Showing results: 481 - 495 of 624 items found.
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Euresys Inc.
Laser line extraction with zero host CPU usageSingle and Dual Laser Line Extraction into a depth mapReal-time generation of 16-bit 3D height mapsChoice of algorithms: Maximum, Peak, Center of Gravity (COG)Precision: up to 1/256 pixel (with Peak and COG algorithms)Performance: 19,000 profiles/s from 1024 x 128 images. 38,000 profiles/s from 1024 x 64 imagesMemento Event Logging Tool
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3DStress® -
Southwest Research Institute
3DStress® provides a user-friendly and interactive tool to investigate geologic stress states and effects on developing and reactivating faults and fractures. Components include Mohr circle plots with Hoek-Brown failure criteria, stress-ratio plots, stereonet and three-dimensional (3D) visualization tools to enable the user to illustrate hypothetical situations or complex real-world fault and fracture systems, and a patented stress inversion algorithm that does not require slip direction information.
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SolarWIS Platform -
ASM Assembly Systems
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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KLA-Tencor Corp
Profilm3D® and Zeta™ optical profilometers provide fast, easy, non-contact solutions for 3D surface topography measurements. Our portfolio of optical profilers supports a variety of measurement techniques, including white light interferometry, True Color imaging and ZDot™ confocal grid structured illumination. KLA Instruments can help guide you to the right optical profiler solution for your unique needs.
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VICORE -
Teledyne DALSA
This versatile system offers excellent performance for inspection applications using traditional 2D imaging, thermal imaging, 3D imaging or a combination thereof. Its small, book style format consumes minimal cabinet space and provides convenient, front-accessible connections for cameras, I/O and system components. This includes a dedicated industrial Ethernet port that offers efficient communication with complementary factory devices using Ethernet/IP or Profinet.
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ROM-3420 -
Advantech Co. Ltd.
ROM-3420 RTX2.0 module integrates an ARM Cortex A9 Dual 1 GHz NXP i.MX6 series ultra low power SoC and I/O solution with Linux. NXP i.MX6 supports 2D, 3D graphics acceleration, and a full HD 1080P video decoding encoding hardware engine. ROM-3420 supports 5V~24V wide range power inputs and a wide temperature design for industrial applications.
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McBain Z-NIR Near Infrared Inspection Microscope -
McBain Systems
The McBain Z-NIR Near Infrared Inspection System is best-in-class for wafer-to-wafer and die-to-die alignment measurement and verification. This unique tool has been sold into many industries with various applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
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L3GD20H -
Adafruit
A gyroscope is a type of sensor that can sense twisting and turning motions. Often paired with an accelerometer, you can use these to do 3D motion capture and inertial measurement (that is - you can tell how an object is moving!) As these sensors become more popular and easier to manufacture, the prices for them have dropped to the point where you can easily afford a triple-axis gyro! Only a decade ago, this space-tech sensor would have been hundreds of dollars.
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EXTEND3D GmbH
*Intelligent laser projector, *Exact positional representation on assemblies in 3D *For attachments, holes, bolts and more *Stencils, fixtures and coordinate measuring machines are superfluous *Avoid mistakes before they arise. *Simplifies, streamlines and speeds up work steps *Over the entire process chain - from data preparation to quality assurance With Werklicht® Pro , the "digital template", you build an elegant bridge between CAD data and the real object.
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Q-450 -
Dantec Dynamics A/S
The 3D High-Speed Image Correlation System Q-450 allows the full-field, non-contact and three-dimensional dynamic measurement of shape, displacements and strains on components and structures made from almost any material. Based on the digital image correlation technique, the Q-450 system is designed for full-field vibration analysis and high speed transient events. This makes it ideal for ballistics testing, fracture mechanics, shock excitations, the Hopkinson Bar test, or Impact Testing.
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Dantec Dynamics A/S
Laser Doppler Anemometry (LDA), also known as Laser Doppler Velocimetry (LDV), is an optical technique ideal for non-intrusive 1D, 2D and 3D point measurement of velocity and turbulence distribution in both free flows and internal flows. Science and industry apply our LDA systems to gain a clearer understanding of fluid mechanics. The measurement results are important steps in fine-tuning product designs to improve aerodynamic efficiency, quality and safety.
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LSG-5000 -
Lisun Electronics Inc.
Moving Detector Goniophotometer completely meets LM-79 Clause 9.3.1 and EN13032-1 clause 6.1.1.3 goniophotometer type 4 requirements. The LSG-5000 is an automatic light distribution intensity 3D curve testing system for measuring light. The measuring distance is from 5m to 30m. It can measure all types of lighting sources, LED or HID luminaires such as indoor and outdoor luminaires, roadway luminaires, street lamps, flood lights and other kinds of luminaires.
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H-Series CATR -
Emite Ingeniería SL. Ed
The H-Series CATR chamber provide complete 3D performance assessment for 5G OTA devices and antennas including gain, efficiency, directivity, polarization and beam characteristics for frequencies from 3 up to 110 GHz, capable of supporting forthcoming 5G Sub-6 GHz (from 3 to 6 GHz) and mmWave (24 to 110 GHz) standardized testing including TRP/TIS, EIRP, EIS, IBB and emissions in accordance to 3GPP TR38.810 and TR37.842.
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Plasma Module -
COMSOL, Inc.
The Plasma Module is tailor-made to model and simulate low-temperature plasma sources and systems. Engineers and scientists use it to gain insight into the physics of discharges and gauge the performance of existing or potential designs. The module can perform analysis in all space dimensions 1D, 2D, and 3D. Plasma systems are, by their very nature, complicated systems with a high degree of nonlinearity. Small changes to the electrical input or plasma chemistry can result in significant changes in the discharge characteristics.
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SICK Sensor Intelligence
ICK profiling systems measure, detect, classify, count, and check vehicles in 3D. They determine the number of axles on heavy goods trucks for vehicle classification and measure vehicle dimensions to rectify loading errors. The systems recognize overheated vehicles approaching tunnels and other entrances and activate diversions. They also monitor external train contours. If a limit value is exceeded, the system triggers an alarm. All this contributes to safety on roads and railroads.