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Wafer
thin crystalline material sliced from ingot.
See Also: Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Probe Cards
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Ceramic Process Carrier Pallets
Ceramic engineering specializing in Silicon Carbide, Boron Carbide, Alumina, Zirconia and Lead Zirconate Titanate (PZT) based ceramics, composites and thin films for High Strength, high temperature, semiconductive ceramic designed for use in wafer fabrication or hybrid circuits in vapor deposite ovens. Test Electronics will precision drill and customize pallets for your circuit board. Click on the Quote tab on the left then click on the Carrier Pallets tab to get an instant quotation on your process carrier pallets.
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Components
The Brooks field-proven wafer transport robots and modules deliver high performance and low total cost of ownership to create manufacturing efficiency, accelerate innovation, and drive profits for today’s manufacturers.
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Contactless One-Point Wafer Thickness Gauge
MX 30x
The MX30x series are manual one-point Thickness gauges for silicon wafers.
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Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
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Contactless Wafer Geometry Gauge
MX 20x series
The E+H geometry gauges are based on two heavy plates mounted parallel to each other. Embedded in the plate are a set of capacitive distance sensors. The wafer will be moved manual or automatically between the plates and measured without any movement.
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Copper Pillar Bump
Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
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Defect Inspection Module
EB40
The Class 1 certified E40 and B40 modules (available separately or combined in one module) can automatically detect defects on the entire edge, from zone 1 to 5, and the entire backside. The ability to inspect the entire backside allows for faster root-cause analysis of zone 5 defects since such defects can migrate from the wafer interior.
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Dimensional Measurement System
MICROLINE AF
The VIEW MicroLine® is a high-performance critical dimensional measurement system for wafers, masks, MEMS and other micro-fabricated devices in situations which do not require fully automated operation.
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Dimensional Metrology
Integrated Metrology Family
Nova Measuring Instruments Inc.
Nova is the market leader in the space of integrated metrology platforms with multiple generations of products. Our integrated metrology platforms enable advanced process control (APC) to monitor and control wafer to wafer variations of complex high-end CMP and Etch applications with high productivity and reliability required for the most advanced logic and memory technology nodes.
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Flexible Test And Scan Solution For FFC Devices
Ismeca NY32W
32-position turret test and scan platform for semiconductors on film-frame wafer media, providing the highest inspection yield for WLCSP and Bare Dies. Integrating innovative hardware and software technologies such as intelligent features that enable extended autonomous operation and productivity.
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Front-end
With geometries getting smaller, macro inspection becomes both more challenging and crucial for defect-free and high-yield wafer manufacturing. The variety of defects calls for detection optimization, fast screening and categorization of the high volume manufacturing environment, while maintaining high throughput.
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Grain Inspector
iS-G1
The iS-G1 is a full line speed optical module for the inspection of crystal grains.Using our new grain imaging technology, the iS-G1 is able to inspect as cut wafers at full inline speed with no need to stop the conveyor belt. Automated algorithms analyze the grains and report metrics.
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High Resolution Wafer Thickness & Thickness Variation Gauge
MX 10x series
The MX10x series measure thickness and thickness variation on silicon wafers. It has a resolution of 10 nanometers and can be adapted to different thickness ranges within a few seconds.
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HJT Tray Automation
JRT Photovoltaics GmbH & Co. KG
The highly sophisticated machine platform HJT TRAY AUTOMATION ensures the fully automated loading and unloading of trays for inline-coating processes. Outstanding innovation is the particularly surface-friendly, yet high-performance handling of wafers in inline flat-carrier transport. This involves high-precision, row-by-row positioning of the wafers which are individually measured.
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Humidity Sensors
digital humidity sensor with integrated temperature sensor that provides excellent measurement accuracy at very low power. The device measures humidity based on a novel capacitive sensor. The humidity and temperature sensors are factory calibrated. The innovative WLCSP (Wafer Level Chip Scale Package) simplifies board design with the use of an ultra-compact package. The sensing element of the HDC1008 is placed on the bottom part of the device, which makes the HDC1008 more robust against dirt, dust, and other environmental contaminants. The HDC1008 is functional within the full 40C to +125C temperature range.
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IGBTs
Renesas insulated-gate bipolar transistors (IGBTs) realize both low saturation voltage and fast switching through thin wafer technology. Product series suitable for a variety of applications are available, and help to cut down all kinds of power loss.
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In-chip Monitoring Solutions
Range of in-chip monitoring and embedded sensing fabrics allows for meaningful data to be captured at each stage of a chip’s lifecycle. Manufacture | Wafer Sort | Package Test | In-field | End-of-lifeDeep in-chip sensing, telemetry & analytics enablement. Highly distributed, real-time thermal analysis. Supply voltage sensing for power optimisation. Chip assessment for chip to product appropriation.
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Inline OEM High Resolution Thickness & Resistivity Module for PV / Solar Sorters
MX 152
To allow three thickness scans during belt transport at different wafer sizes, two measuring bars, one from top and one from bottom, hold 3 sensors each.
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Inline Wafer Electrical quality Inspection
ILS-W2
the Ultimate Wafer Electrical Quality Inspection Unit for Wafer Inspection Systems
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In-situ Wafer Temperature Monitoring
CI Semi's family of noncontact temperature monitors (the NTM line), offers high end pyrometry products for the measurement of wafer temperatures during process. CI Semi’s flag ship of the line, the NTM Delta, incorporates real-time, same point emissivity measurement and compensation making it the ideal solution for in situ monitoring for processes such as RTP, CVD and PVD. The NTM family is sold to leading tool manufacturers.
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kSA BandiT
The kSA BandiT is a non-contact, non-invasive, real-time, absolute wafer and thin-film temperature monitor used during thin-film deposition and thermal processing.
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kSA Scanning Pyro
For use on Veeco K465i and EPIK700 MOCVD reactors, the kSA Scanning Pyro performs automated temperature mapping in order to measure temperature variations across wafer carriers and wafers. Use it to tune heater zones and optimize process and hardware to achieve higher yields, wafer uniformity and device performance.
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Longitudinal Magneto-Optic Kerr Effect System
KerrMapper S300 and V300
The KerrMapper family of tools utilizes the longitudinal Magneto-Optical Kerr Effect (MOKE) to characterize the magnetic properties of magnetic multi-layer wafers for data storage, MRAM, and other magnetic sensors. Utilizing a non-contact full-wafer measurement technique, the KerrMapper S300 and V300 systems create a map of the magnetic properties of entire wafers.
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Manual Prober 100/150/200
Compatible with a wide range of needs for series evaluation and analysis with comfortable operability popular Always adopting a soft contact by adopting a shock absorber. It adopts a large platen and realizes mounting of a margin manipulator. Moreover, it is possible to adjust Z of the needle at once by moving the platen up and down. It is an ancient form that takes operability into account. It is easy to load / unload wafers.
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MASK MVM-SEM® E3600 Series
E3640
Ongoing semiconductor process shrinks are driving new demand for stable, highly precise measurement of pattern dimensions for photomask and wafer production. The E3640 satisfies these requirements with industry-leading precision measurement capabilities and upgraded functionality that enhances mask R&D and production efficiency.
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Mercury Probes
Materials Development Corporation
MERCURY PROBES are precision instruments that enable rapid, convenient, and non-destructive measurements of semiconductor samples by probing wafers with mercury to form contacts of well-defined area.
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Micro-spot DUV Spectroscopic Reflectometry
FilmTek 2000 PAR
Scientific Computing International
A low-cost solution for high-throughput, fully-automated mapping of patterned wafers for development and production environments. Utilizes patented parabolic mirror technology to measure wavelengths from DUV to NIR with a spot size as small as 13µm. Fully user-customizable wafer mapping capabilities rapidly generate 2D and 3D data maps of any measured parameter.
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MPI Manual Probe Systems
MPI Advanced Semiconductor Test
manual probe systems are open, easy to use and cost effective yet highly accurate. These systems are designed for precision analysis of substrates and wafers up to 150, 200 and 300mm.
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MPI PA Wafer Probers
MPI Photonics Automation is the industry-leading provider of turnkey wafer test and measurement solutions. We offer a complete line of high-performance wafer probers designed to address the diverse and complex needs of the Photonics, Optoelectronic, Semiconductor, and Laser industries.
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Multisite Probe Card
T300 ButtonTile™
The Celadon T300™ probe cards are designed for long-term, multi-site, high-density wafer level reliability or burn-in tests up to 400°C. In today’s economic environment, conventional reliability data is needed quickly while eliminating the cost, electrical stress, and delay of parts packaging while maintaining a wafer performance map.
