Showing results: 3271 - 3285 of 3398 items found.
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AIM GmbH
AIM’s Fibre Channel test, simulation and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with one dual core RISC processor per port, massive and scalable DDR3 memory and IRIG-B time encoder/decoder functions are standard. The new ultra high performance intelligent 4-lane PCIe 2.0 interface modules offer 2 ports with full function test, simulation, monitoring and analyzer functions for Fibre Channel networks. The dual core processor provides onboard processing and data transfer capabilities for the most demanding Fibre Channel applications including upper layer protocol support done on board level. Large and high data throughput DDR3 RAM is accessible for the onboard processor as is a high performance FPGA implementing the customized Fibre Channel interfaces enabling the board to analyze incoming and modify outgoing data in real time. Each module provides 2 Fibre Channel compliant full duplex ports, implementing the full link level services. SFP cages make it suitable for different media types as optical or electrical network technologies. Ports operate either in Traffic Simulator or Analyzer/Monitor mode with support for port related Frame Statistics. Sophisticated packet capturing mechanism and monitoring features are complimented with powerful triggering and filtering capabilities.
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MMB501 -
Axiomtek Co., Ltd.
The MMB501 is powered by the LGA1151 socket 7th/6th generation Intel® Core™ i7/i5/i3, Pentium® and Celeron® processors (formally codename: Kaby Lake/Skylake) with Intel® Q170 chipset. The MMB501 supports four high bandwidth 288-pin DDR4-2133/2400 with a memory capacity up to 64GB. The industrial-grade micro ATX motherboard is expandable with one PCIe x16 slot, two PCIe x4 slots, one PCI slot and one full-size PCI Express Mini Card slot. Moreover, the embedded board supports triple-display via DisplayPort, HDMI, DVI-D and VGA interfaces. Furthermore, this outstanding multi-function embedded motherboard is integrated with the Intel® HD Graphics 530/510 to deliver stunning UHD 4K resolution and fast 3-D and video playback for graphics-intensive applications. To meet the distinct needs from users, there are six SATA-600 with RAID 0/1/5/10, six USB 3.0, five USB 2.0, four RS-232 ports, two RS-232/422/485 ports, one DisplayPort, one DVI-D, one HDMI and one VGA, as well as has two Gigabit Ethernet ports with Intel® i219LM and Intel® i211AT controllers. To ensure stable and reliable operation, the high-performance Intel® Core™-based industrial micro ATX motherboard supports a watchdog timer and hardware monitoring features. Furthermore, this new embedded board runs well with Windows® 7, and Windows® 10 operating systems.
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SHB140 -
Axiomtek Co., Ltd.
The SHB140 PICMG 1.3 single board computer is based on the 14nm 6th generation Intel® Core™ i7/i5/i3 processors in the LGA1151 package with Intel® Q170 Express chipset (codename: Skylake). The high performance SHB-based CPU card comes with two DDR4 2133/2400 MHz up to 32GB and six SATA-600 ports with RAID 0/1/10/5. Combined high-bandwidth PCI Express for frame grabbing and conventional PCI expansion for motion capture, the SHB140 is an optimum solution for machine vision and automation applications. This high performance PICMG 1.3 slot CPU card also features an integrated Intel® AMT 11 and TPM 1.2 for higher security and easier maintenance.
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Instron
These three zone resistance wire wound furnaces are of split construction to facilitate fast and easy loading of a pre-assembled specimen train. The case is constructed from stainless steel with aluminium and hardened insulation board end plates. The optional front cut-out allows the use of side-entry high-temperature extensometry. Adjustable stainless steel latches keep the furnace halves locked together during use, but are then easily opened once testing is complete. The furnace is available with optional heavy duty brackets or mountings, which attach to a wide range of testing systems. An extensive range of standard controllers is available to suit most test regimes. Custom variants can be specified should the standard range not include a suitable unit.
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Test Coach Corporation
Test Coach has been delivering the highest quality in-circuit test programs since 1998. Our engineers have the education, experience and expertise needed to solve your most challenging test requirements. We partner with our customers to provide comprehensive test solutions, including consulting on: design for test, recommendations on the best hardware and software options to implement, test strategy, and long term planning for multi board projects. Our expertise allows us to really understand customer requirements, so that quotes are accurate and timely. However, we also understand that sometimes projects can change scope. At Test Coach, we have the flexibility to adapt to changes with as little impact to delivery as possible.
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Curtiss-Wright Defense Solutions
Our XMC mezzanine cards provide an easy way to add processing power and meet performance requirements within the most demanding size, weight, and power (SWaP) constraints. Create a zero-slot solution by mounting the mezzanine on a graphics or FPGA card or on the power supply of a Curtiss-Wright 3U or 6U computing system. Alternatively, you can double the density of a single-slot solution using any 3U or 6U VPX card with an available XMC mezzanine site, such as a single board computer (SBC), digital signal processing (DSP), or VPX carrier card. Our XMC processor modules can even be used as standalone cards for applications on small unmanned aerial vehicles (UAVs) and robots where a VPX carrier card is not required.
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TacFLIR® 280-HDEP -
Teledyne FLIR
The TacFLIR 280-HDEP is an essential system for ground vehicle surveillance and fixed installations. With an all-new stabilized payload assembly for enhanced reliability, the TacFLIR 280-HDEP is ready for a variety of land missions, and the modular and scalable control electronics unit (CEU) is capable of hosting powerful video processing and Aided Target Recognition (AiTR), as well as third-party algorithms. Designed to meet the rigorous demands of military operations, the system delivers best-in-class EO/IR imagery and optional Display Interface Boards (DIB) which allow the operator to stream up to four independent video streams. In addition, there is also a removable terabyte hard drive w/DVR to record over 80 hours of compressed video and 250 screen captures.
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NetUSB-1149.1/E -
Corelis, Inc.
The NetUSB-1149.1/E (4 TAPs) is an advanced USB 2.0 and LAN-based controller that can be used in the testing and/or in-system programming (ISP) of devices, boards, or systems compliant with the IEEE-1149.1 standard. The NetUSB-1149.1/E controller supports concurrent (gang) testing and in-system programming of CPLDs and Flash devices at TCK rates of up to 80MHz.The controller connects to the computer either through the USB interface or LAN interface for easy installation at nearby or remote locations. Other features include signal delay compensation for long cable lengths to the UUT, TAP signals, and GPIO discrete signals which are individually programmable from 1.25V to 3.3V, programmable slew rate control and pre-power up test for shorts between power and ground traces on the UUT.
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VP4P201 -
LinkedHope Intelligent Technologies Co.,Ltd.
VP4P201 is a 6U VPX portable platform compliant with VITA46.0 specification. With the air cooling design and VPX modular design on the chassis, VP4P201 has excellent heat dissipation performance. VP4P201 is manufactured with high-impact Al alloy structure, and its surface is processed by hard anodic oxidation.VP4P201 is equipped with a 6U 5-slot Single-Star VPX backplane that has 4 payload slots and 1 switch slot. The connector on VP4P201 can realize data exchange between data planes and control planes of 4 payload boards. Besides, there is a 460W ATX AC/DC Power installed in the chassis.VP4P201 is highly applicable in measurement and testing. As a standard package, VP4P201 can also work as a traditional CPCI or PXI chassis by the replacement of the backplane.
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Model 8256 -
Pentek, Inc.
- Video: AOC 2021 Mercury's Model 8256 SOSA Aligned Dev. Platform and RFM3202 Microwave Transceiver- Video: Model 8256 3U VPX SOSA Aligned Development Platform, multi-vendor operation demonstration- Video: Model 8256 3U VPX SOSA Aligned Development Chassis- Developed in alignment with the SOSA™ Technical Standard- Ideal development platform for Pentek's- Model 5550 8-Channel A/D & D/A Zynq UltraScale+ RFSoC Processor - SOSA Aligned 3U VPX- Model 5553 8-Channel A/D & D/A Zynq UltraScale+ RFSoC Processor - SOSA Aligned 3U VPX- 8-slots provide space for a range of acquisition and processing boards- Optional rear panel RF and optical connections- Compatible with the Quartz product family
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PICO840 -
Axiomtek Co., Ltd.
The PICO840 ultra-small Pico-ITX embedded SBC supports the quad-core Intel® Atom® processor (code name: Bay Trail-I) and supporting DDR3L-1066/1333 MHz system memory up to 8 GB. Considering different environments, this industrial-grade Pico-ITX mainboard is built to withstand extreme temperature, ranging from -40°C to +70°C (-40°F to +158°F). Moreover, with superior integration and power efficiency, this compact size single board computer enables system developers and OEMs to create smaller, lighter, quieter devices than ever and embrace the new possibilities across POS systems, mobile medical monitor, compact panel PCs as well as multiple embedded computer, system and appliance segments.
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MVTec Software GmbH
In the industrial environment, especially in digitalized, automated production scenarios, more and more so-called embedded systems are being used. Embedded devices are small, with compact dimensions, highly efficient, and generate little waste heat. Therefore, they are also suitable for limited space conditions. Due to often harsh environmental conditions, they must be particularly robust and resistant to external influences like massive dust accumulation, strong vibrations, and high humidity or even direct contact with water. Typically, embedded devices are handhelds, smartphones, tablets, vision sensors, smart cameras, smart sensors and single board computers. If the systems have integrated machine vision software, they can be used for a wide range of image processing applications. This is known as embedded vision.
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IMB211 -
Axiomtek Co., Ltd.
The IMB211 is industrial-grade ATX motherboard with a full-range of integrated peripherals for general industrial and embedded applications. The IMB211 is based on 4th Generation Intel® Core™ i7/i5/i3/ Celeron® processors in LGA1150 socket with Intel® Q87 Express chipset. Four 204-pin DDR3-1333/1600 slots provide a maximum memory capacity of 32 GB to improve overall system performance. This industrial-grade high performance motherboard also supports Intel® Active Management Technology 9.0 (iAMT 9.0), SATA RAID, and triple-display capability through DisplayPort, HDMI and DVI-I interface. The board helps users to deploy more responsive, high-performance, graphic performance systems for advanced communication, gaming, industrial and automation applications.
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PICO500 -
Axiomtek Co., Ltd.
The PICO500, an extreme compact pico-ITX embedded board, supports the latest 14nm 6th generation Intel® Core™ i7/i5/i3 processors (Codename: Skylake-U). The tiny PICO500 is equipped with one DDR4 SO-DIMM with up to 16 GB memory capacity. Integrated with Intel® HD graphic engine, the Pico-ITX motherboard supports HDMI and 18/24-bit dual channel LVDS that delivers a whole new level of Ultra HD 4K visual experiences. Its Pico-ITX form factor allows for an extremely compact performance system; meanwhile, the PICO500 is built to withstand wide temperature conditions, ranging from -20°C to +70°C (-4°F to +158°F) with active thermal solution.
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Lepton -
Pure Engineering, llc
The FLIR Lepton™ is the most compact longwave infrared (LWIR) sensor available as an OEM product. It packs a resolution of 80 × 60 or 160x120 pixels into a camera body that is smaller than a dime. This revolutionary camera core is poised to equip a new generation of mobile and handheld devices, as well as small fixed-mount camera systems, with thermal imaging capabilities never seen before. Lepton contains a breakthrough lens fabricated in wafer form, along with a microbolometer focal plane array (FPA) and advanced thermal image processing. In order to support the lepton and make it easy to use, we have developed a breakout board to support the module along with example source code. Please see the Lepton Thermal Camera Breakout Datasheet for more information.