Showing results: 106 - 120 of 427 items found.
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GPR-GB7SY -
Genmark Automation
The GPR-GB7SY Yaw-Axis (single and dual yaw) robot features Genmark’s technologically advanced mechanisms including patented GPR and YAW technologies to achieve the highest level of performance currently available in an automated material handler capable of transporting up to 450mm wafer payloads with utmost reliability and precision.
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GB4S-W -
Genmark Automation
Genmark’s “wet” process wafer handling robot, the GB4S-W Robot System, offers precision, performance, and reliability. The GB4S-W assures optimal performance and maximum up time of wet process equipment with minimal footprint. The GB4S-W addresses all major concerns such as premature damage of robot’s mechanisms due to moisture/humidity operational conditions associated with wet process applications including CMP and other applications.
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GPR-GB7-W -
Genmark Automation
GPR-GB7-W Robot System is designed with sealed mechanisms to prevent internal damage due to exposure to wet environments associated with automation of CMP and other process applications requiring materials handling under wet conditions.
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Hprobe Company
Hprobe design and fabricate turnkey automated testing equipment (ATE) for electrical characterization and testing of integrated circuits under magnetic field such as MRAM (Magnetic Random Access Memory) and sensors. In each phase of the technology and product development as well as during mass manufacturing, a dedicated magnetic tester is available.
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IS-T1 -
BT Imaging Pty Ltd
Measurement Technique Laser Triangulation1-3 Laser Sensor SpotsLaser Spot Size Optimized for Accuracy and Precision.
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MX 10x series -
E+H Metrology GmbH
The MX10x series measure thickness and thickness variation on silicon wafers. It has a resolution of 10 nanometers and can be adapted to different thickness ranges within a few seconds.
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GPR-GB8 -
Genmark Automation
Designed for ultra-precise transport of 300/450mm wafers and large FPDs, the GPR-GB8 Robot System combines increased reach and load capacity while employing Genmark’s breakthrough patented GPR™ technology.The patented GPR™ technology enables the servo-controlled robot to interface compliantly and intelligently with misaligned cassettes, FOUPS and process modules, as well as provide software-controlled end-effector deflection compensation during transport of heavier payloads.
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GPR-GB8-SM -
Genmark Automation
The combination of global linear motion of the two-links arm (R-axis) and rotation (Y-axis) of two swapping arms (A1 and A2 axes) ensure optimal handling of up to 4 in-line FOUPs, and dimensionally equivalent process modules, without the need to mount the robot on linear track component.
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G-Rex3™ -
Genmark Automation
The G-Rex3™ robotic system offers a small footprint, optimal throughput, reliability and serviceability in a cost effective package. It features innovative patent-pending designs, advanced control approaches and EZTeach technologies resulting in improved performance and reliability. The G-Rex3™ is a simplified low-mass design with fewer parts and moving components. The result is improved dynamics leading to higher acceleration and speed.
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PN-100BI -
NAPSON Corp.
*Principle: Photovoltaic effect with the laser diode*Suitable for production line and tranceportation system*Connect to host PC by LAN to send measurement command and data
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MX 70x -
E+H Metrology GmbH
The MX 70x series measure Thickness, Warp, Waviness, Roughness and are usable for nanotopography.
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Customized Solutions -
Microtronic, Inc.
Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.
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NC-6800 -
NAPSON Corp.
*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Number of cassette station can be changed by customers request*Eddy current method for resistivity, Electric capacitance method for wafer thickness*Temperature correction for silicon wafer function
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NC-3000R -
NAPSON Corp.
*High accuracy measurement system for large diameter wafer*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Compact design of Two-stage by measuring area and transfer area*Number of cassette station can be changed by customers request Option : Add wafer flattness measurement system(FLA-200)
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WS-8800 -
NAPSON Corp.
*Measurement of resistivity, thickness, conductivity(P/N) and temperature*Tester self-test function, wide measuring range*Thickness, measurement position and temperature correction function for silicon resistivity*Number of cassette station can be changed by customers request*Host (CIM) communication and SMIF or FOUP compatible