Showing results: 1831 - 1845 of 3415 items found.
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Part No. InPD1012-30 -
Teledyne Defense Electronics Relays & Coax Switch
Non-terminated SPDT Indium Phosphide Active RF Switch • 3mm x 3mm x 1mm package size • 100ns switching time• Monolithic solid-state switch with no mechanical wear• Test board with K-connectors can be providedDC-30GHz
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Part No. InPD1012-14 -
Teledyne Defense Electronics Relays & Coax Switch
Non-terminated SPDT Indium Phosphide Active RF Switch • 3mm x 3mm x 1mm package size • 100ns switching time• Monolithic solid-state switch with no mechanical wear• Test board with K-connectors can be providedDC-14GHz
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National Technical Systems
Conductive Anodic Filament (CAF) testing helps to determine the reliability of a printed circuit board (PCB) laminate material or a finished product. With conductor spacing and overall part sizes getting smaller and smaller, the necessity for this test is increasing.
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AXI X Series -
Nordson Corporation
The X-platform series is a dedicated high speed inline automated X-ray inspection system for the inspection of PCB-assembly boards for single/multipanels or samples in trays. The system offers market leading inspection speed and is ideal for low-mix high-volume production environment.
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PXIe3004 -
VX Instruments GmbH
The PXIe3004 is a peripheral slot board for PXI Express systems, equipped with a quad port USB 3.0 compliant host controller. All four USB connectors are available from the front panel for attachment of external USB devices.
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FFR1000 -
Rhesca Co., Ltd.
This equipment is designed to bend a flexible printed circuit board, which has a high degree of freedom and versatility, and at that time, apply a load to the bending point at the initial stage or each time, and repeat bending and unfolding to confirm the durability.
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thermVIEW -
Advanced Thermal Solutions, Inc.
thermVIEW is a high resolution liquid crystal thermography system for cost effective temperature measurement of electronic circuit boards, micro circuits, hybrid components and integrated circuits. One micron level* thermal mapping of electronic devices.
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VI Control Systems Ltd.
Group3 Control is a fiber optically linked control system using distributed I/O modules called Device Interfaces, or DIs. A DI is positioned at the point to be controlled and the appropriate I/O boards added to it from the list below.
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CHAMP-FX4 -
Curtiss-Wright Defense Solutions
Integrating FPGAs into any system can be challenging: from ensuring your boards will meet performance needs in the most rugged conditions to creating a basic framework that will last despite growing radar system, EW & SIGINT application needs.
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HW Test
REBOUNDER test kits feature two separate "Co-Active Seals", "Quick Twist" Locking Guide Pins, and boards constructed of fine weave G10/FR4, increasing testing reliability and accuracy while simplifying finishing, debugging, and maintenance.
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Kontron
Hartmann Electronic’s cPCI 3U RA Series features a sleek board design based on High Speed Design concept with exceptionally low-level reflection. The featured reflection levels are achieved by means of uniform signal surge impedance.
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4U 42HP -
Kontron
The Hartmann CompactPCI 4U system platform provides an intelligent, practical packaging solution for high-performance processors. This versatile desktop model provides a 7 slot 3.3 or 5V I/O 3U cPCI backplane for vertical mounting of boards.
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117EXT6116-0XXX -
ELMA Electronic, Inc.
The cPCI extender boards are designed to bring a circuit card completely out of a card cage or enclosure so that it can be tested or debugged on each 2mm HM connector in P1-P5. Each line in rows A-E can be isolated with the DIP switches.
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117FFE6018-0XXX -
ELMA Electronic, Inc.
The cPCI extender boards are designed to bring a circuit card completely out of a card cage or enclosure so that it can be tested or debugged on each 2mm HM connector in P1-P5. Each line in rows A-E can be isolated with the DIP switches.
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D-Frame -
ELMA Electronic, Inc.
Elma’s D-Frame engineering development platform combines a rich feature set with portability and easy access for embedded system design efforts. It is ideal for activities such as board design, application development, data flow analysis, troubleshooting and demonstration.