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Inspection and Measurement of Critical Dimensions
NEXIV VMZ-K6555
The Nikon Confocal NEXIV VMZ-K6555 was developed on the strength of Nikon's leading opto-mechatronics (optical, mechanical and electronic) technologies. It incorporates a variety of confocal optics for fast and accurate evaluation of fine three-dimensional surface metrology, image processing technology, and TT L laser autofocus. It allows both 2D and height measurements in the same field of view.
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Critical Dimension Measurement System
MicroLine® Series
The MicroLine series of non-contact critical dimensional measurement systems are ideal for semiconductor and MEMS applications. MicroLine systems automatically measure linewidth, overlay, and other critical features on wafers and photomasks. Systems are capable of measuring features from 0.5 m to 400 m in size. Measurement repeatability is 10 nm at 1 s (with 100x objective).
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PXI FPGA & Measurement Accelerator
Keysight PXI FPGA & measurement accelerator provide digital-pre-distortion (DPD) and envelope tracking (ET) measurements that are embedded in high performance FPGA processing cards.
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PXIe Measurement Accelerator
M9451A
The M9451A PXIe Measurement Accelerator combined with Option DPD Digital Pre-Distortion & Envelope Tracking Gateware shows what is possible when you combine state of the art FPGA's with Keysight's trusted measurement expertise and PXIe's high speed data handling. As part of Keysight's RF PA/FEM Characterization & Test, Reference Solution, this combination provides unprecedented performance for demanding envelope tracking and digital pre-distortion measurements required for testing modern power amplifiers (PAs) and front-end modules (FEMs). Hardware acceleration provides better than 20x speed improvement over Keysight's previous host-based Reference Solution, with closed/open loop digital pre-distortion (DPD) and envelope tracking (ET) measurements taking just tens of milliseconds and overall measurement times less than 70 ms.
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Automated Measurement System
EVG®40NT
The EVG40 NT (stand-alone tool) and the AVM (HVM-integrated module) enable measurement of lithography relevant parameters like critical dimension, as well as bond alignment accuracy.Because of the high-measurement accuracy, it is possible to verify compliance to tight process specifications and instantly optimize integrated process parameters.
