Showing results: 121 - 135 of 137 items found.
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igentic® 841t -
Sterner Automation Limited
Integrated circuit (IC) and micro electro-mechanical system (MEMS) device manufacturers need to address the challenges of today's global market including increased functionality, speed and complexity while delivering components at reduced costs. Sterner Automation's igentic® 841t automated test systems meet these demanding requirements by providing a flexible platform for comprehensive end-of-line IC and MEMS device handling, testing, grading and packaging. The resulting improvements in quality assurance and process efficiency will maximize customer satisfaction and profitability.
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PFL780/760 -
Polar Instruments Inc
The PFL780 and 760 use IC clips as a test interface. This makes them ideal for the service and maintenance of legacy systems. If you need to work on high density surface mount PCBs you should consider the GRS500 as a more suitable alternative.
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Wewon Environmental Chambers Co, Ltd.
Probe card manufacturing need the semiconductor test equipment. When we designed the thermal testing equipment, Only some commonly used test items are packaged into the IC tester, and the logic function of the verification chip is implemented in a fixed test mode. But as chip products diversify, Some thermal inducing system can no longer do it alonehttps://www.wewontech.com/semiconductor-test-equipment/
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LPDDR4 and LPDDR3 -
Triad Spectrum, Inc.
Testing LPDDR4, LPDDR3 devices is made fast and simple with the "Lower Power" LPDDR4/3 TCE-3200LP IC test system. It can be configured up to 32 sites in parallel and integrated with the customer's selected handler.The TCIII-3200LP system can be used as a production tool as well as an engineering tool. To assist manufacturers and integrators, TurboCATS has developed a heat chamber that can be integrated with the TCE-3200LP, LPDDR4 and LPDDR3 test system. This allows the devices to be tested while being exposed to heat conditions.
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Cohu, Inc.
Diamondx semiconductor test system extends Cohu’s low-cost, high-throughput production test solution platforms to high pin count, higher site count wireless, mobility, SOC, Flat Panel Display drivers, Power Management, and microcontrollers. Designed to meet the cost drivers IC companies face, Diamondx extends Cohu’s leadership in lowering the cost of operations.
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SYSTEM 8 (AICT) -
ABI Electronics Ltd
The SYSTEM 8 Analogue IC Tester is the answer to testing analogue devices. The key feature of the AICT is its ability to functionally test all common analogue ICs and discrete devices in circuit. It is also capable of testing all types of analogue and digital components by means of the well-known, power off V-I test technique. For users requiring only the latter function, please select the Analogue Test Station section.
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Amida Technology, Inc.
AMIDA 5000 is a high-end performance test system, combining analog, mixed-signal and logic with the latest test solutions. High pin count - as many as 512 smart multi-function pinframes and 128 sites. Ability to provide cost-optimized test solutions for a variety of consumer components in power management and mobile device components. This system has a higher number of parallel tests and a higher level of capability. This series of test systems provides a powerful test combination with high-speed hardware and software integration. The 5000 series test system is the best analog, mixed signal, digital IC, PA test system for engineering verification and mass production. It can be easily connected to all well-known wafer probing machines and sorters, and also supports parallel test functions. The 5000 series meets customers' needs for high-precision, high-resolution, high-reliability, user-friendly, and low-cost testing and measurement of test systems.
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Thermo Fisher Scientific Inc.
Identify and help correct ESD and latch-up susceptibility issues on sensitive integrated circuit components prior to full-scale production with the Thermo Scientific™ MK.2-SE ESD and Latch-Up Test System. The MK.2-SE test system provides advanced capabilities to test high pin count IC devices to Human Body Model (HBM) and Machine Model (MM) ESD standards. The system’s pulse delivery design addresses wave form hazards such as trailing pulse and pre-discharge voltage rise, and performs Latch-Up testing per the JEDEC EIA/JESD 78 Method.
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W2200BP -
Keysight Technologies
Advanced Design System (ADS) is the flagship product from Keysight EEsof EDA, the technology and innovation leader in high-frequency, mixed-signal electronic design automation (EDA). It is the only design simulation platform that enables the co-design of IC, package and board in high-frequency and hi-speed applications. ADS seamlessly integrates system, circuit, and full 3D electromagnetic simulation with Keysight's test instrumentation to perform single pass successful electronic designs repeatedly.
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Ironwood Electronics
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Amida Technology, Inc.
AMIDA has introduced two new analog/mixed-signal and logic options in the AMIDA-3000 series in recent years—the AMIDA-3001XP and AMIDA-3KS test systems. Both reinforce the AMIDA-3000 series' ability to provide cost-optimized test solutions for a variety of consumer components in power management and mobile device components. The AMIDA-3000 series provides more than twice the number of analog channels of its modules per test system, thus greatly reducing the acquisition cost of each channel and more than doubling the number of analog channels in the entire test system. This results in a higher number of parallel tests and a higher level of capability for this system, as well as a lower and more cost-effective IC unit test cost for this tester. This series of test systems provides a powerful test combination with high-speed hardware and software integration. The built-in instant messaging protocol detection function of AMIDA-3001XP test machine not only simplifies the complexity and difficulty of test development, but also greatly shortens the test time by using its high-speed computing capability.
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KLA-Tencor Corp
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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Pacific Testing Laboratories
A partial list of our state of the art test equipment, applicable to these testing disciplines, will include the following: Two Scanning Electron Microscopes with EDS (SEM/EDS) Three Differential Scanning Calorimeters (DSC) Three Thermogravimetric Analyzers (TGA) Three Thermo Mechanical Analyzers (TMA) One Dynamic Mechanical Analyzer (DMA) Two Real-Time Fluoroscopic X-ray Systems, including a Microfocus System One Fourier Transform Infrared Microscope (FTIR) (capable of identifying a single particle of an unknown material) Two Ion Chromatographs (IC) (capable of identifying ionic impurities in ppm)
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MASER Engineering B.V.
Reliability Test and Diagnostic services are offered to a wide range of customers that are active as Fabless Semiconductor or Integrated Device Manufacturers, automotive electronics supplier, Telecom and ICT application specialists, Industrial and Medical electronic system manufacturers or in Aerospace and Space applications. Independent high tech test and diagnostic service laboratory. IC and electronic module qualification. ESD and Latch Up testing. Design assessment by HALT/HASS. Failure and construction analysis.
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RP4030 -
Teledyne LeCroy
The Teledyne LeCroy RP4030 Power Rail Probe meets the specific requirements of those who need to acquire a low-voltage DC signal as part of a:-Comprehensive power integrity, digital power management IC (PMIC), voltage regulator module (VMR), point-of-load (POL) switching regulator, or low-dropout regulator testing- Complete embedded power management system that includes PMICs, VRMs, POLs, and LDOsThe RP4030 will faithfully acquire a low-impedance, low-voltage DC power/voltage rail signal without unduly loading the device under test (DUT), while providing high offset to allow DC power/voltage rail signal display on an oscilloscope with high gain.
