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Image Quality Analysis
Quality Engineering Associates Inc.
Historically, print and image quality evaluation has been hampered by reliance on subjective judgment and guesswork. But not any more. QEA has developed a full line of quantitative, reliable image analysis tools, encompassing sophisticated, fully-automated camera-based systems, automated scanner-based systems, portable hand-helds for distinctness of image (DOI) measurements, and a portable color measurement toolkit.
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Headspace Gas Analysis
The headspace gas analyzer adopts a professional structure design and is equipped with a high-precision sensor, which can accurately and conveniently determine the content and mixing ratio of O2 and CO2 in hollow packaging containers such as sealed packaging bags, bottles and cans. The equipment is used for headspace gas analysis and detection of various sealed packaging bags, packaging containers, vials, ampoules and other products.
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Coverage Analysis Tool
GNATcoverage
GNATcoverage performs coverage analysis on both object code instruction and branch coverage and Ada and C language source code statement, decision and Modified Condition/Decision Coverage (MC/DC). Unlike most current technologies, the tool works without requiring instrumentation of the executable. Instead, it runs directly on an instrumented version of GNATemulator, a lightweight and efficient emulator tool. GNAT Pro add-on.
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Order Tracking Analysis
Order Tracking is a general term describing a collection of measurement functions used for analyzing the dynamic behavior of rotating or reciprocating machinery for which the rotational speed can change over time. Unlike the power spectrum and other frequency-domain analysis functions where the independent variable is frequency, Order Tracking functions present the data against multiples (Orders) of the variable shaft running speed.
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Image Analysis Micrometers
For calibrating and analyzing microscopy measurement systems, the IAM line of Image Analysis Micrometers are perfectly suited. Calibrated to NIST Standards, and imaged with the best line edge quality in the industry, the IAM series is a diversified line of slides that function in areas of color calibration (IAM-9C), Optical Magnification, Frame Distortion, and other applications. Custom features, substrates, sizes and designs are available as custom solutions.
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Failure Analysis Services
BMP Testing and Calibration Services Inc.
Failure analysis plays a crucial role in product development that enables industries to prevent future product failures and improve them for the end-user. It’s a multi-faceted approach to finding how and why a product failed and involves an in-depth investigation of the circumstances surrounding the failure and discovery of relevant background information, including but not limited to the type of application, environmental factors, service life, and pertinent design information.
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Data Analysis Software
APP ClearView
APP ClearView™ is the ideal data analysis software for engineeres and managers that need system information and answers quickly. It has a wide varity of graphics, math functions, reports, and file manipultion features that allow the user to easily navigate through their data. It supportsimporting of indisustry standrad formats such as COMTRADE (Common Data Transient Data Exchange) version 1996, 1997, and 1999.
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Transient Stability Analysis
I*SIM
PTW I*SIM is a program for transient stability analysis. It is designed to simulate system response during and after transient disturbances such as faults, load changes, switching, motor starting, loss of utility, loss of generation, loss of excitation, and blocked governor events. I*SIM is designed to study today's most challenging simulation problems in one convenient and easy-to-use program.
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Static and dynamic analysis
MEMS
Static and dynamic analysis and visualization are critical parts of the test and development process for MEMS microstructures in order to characterize surface metrology and measure in and out of plane motions. The PS4L Adaptive Architecture is ideal for configuring a system to perform tests to very specialized requirements of the MEMS customer. MEMS customers often require vacuum probing, which is available in semiautomatic and fully automatic configurations.
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Microsectional Analysis (Cross-Section)
Microsectional Analysis remains the most widely accepted means for analyzing the PCB/PWB plated through-hole integrity. A PCB is a combination of different types of materials such as glass, aramid fibers, kapton, copper, acrylic adhesive, epoxy, polyimide, Teflon, and solder. Each of these materials has a different relative hardness and, coupled with that of the mounting media such as epoxy or acrylic, makes the PCB microsection one of the most difficult to perform.
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Data Acquisition & Analysis
Avionics Interface Technologies
We provide fully integrated avionics data bus and high speed network analyzer and data acquisition systems. Combining our extensive product catalog of Avionics interface modules, and our easy to use Analyzer software applications, with our Engineering Expertise, we are able to satisfy a wide range of avionics network data capture and analysis requirements with our COTS products or with customized solutions.
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Mainframe Debugging and Analysis
Xpediter
Xpediter is Compuware's mainframe application interactive debugging and code coverage solution. When an application experiences a problem, developers need to get into an interactive test session to solve the issue. However, complex setup procedures make this a time-consuming step and delay the resolution process.Compuware's mainframe debugging and analysis tool Xpediter enables developers to get into an interactive test session with minimal effort and quickly move applications into production with greater confidence.
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Probing & Analysis Adapters
No matter how well designed a circuit is, there is almost always a need to hook up test instruments to it to verify function, look for bugs, or baseline performance. As IC packages become smaller and pin counts grow this becomes harder and harder. probing adapters are required to alleviate this de-bug problem. Many different types of adapters fall into the test and debug category. The common feature is that they bring the signals of an IC out to a format that is easy to interface with test and analysis equipment.
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Failure Analysis – Materials
Failure analysis – materials is the investigation into the background or history of a sample, or an event, to determine why a particular failure occurred. A product failure may include premature breakage, discoloration or even an unexpected odor. It is useful to know if this failure is a new, unique occurrence or if it has been an ongoing issue. The investigation can involve analyzing the sample as it currently exists and extrapolating from that data what may have caused the failure. A sample of the “good” vs. “bad” product may also be useful for comparison purposes.
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Optical Forming Analysis
ARGUS
The forming analysis system ARGUS supports the optimization of the sheet metal forming process taking into account the correct material selection and the optimization of tools. This a decisive factor for competitiveness, particularly in the automotive industry. ARGUS provides full-field results with high local resolution for small as well as for large components. Therefore, it is ideal for numerous sheet metal forming tasks like: detection of critical deformation areas, solving complex forming problems, optimization of forming processes, verification of tools as well as verification and optimization of numerical simulations.
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Vapor Sorption Analysis
Vapor Sorption Analysis is a technique in which a sample is subjected to varying conditions of humidity and temperature, and the response of the sample is measured gravimetrically. Understanding the effects of water content on structure and properties is critical in the development, processing and end use of a broad spectrum of materials. TA Instruments offers the most sensitive, versatile, and productive moisture sorption analyzers on the market. The Discovery SA combines a high-sensitivity thermobalance, innovative humidity control chamber, and reliable autosampler. Innovative technology combined with our unparalleled reputation for service and support make TA Instruments the clear choice of scientists worldwide for vapor sorption studies.
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Finite Element Analysis
This useful tool will minimize induced stress on the board under test. The 3-D software will account for all components populated on the board, and probe force and push rod locations on the fixture. It uses this information to simulate the actual test to determine which area of the board is enduring too much stress and then provide suggestions to correct the situation. A damaged board could cost upwards of thousands of dollars and lost time. Including Board stress analysis in your test strategy is an excellent way to insure that your new test comes up fast, and without any stress related board damage.
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Thermal Testing And Analysis
Response Dynamics Vibration Engineering, Inc.
We have consulted on thermal issues ranging from conduction issues in TECs, thermal radiation modeling, and countless air cooled system issues relating to system performance, vibration, and acoustics noise. We use a wide array of thermocouple instrumentation, thermal imaging, flow measurements, as well as finite element analysis and analytic modeling to measure, design, and debug thermal and related issues. We often work on customer products in our Response Dynamics lab where we characterize the system, engineer solution options, and prototype solutions. We then work with the customer to work the winning solution into their quality control and manufacturing process.
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Materials And Chemical Analysis
Anderson Materials Evaluation, Inc.
Materials characterization, failure analysis, quality control, and materials and process development services are offered. Our analytical techniques allow us to assess elemental and chemical material composition, thermal properties, coating thickness, electrochemical properties, surface chemistry, surface wetting, corrosion rates and pitting potentials, contamination and degradation problems, metallography, fractography, phase transitions, static coefficient of friction, adhesive bonding strength and causes of adhesive bonding failures, surface tension and surface energy, tensile and compressive strength, bend deflection, lapshear strength, elasticity properties, UV and visible light absorption and reflection, density and porosity, and many other material properties integral to improving your products.
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Board Stress Analysis
Board stress analysis is an increasingly critical part of the test fixture build process today. Probe densities under BGA devices put tremendous pressure onto the solder joints of these devices. If the fixture is not designed properly, immediate damage can occur to the BGA’s, or even more devastating, future damage, which creates field failures. We can provide strain testing before shipping your fixture to insure that there are not excessive forces placed on your BGA parts. With the use of National Instruments Strain equipment, and tri-directional rosettes, we cycle test the board/fixture and measure and record the amount of strain from each corner of each BGA. Any over limit conditions are corrected before shipment. This service insures that your products will not be damaged at ICT, and help to reduce field failures from damaged components, compromised solder joints, or lifted pads.
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Control Coupling Analysis
VerOLink
VerOLink (Verify Object Linking) is a verification tool (DO-178B, DO-330, IEC 61508 and ISO 26262) that helps satisfy the control coupling objective. Control coupling provides a measure of the correctness of the integration of many independently compiled object files linked to form a single executable image. Even if all requirements based tests are performed on the integrated executable image and the coverage is measured at the object code level without instrumenting the code, the possibility still exists that the linker could have linked a function call incorrectly. VerOLink is used to provide this final check. Verification of the code integration is fully automatic with VerOLink. The tool analyzes the executable image to find all functions and all function calls and their locations in the object files. By analyzing the object files used in an application, VerOLink verifies that the function calls within an executable image have been resolved correctly when the linker combined the object files
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Data Acquisition & Analysis
American Environments Co., Inc.
American Environments facilities are equipped with automated data acquisition systems.
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Data Analysis Software
PV II
Software to communicate and display data from PQPro™ Power Quality Analyzer.Can connect wirelessly (Bluetooth) to multiple instruments.View real time data numerically, vector diagrams and analog meter format.View downloaded data in graphical form.Multiple graphical pages can be open at the same time.Graphs can be annotated with data boxes and text bubbles.Graphs can be pasted in to Word or Excel files.Export data in CSV format.Export data in PQDIF format.Export section of data file to PV II format.Generate reports with both graphical and tabular data.
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Data Analysis Software
QUICK LOG
Adopt the leading interactive interface in industry· Fast parameter set and graphic operation interface· Automatically recognize connected instrument, more vivid· Unique auto mode provides immediate report once connected· Support high and low limit alarms statistics· Upport unchangeable report file in PDF format
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Enable Non-Invasive Analysis
Sparklike Handheld™
Sparklike Handheld™ is practical and quick method to test IG gas concentration. Technology is based on plasma emission spectroscopy. A high voltage spark is launched in the IG unit's cavity causing a light emission which is observed and analyzed further.
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ESPI Analysis Application
TP601010
First released by Intel in June 2013, the Enhanced Serial Peripheral Interface (“eSPI”) is designed as a replacement for the Low Pin Count (“LPC”) bus. eSPI supports communication between Embedded Controller (EC), Baseboard Management Controller (BMC), Super-I/O (SIO) and Port-80 debug cards. eSPI was available in the Sky Lake chipset (2015) and is available in the Kaby Lake [current] chipset. Cannonlake will support eSPI and is slated for release the second half of 2017. Icelake is scheduled for release in 2019 and it will mark the first chipset when eSPI becomes mandatory.
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Harmonic Analysis Software
HI_WAVE
HI_WAVE simulates resonance and harmonic distortion in industrial, commercial, and utility power systems.
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Measuring and Analysis Software
With over 10 years of experience, IVS-KA6000 PV Test IV software has been developed by Enli Technology. IVS-KA5000, the previous generation, has more than 500 users. IVS-KA6000 is evolved from IVS-KA5000 based on users’ feedback and experience. IVS-KA6000 can control a variety of SMUs and perform data collection of current and voltage based on setting parameters by users. The formulas and algorithms of IVS-KA6000 are …
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Mercury Porosimetry Analysis
AutoPore V
The AutoPore V Series Mercury Porosimeters can determine a broader pore size distribution more quickly and accurately than other methods. This instrument also features enhanced safety features and offers new data reduction and reporting characteristics of your material.
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Non Destructive Analysis
The submicron resolution of a submicron focus X-ray tube and digital image detection offers in 2D and Oblique View with High Magnification imaging mode high resolution X-ray images. A 3D image of the sample can be reconstructed from multiple image recordings during a 360° rotation of the sample. Virtual any cross section can be viewed at an offline workstation. This mode is a strong tool for multi-material components.