for aligning parts with respect to a referential (calculated using a group of reflectors), which allows movement or deformation monitoring directly on the part's referential.
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Automated Precision Inc.
Whether for global manufacturers or small custom shops, API’s measurement expertise, combined with advanced metrology equipment, can execute convenient and fast reverse engineering projects. Our Laser scanning services can create data from an existing part or compare captured data to a CAD model. Reverse engineering services include scan as-built parts to creation of a 3D digital point cloud and CAD Model.
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Verisurf Software, Inc.
Verisurf hardware is configured with the right functionality for your application and budget. We invite you to review our products and contact us to see a Verisurf 3D measurement system first hand or to help configure and quote the right system for your application and budget.Let Verisurf Software, Inc. be your measurement consultant ready to provide full implementation support of your chosen hardware-Verisurf software combo!
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STK -
Analytical Graphics, Inc.
STK is a free 2D and 3D modeling environment used by engineers, mission analysts, operators and decision-makers from more than 700 global organizations to model complex systems (such as aircraft, satellites, ground vehicles and their sensors) to evaluate their performance in real or simulated time. Built on a time-dynamic, physics-based geometry engine, AGI software answers fundamental questions essential to solving dynamic analysis problems
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Euresys Inc.
Laser line extraction with zero host CPU usageSingle and Dual Laser Line Extraction into a depth mapReal-time generation of 16-bit 3D height mapsChoice of algorithms: Maximum, Peak, Center of Gravity (COG)Precision: up to 1/256 pixel (with Peak and COG algorithms)Performance: 19,000 profiles/s from 1024 x 128 images. 38,000 profiles/s from 1024 x 64 imagesMemento Event Logging Tool
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3DStress® -
Southwest Research Institute
3DStress® provides a user-friendly and interactive tool to investigate geologic stress states and effects on developing and reactivating faults and fractures. Components include Mohr circle plots with Hoek-Brown failure criteria, stress-ratio plots, stereonet and three-dimensional (3D) visualization tools to enable the user to illustrate hypothetical situations or complex real-world fault and fracture systems, and a patented stress inversion algorithm that does not require slip direction information.
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SolarWIS Platform -
ASM Assembly Systems
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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KLA-Tencor Corp
Profilm3D® and Zeta™ optical profilometers provide fast, easy, non-contact solutions for 3D surface topography measurements. Our portfolio of optical profilers supports a variety of measurement techniques, including white light interferometry, True Color imaging and ZDot™ confocal grid structured illumination. KLA Instruments can help guide you to the right optical profiler solution for your unique needs.
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VICORE -
Teledyne DALSA
This versatile system offers excellent performance for inspection applications using traditional 2D imaging, thermal imaging, 3D imaging or a combination thereof. Its small, book style format consumes minimal cabinet space and provides convenient, front-accessible connections for cameras, I/O and system components. This includes a dedicated industrial Ethernet port that offers efficient communication with complementary factory devices using Ethernet/IP or Profinet.
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ROM-3420 -
Advantech Co. Ltd.
ROM-3420 RTX2.0 module integrates an ARM Cortex A9 Dual 1 GHz NXP i.MX6 series ultra low power SoC and I/O solution with Linux. NXP i.MX6 supports 2D, 3D graphics acceleration, and a full HD 1080P video decoding encoding hardware engine. ROM-3420 supports 5V~24V wide range power inputs and a wide temperature design for industrial applications.
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McBain Z-NIR Near Infrared Inspection Microscope -
McBain Systems
The McBain Z-NIR Near Infrared Inspection System is best-in-class for wafer-to-wafer and die-to-die alignment measurement and verification. This unique tool has been sold into many industries with various applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
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L3GD20H -
Adafruit
A gyroscope is a type of sensor that can sense twisting and turning motions. Often paired with an accelerometer, you can use these to do 3D motion capture and inertial measurement (that is - you can tell how an object is moving!) As these sensors become more popular and easier to manufacture, the prices for them have dropped to the point where you can easily afford a triple-axis gyro! Only a decade ago, this space-tech sensor would have been hundreds of dollars.
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EXTEND3D GmbH
*Intelligent laser projector, *Exact positional representation on assemblies in 3D *For attachments, holes, bolts and more *Stencils, fixtures and coordinate measuring machines are superfluous *Avoid mistakes before they arise. *Simplifies, streamlines and speeds up work steps *Over the entire process chain - from data preparation to quality assurance With Werklicht® Pro , the "digital template", you build an elegant bridge between CAD data and the real object.
