Showing results: 196 - 210 of 427 items found.
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PVA TePla Analytical Systems GmbH
The fully automated acoustic microscopes from the SAM Auto Line enable simple detection of cavities, voids, bubbles, inclusions, and delamination and are ideally suitable for wafer inspection, bond checking, and MEMS inspection. An automatic defect-review software package performs a fully automated evaluation of the entire wafer. The results can be issued as klarf files and VEGA MAP. A GEM/SECS connection is also possible.
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k-Space Associates, Inc.
The kSA BandiT is a non-contact, non-invasive, real-time, absolute wafer and thin-film temperature monitor used during thin-film deposition and thermal processing.
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RoodMicrotec GmbH
Tests regarding function, electrical and optoelectronical parameter. Electrical test of wafer up to 8? and packaged devices - selection and volume test.
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128 Series -
Frontier Semiconductor, Inc,
Bow and Global Film Stress Measurement.Non-contact full wafer stress mapping for semiconductor and flat panel application.Dual Laser Switching Technology.
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Nanotronics Imaging
High-throughput automated macro inspectionAny wafer size, in less than one second with ~75 micron resolutionSmall footprint table-top system
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T5830/T5830ES -
Advantest Corp.
Highly flexible tester which has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories
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Model 659 -
OAI
UV Light and Energy Meter for use with all wafer steppers. For over 45 years, OAI is a world leader in UV Light and Energy Measurement Instrumentation used for reliable accurate calibrated control of the photolithography processes in the Semiconductor, MEMS, Wafer Packaging and Wafer Bumping Industries. The New Model 659 is an advanced UV exposure analyzer specifically designed for use with all wafer steppers including high intensity wafer steppers. This meter averages up to 400 exposure readings, has Ethernet and USB interface for downloading recorded measurements, and has intensity range of up to 7,500mW/cm2. Probes are available in wavelength of 365nm, 400nm, 420nm & 436nm. OAI has a complete certified calibration lab to maintain the performance, quality and reliability of our meters. The Model 659 meter is traceable to NIST standards.
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McBain Z-NIR Near Infrared Inspection Microscope -
McBain Systems
The McBain Z-NIR Near Infrared Inspection System is best-in-class for wafer-to-wafer and die-to-die alignment measurement and verification. This unique tool has been sold into many industries with various applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
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Polar Kerr System -
MicroSense, LLC
The Polar Kerr System for MRAM utilizes the polar Magneto-Optical Kerr Effect (MOKE) to characterize the magnetic properties of multi-layer wafers used in the development and manufacturing of perpendicular MRAM. Utilizing a non-contact full-wafer measurement technique, the system creates a map of the magnetic properties of entire wafers up to 300 mm. The system is available in a manual loading or fully-automated configuration for use in R&D and/or production.
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ASML
Our optical and e-beam wafer metrology and inspection products quickly and accurately measure pattern quality before and during high-volume chip manufacturing.
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HS-PSRT -
HenergySolar
It use Four Probe to test the resistivity and P/N type of wafers、ingots and all type of silicon materials.It can be used by Solar and Semiconductor industry.
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4605-HTR -
TESEC, INC
4605-HTR is a MAP Sorter which picks up devices from wafer ring and sorts to tape or bin according to the MAP file created by film frame test handler or prober. 4605-HTR is a high speed handling system, available for 12 inches wafer rings. When used in combination with 4170-IH, 4605-HTR much improves efficiency in testing process of leadless devices as a high speed sorting machine.
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Materials Development Corporation
MERCURY PROBES are precision instruments that enable rapid, convenient, and non-destructive measurements of semiconductor samples by probing wafers with mercury to form contacts of well-defined area.
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413 Series -
Frontier Semiconductor, Inc,
Substrate Thickness, Warp, and TTV Measurement- with or without Tape- for Wafer Backgrind and Etch Thinning processes.Non-contact Echoprobe Technology.Thin film and surface roughness options.
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HS-MPRT-5 -
HenergySolar
t used for measuring resistivity of silicon rods and wafers, and sheet resistance of diffused layers, epitaxial layers, LTO conductive films and conductive rubbers, etc.