Showing results: 3211 - 3225 of 3398 items found.
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PIRT1280A1-12 -
Princeton Infrared Technologies, Inc.
This lattice matched InGaAs 2D SWIR focal plane array (FPA) allows for high resolution SWIR imaging at high frame rates >90fps. This small pitch array, 12μm, combined with the high quantum efficiency of the lattice matched InGaAs arrays enables impressive imaging in the SWIR band. It boasts an on board 14-bit A/D with very low read noise of <45e- per read. Princeton Infrared Technologies, Inc. offers this low power SWIR array by itself or in a TEC cooled package. It is also incorporated with camera electronics for a complete solution.
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ScanExpress TPG -
Corelis, Inc.
To deliver a product meeting the highest standards of quality and reliability, design engineers and test engineers alike must maintain test capabilities throughout the entire product life cycle, from prototype to manufacturing. Automation in test generation is essential to ensure that tests keep up with the rapid development of modern products.The ScanExpress TPG™ Intelligent Test Pattern Generator Software provides a highly advanced, automated boundary-scan test design environment—perfect for quick and efficient creation of complete boundary-scan tests for all IEEE-1149.1 and IEEE-1149.6 compliant circuit boards.
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GX5733 Series -
Marvin Test Solutions, Inc.
The GX5733 is a 3U modular digital I/O card that offers up to 128 I/O channels. Designed for ATE, data acquisition, or process control systems where a large number of discrete I/O channels are required, the GX5733 offers the highest channel density and flexibility in the industry for a single-slot, 3U PXI plug-in board. 96 channels support TTL levels and an additional 32 I/O channels can be customized by installing one of Marvin Test Solutions' GX57xx series I/O modules. Alternatively, the remaining port can be configured to support 32 TTL channels.
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JEMIO -
StarTest
The JTAG External Modules JEMIO™ for Cluster test are intended to provide test access to off-board signals that otherwise could not be accessed by a JTAG test system. For many designs, Boundary-Scan has adequate access to on-board signals, but signals that go off the board often cannot be tested by a JTAG tester. By adding JTAG access to these off-board signals, JEMIO™ modules can increase the board's JTAG test coverage, possibly reducing the need for implementing another test method or for developing alternative tests to reach the required level of test coverage.
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KT-200SG -
Kast Eng Co. LTD.
This test instrument stands for the EMI(Electro Magnetic Immunity) ability test to the electric devices, electronic circuit boards & electric equipments. Recently this instrument is widly used in many companies in Korea & other countries to test the immunity to thier products-power supply, drive PCBs, communication systems, LCD display panels whether they are safe or not against the impulse & noise.All for the purpose, of this object, it generates 4 ~ 5 kinds of different impulse test waveforms.Output test voltage level : 5 ~ 200 V ImpulseOutput voltage polarity : Positive, NegativeType of waveforms
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MS 1303 -
Meltronics Systemtech
The Railway signaling unit is used to receive the input signals from the field for validating and clearing route for trains. After receiving the signals, signals are isolated and various tests are done inside the system to ensure the received signals reliability and produce clearance signal to railway line. For security reasons card signature has been given to each card in the system. System consists of digital input modules, digital output module, digital read back module, RS232 interface with 80486 processor board. It is an ISA Bus Back plane based system.
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Environment Associates Inc.
The purpose of Pyroshock (pyrotechnic shock) testing is to simulate the high-frequency, high-magnitude shock pulse experienced by an explosive event (such as an impact on a military tank or an explosive deployment charge). Pyroshock testing can expose failures in electronic components that are sensitive to high-frequency pyroshock energy. Common failures include: relay and crystal oscillator chatter, detachment of larger components from the circuit board, hard failures of small circuit components, and the dislodging of contaminants, which cause short circuits. Severe damage to crucial components used in space or in the military can produce critical results, such as loss of life, due to malfunction.
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Cincinnati Sub-Zero Products
We provide a large selection of thermal shock chambers to accommodate various types of product testing. Thermal Shock Chambers perform tailored environmental stress screening of component and board electronic assemblies. Our unique chamber design transfers product between two extreme temperature-controlled chambers, passing equal volumes of high velocity conditioned air over the product and resulting in rapid product temperature changes. The induced thermal stresses can reveal hidden manufacturing defects in electronic sub-assemblies and other components by the expansion and contraction of critical parts.
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COM Express Type 6 Starter Kit Plus -
ADLINK Technology Inc.
The Type 6 Starter Kit Plus consists of a COM Express Type 6 module with ATX size Type 6 reference carrier board that offers one PCI Express x16 slot with proprietary pinout for DDI adapter card that convert DDI signal to DP or HDMI signal, one PCI Express graphics x16 slot, one PCI Express x4 slot, three PCI Express x1 slots, Serial ATA, VGA, LVDS, USB3.0/2.0, Gigabit LAN and Super I/O. All necessary cables are included.
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Environment Associates Inc.
We service most industry segments with harsh environment, salt fog corrosion testing.If your product is coated or painted for the marine, automotive or military industries, we are equipped to provide accredited testing within multiple chambers.We provide ASTM sample preparation for coated and painted articles to ensure that your test is performed correctly.We also provide custom configurations with varied salt concentrations and temperatures for many customers with products that are used in unique environments. Products like circuit boards, electronic devices and sensors may all have specialized testing requirements.
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AVT-853 -
Advanced Vehicle Technologies, Inc.
Fully capable interface with room to grow in functionality and capability. Available as an OEM unit; board only, or in a small enclosure. Ethernet connection to host computer. Protocols supported; CAN, 2-wire (CAN-C or ISO 11898 or J1939); CAN, GM Single Wire CAN (SWC); J1850 VPW, GM Class 2, 1x and 4x modes, block transfers; CAN ISO 15765 support (multi-frame messaging). K-line, LIN (several versions). 3 channels of analog to digital input. User programmable automatic features. User accessible EEPROM with security features.
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Santa Barbara Infrared, Inc.
The FPA Test Set (FPATS) interface to the detectors under test (DUT’s) is via a custom pedestal plate which provides both a conductive heat path to both the individual DUT’s as well as the field of view limiting aperture plate. This custom pedestal plate protrudes through the customer provided DUT interface printed circuit board (PCB) and makes physical contact with the rear of the DUT packages and the aperture plate when the FPATS is in the closed position. The pedestal plate is mounted to the ambient source plate and its temperature is actively driven by this subsystem.
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GX5733 -
Terotest Systems Ltd.
The GX5733 is a 3U modular digital I/O card that offers up to 128 I/O channels. Designed for ATE, data acquisition, or process control systems where a large number of discrete I/O channels are required, the GX5733 offers the highest channel density and flexibility in the industry for a single slot, 3U PXI plug-in board. 96 channels support TTL levels and an additional 32 I/O channels can be customized by installing one of Marvin Test Solutions' GX57xx series I/O modules. Alternatively, the remaining port can be configured to support 32 TTL channels.
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GX3500 -
Terotest Systems Ltd.
The GX3500 is a user configurable 3U FPGA PXI card which offers 160 digital I/O signals for specific application needs. The card employs the Altera Cyclone III FPGA which can support clock rates up to 150 MHz and features over 55,000 logic elements and 2.34 Mb of memory. The 3U PXI FPGA card GX3500 can also accept an expansion card assembly which can be used to customize the interface to the UUT – eliminating the need for additional external boards which are cumbersome and physically difficult to integrate into a test system.
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Ironwood Electronics
Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
