Showing results: 3226 - 3240 of 3415 items found.
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HD-T1 -
Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
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TPCE278 -
TEWS Technologies GmbH
The TPCE278 is a standard height PCI Express Revision 3.0 compatible module that provides one slot for a single-width XMC module used to build modular, flexible and cost effective I/O solutions for all kinds of applications like process control, medical systems, telecommunication and traffic control. The TPCE278 is a versatile solution to upgrade well known XMC I/O solutions to the PCI Express signalling standard. The PCI Express x4 link from the host board to the XMC module is enhanced by a PCIe Gen3 Redriver, allowing safe operation of XMC modules on PCIe mainboards.
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HGM-MZ -
IMR Environmental Equipment, Inc.
The Multi-Zone Monitor provides continuous detection of refrigerant gas levels in up to 16 separate test zones and can be fitted with an optional two channel 4-20 mA current loop board for connection to remote monitoring equipment. Multi-Zone monitors retain a log of previous readings that can be easily accessed for analysis. Four relay contacts are provided that can be programmed to trigger external alarm devices in the event of a system fault, or if a leak (small), spill (medium) or evacuation (large) level of gas is detected, while audible and visual front panel indicators show alarm and fault conditions.
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NEOSEM TECHNOLOGY INC
The N3500 is Neosem Technology’s fourth generation memory test system. Specifically designed for Flash Components and Flash Cards, the N3500 tester-on-a-board architecture targets the broadest range of DUT technologies in various form factors and packages. Each Tester Board (or “Blade”) contains 288 I/O pins and 32 DPS supplies. Up to 64 Blades populated in one test head can test over 2000 DUTs in parallel. Neosem Technology’s high parallel DUT count architecture, combined with low capital cost, provides the absolute lowest HVM cost of test.
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WT-100 -
Thermal Engineering Associates, Inc.
The WT-100 Forced Convection (Moving Air) Wind Tunnel is designed in accordance with the EIA/JEDEC JESD51-6 standard for thermal characterization of semiconductor packages and devices. The vertical design minimizes laboratory floor space requiements. Air is drawn in at the bottom and exhausts at the top. The test section is large enough to accommodate the largest JEDEC and SEMI thermal test boards. Air velocity can be adjusted over the range of 0.5 to 5 m/s; air velocity is monitored with an included hot-wire anemometer connected to a digital display. A Type-T thermocouple is mounted in the test section for monitoring the moving air temperature.
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PIRT1280A1-12 -
Princeton Infrared Technologies, Inc.
This lattice matched InGaAs 2D SWIR focal plane array (FPA) allows for high resolution SWIR imaging at high frame rates >90fps. This small pitch array, 12μm, combined with the high quantum efficiency of the lattice matched InGaAs arrays enables impressive imaging in the SWIR band. It boasts an on board 14-bit A/D with very low read noise of <45e- per read. Princeton Infrared Technologies, Inc. offers this low power SWIR array by itself or in a TEC cooled package. It is also incorporated with camera electronics for a complete solution.
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ScanExpress TPG -
Corelis, Inc.
To deliver a product meeting the highest standards of quality and reliability, design engineers and test engineers alike must maintain test capabilities throughout the entire product life cycle, from prototype to manufacturing. Automation in test generation is essential to ensure that tests keep up with the rapid development of modern products.The ScanExpress TPG™ Intelligent Test Pattern Generator Software provides a highly advanced, automated boundary-scan test design environment—perfect for quick and efficient creation of complete boundary-scan tests for all IEEE-1149.1 and IEEE-1149.6 compliant circuit boards.
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GX5733 Series -
Marvin Test Solutions, Inc.
The GX5733 is a 3U modular digital I/O card that offers up to 128 I/O channels. Designed for ATE, data acquisition, or process control systems where a large number of discrete I/O channels are required, the GX5733 offers the highest channel density and flexibility in the industry for a single-slot, 3U PXI plug-in board. 96 channels support TTL levels and an additional 32 I/O channels can be customized by installing one of Marvin Test Solutions' GX57xx series I/O modules. Alternatively, the remaining port can be configured to support 32 TTL channels.
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JEMIO -
StarTest
The JTAG External Modules JEMIO™ for Cluster test are intended to provide test access to off-board signals that otherwise could not be accessed by a JTAG test system. For many designs, Boundary-Scan has adequate access to on-board signals, but signals that go off the board often cannot be tested by a JTAG tester. By adding JTAG access to these off-board signals, JEMIO™ modules can increase the board's JTAG test coverage, possibly reducing the need for implementing another test method or for developing alternative tests to reach the required level of test coverage.
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KT-200SG -
Kast Eng Co. LTD.
This test instrument stands for the EMI(Electro Magnetic Immunity) ability test to the electric devices, electronic circuit boards & electric equipments. Recently this instrument is widly used in many companies in Korea & other countries to test the immunity to thier products-power supply, drive PCBs, communication systems, LCD display panels whether they are safe or not against the impulse & noise.All for the purpose, of this object, it generates 4 ~ 5 kinds of different impulse test waveforms.Output test voltage level : 5 ~ 200 V ImpulseOutput voltage polarity : Positive, NegativeType of waveforms
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Environment Associates Inc.
The purpose of Pyroshock (pyrotechnic shock) testing is to simulate the high-frequency, high-magnitude shock pulse experienced by an explosive event (such as an impact on a military tank or an explosive deployment charge). Pyroshock testing can expose failures in electronic components that are sensitive to high-frequency pyroshock energy. Common failures include: relay and crystal oscillator chatter, detachment of larger components from the circuit board, hard failures of small circuit components, and the dislodging of contaminants, which cause short circuits. Severe damage to crucial components used in space or in the military can produce critical results, such as loss of life, due to malfunction.
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Cincinnati Sub-Zero Products
We provide a large selection of thermal shock chambers to accommodate various types of product testing. Thermal Shock Chambers perform tailored environmental stress screening of component and board electronic assemblies. Our unique chamber design transfers product between two extreme temperature-controlled chambers, passing equal volumes of high velocity conditioned air over the product and resulting in rapid product temperature changes. The induced thermal stresses can reveal hidden manufacturing defects in electronic sub-assemblies and other components by the expansion and contraction of critical parts.
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COM Express Type 6 Starter Kit Plus -
ADLINK Technology Inc.
The Type 6 Starter Kit Plus consists of a COM Express Type 6 module with ATX size Type 6 reference carrier board that offers one PCI Express x16 slot with proprietary pinout for DDI adapter card that convert DDI signal to DP or HDMI signal, one PCI Express graphics x16 slot, one PCI Express x4 slot, three PCI Express x1 slots, Serial ATA, VGA, LVDS, USB3.0/2.0, Gigabit LAN and Super I/O. All necessary cables are included.
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Environment Associates Inc.
We service most industry segments with harsh environment, salt fog corrosion testing.If your product is coated or painted for the marine, automotive or military industries, we are equipped to provide accredited testing within multiple chambers.We provide ASTM sample preparation for coated and painted articles to ensure that your test is performed correctly.We also provide custom configurations with varied salt concentrations and temperatures for many customers with products that are used in unique environments. Products like circuit boards, electronic devices and sensors may all have specialized testing requirements.
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Columbia Elektronik AB
Testing is more than just finding defects on Printed Circuit Boards. It is also about how to predict defects before they occur. True economy can only be achieved when you see testing as an integrated part of manufacturing. To achieve this we provide Advanced Diagnostic Tools and Electronic Manufacturing Systems (EMS) that integrate testing with design, manufacturing and repair. Columbias expertise covers all aspects of PCB and sub-assembly production testing utilizing a full range of modern technologies: SPI, AOI, ICT, functional analog/digital testing and flying probe testing.
