Showing results: 601 - 615 of 631 items found.
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ADLINK Technology Inc.
Embedded vision systems, also referred to as compact vision systems, offer an alternative to Smart cameras and computer-based systems. The ADLINK EOS series is a complete embedded system that offers image acquisition, processing, archiving, and display capabilities. It is equipped with a multi-core CPU, ideal for applications requiring high computing power and multi-camera imaging, such as 3D vision and robotics guidance. Featuring rich I/O connectivity with factory-floor networks, including RS-232/422/485, USB, and isolated digital I/O, as well as onboard storage, ADLINK’s embedded vision system is ready to deploy. A system monitoring feature, feeding back temperature and voltage data, combines with a watchdog timer to maximize robustness and reliability of the ADLINK EOS series in mission critical applications.
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Cohu, Inc.
For optical sensor test Cohu offers a variety of solutions being driven by requirements for tri-temp, parallelism and stimulus spacing. Customized optical stimulus units are integrated into Cohu’s test handling systems. For light detector test, we implement different types of light sources, such as infrared, ambient- and colored light. We offer different solutions for 3D image sensors combining emitter and receiver tests of LiDAR, Time of Flight and Structured Light devices.
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Robson Technologies, Inc.
RTI designs and manufactures DUT boards for many types of special purpose test equipment including: ESD test systems, special purpose functional testers, automated curve trace equipment, as well as standard semiconductor test equipment. All designs are performed in-house using PCB design software (Mentor PADS, CAM350) and 3D mechanical design software (Solid Edge) if required. PCB fabrication is sub-contracted to one of our long-time fabrication partners.
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FIB -
JEOL Ltd.
An easy-to-use, out-lens type scanning electron microscope (SEM) equipped with a Schottky electron gun, as well as a new FIB column capable of large current processing (maximum ion current 90nA) installed into one chamber. JIB-4610F enables high-resolution SEM observation after high-speed cross-section milling with FIB, and high-speed analysis with a variety of analytical instruments, such as energy dispersive X-ray spectroscopy (EDS) that takes advantage of the Schottky electron gun delivering a large probe current (200nA), electron back scatter diffraction (EBSD) to perform crystallographic characterization, and cathodoluminescence (CLD). In addition, the 3D analysis function Cut & See is included in the standard configuration, allowing cross-section milling to be executed automatically at fixed intervals, while acquiring SEM images for each cross section.
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DI-NH3 -
MKS Instruments
MKS' DI-NH3 is a compact, stand-alone system providing dissolved ammonia water. With Semiconductor 3D IC architectures using new materials like Cu-Co and Si-SiGe, the ability to wet clean with precise alkaline chemistries is growing in frequency and importance. The DI-NH3 delivers dissolved ammonia, providing optimal cleaning capability in an alkaline chemistry, minimizing material loss and contamination and inhibiting Electrostatic Discharge (ESD). Using closed-loop control, conductivity and pressure are kept stable under changing flow conditions. The dissolved ammonia concentration is monitored and adjusted, delivering the specific NH4OH concentration needed. Dissolved ammonia’s alkaline chemistry provides ESD protection during rinsing, particle lift-off, and residual photoresist removal in middle-of-line (MOL) and prevents corrosion of cobalt/copper interfaces.
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EV Group
ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.
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ARC Technology Solutions
Have time to market pressure and need to get a system or assembly or production line up and running quickly? Need to rapidly build out a solution, but don’t want to spend months on building up an architecture? Allow our rapid prototyping team to assist you – whether it is crafting 3D printed mechanical assemblies or a building up a high speed IO interface, you are in very capable hands with the ARC engineering team. Our DSX product, can help support your IP, implement your process or and be the core processing engine for your design, or if a larger system, DSX could be an integral part of your system. PVS, another tool that can help error-proof your assembly process, is ready to go in a flexible, software-centric solution that you can be reconfigured as needed to meet your changing demands.
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Raymond RF Measurements Corp.
Raymond RF's Antenna Measurement Software performs 2-D (polar/rectangular) and 3-D (spherical) antenna pattern measurements for passive antennas and active wireless mobile stations (cell phones). Insertion loss of passive devices is included as part of the calibration component. Data management and reporting of antenna properties such as half power beam-width, directivity, gain, radiation efficiency, total radiated power, and total isotropic sensitivity. AMS performs and reports all measurements required by the CTIA Over-the-Air Performance Test Plan.
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VQDM-100 -
VideoQ Inc
Versatile compact and robust multi-purpose tool for R&D and glass-to-glass QA/QC Instant visual-aural quality estimation plus automatic latency, AV sync and 3D LR sync measurement Multi-channel time-line analysis, including video frames continuity testing 4 Light Sensors with vacuum caps, 4 Audio inputs (standard line levels) 2 channels of AV timing analysis, simultaneous measurements of Video and Audio Latencies Real time multi-channel data acquisition via USB port Unique sophisticated set of static and dynamic test patterns up to 1080p@60fps - see more details in separate VQL page Source of VQDM, VQMA2, and VQMA3 Test Patterns for VideoQ Analyzers Multi-format digital and analog AV outputs: HDMI, YPrPb, S-video, SPDIF, LR analog audio Networkable unit, easy expansion with any external USB storage device: live clips, user content, etc.
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CEM300 -
Axiomtek Co., Ltd.
The CEM300, a COM Express® Type 10 module, supports Intel® Pentium® N3710 and Celeron® N3160/N3060 quad-core/dual-core processors (codename: Braswell) with support for 4 GB DDR3L memory onboard. Integrated with Intel® Gen 8 graphics, the COM Express® Type 10 computer-on-module provides excellent graphic performance including support for DirectX 11.1, OpenGL 4.2, and 3D features and resolution up to 4K (3840 x 2160 @ 30 Hz). The ultra-small mini module comes with 4 to 6 watts low power consumption, and provides wide range voltage power input of 4.75V to 20V for harsh industrial environments. The Axiomtek CEM300 is ideal for IoT-connected industrial controls, medical imaging, retail equipment, MMK (Multi Media Kiosk), industrial gateway, automation and POS terminals related applications.
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CAPA110 -
Axiomtek Co., Ltd.
Axiomtek's CAPA110, a high-end graphics 3.5" embedded board is equipped with the latest AMD G-series APU dual core T56N 1.65GHz and AMD FCH A50M chipset, which is a wonderful choice for graphics-intensive applications such as high-end medical imaging, digital signage, kiosks/POI, thin clients, and gaming machines. One SO-DIMM socket on the CAPA110 supports up to 4GB of DDR3 1333 memory. The integrated Radeon™ HD6320 graphics controller delivers unprecedented high definition visual experience and offers outstanding 3D performance with DirectX 11 supported. Dual display capability is supported via the VGA and DisplayPort connections on the coastline, as well as onboard 18-bit/24-bit LVDS interface. Besides, the CAPA110 provides high-bandwidth expansion capability with one PCI Express Mini card for custom system configurations. Moreover, the system only requires +12V DC power input.
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AOSense
Detailed description of item: Complete cold atomic beam sources for alkaline-earth precision experiments and atomic devices. Small chambers with patented permanent-magnet Zeeman slowers and in-vacuum 2D MOT optics allow high flux with low outgassing and no thermal beam flux at the cold atom port, which provides a CF-133 connection to customer vacuum chamber. Advanced thermal design of the effusion oven allows long-lifetime operation at minimal heating power, with no water cooling. An integrated low-outgassing hot window is provided for coupling of on-axis Zeeman cooling light. Ion and getter pumps integrated into the chamber manage outgassing from the oven at temperatures up to 520 °C. Operating baseline pressures below 1×10-11 mbar can be attained in the customer’s downstream cold atom (typically 3D MOT) science chamber, with suitable pumping speed provided at the differentially-pumped cold beam output port.
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AMP-204C/AMP-208C -
ADLINK Technology Inc.
ADLINK"s new AMP-204C/AMP-208C DSP-based 4/8-axis advanced pulse-train motion controllers incorporate up-to-date floating-point DSP and FPGA technology, enabling high pulse output and encoder input frequency up to 6.5 MHz and 20 MHz respectively. Leveraging ADLINK" s Softmotion technology, the AMP-204C/AMP-208C offer impressive comprehensive and application-oriented motion functionality to reduce development time while maintaining superior throughput and accuracy. Superior synchronous motion control performance combines with point-table function integrating multi-dimensional interpolation, such as 3D linear/circular/spiral interpolation with enhanced trajectory and velocity planning, for contouring applications in semiconductor, display and conventional manufacturing industries. The AMP-204C/AMP-208C also support PWM control with three different control modes for frequency or duty cycle, benefiting laser engraving/marking/cutting applications. Moreover, hardware-based position comparison and trigger output are applicable in AOI applications.
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Machine Vision Products
Machine Vision Products, Inc. has extensive experience in a wide range of Microelectronics and Packaging applications. MVP works with the world’s leading manufacturers on a global basis. From multiple die and wire technologies to leadframe, ball grid array and surface inspection applications, MVP has the widest applications toolbox of any AOI provider. MVP takes pride in the fact that they supply many complex inspection solutions to diverse industries such as Automotive, Telecoms, Medical Devices, Military, and Space. MVP’s 900 Series is the base platform upon which all Microelectronics and Packaging inspection solutions are based. The 900 series 2D capabilities provide metrology and defect detection using a propriety Quad-Color lighting, Telecentric optics and resolutions down to 1um. 3D height measurement capabilities allow for in-line high speed inspection of Dies, paste deposition, positional accuracy, volume and height with a resolution down to 1.13um.
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Sinowon Innovation Metrology Manufacture Ltd.
◆ The lifting system adopts linear guide rail and precision screw drive, which makes the lift drive more comfortable and stable;◆ With precision toothless rod and fast movement locking device, ensure return error is within 2um;◆ High accuracy A optical scale and precision working stage, ensure machine accuracy is within 3+L/200 um;◆ HD zoom lens and HD color digital camera, ensure clear image without distortion;◆ With programmable surface 4-ring 8-division LED cold light and contour LED parallel illumination, it can control the brightness of the 4-ring 8-division independently;◆ With powerful iMeasuring2.1 software system , to enhance the control quality;◆ Optional imported contact probes and 3D measuring software, it can help upgrade the machine to be coordinate measuring machine;◆ Optional FexQMS measurement data analysis and real-time monitor software, enhance process control, reduce material consumption;
