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Showing results: 3391 - 3405 of 3415 items found.

  • Digital Signage Player With Intel® Pentium® Processor N4200 & Celeron® Processor N3350, DisplayPort++, HDMI, 2 GbE LAN And 4 USB

    DSP300-318 - Axiomtek Co., Ltd.

    The DSP300-318 is powered by the onboard Intel® Pentium® processor N4200 and Celeron® processor N3350 (code name: Apollo Lake). It can deliver dazzling visual images and video advertising in 4K resolution. Measuring only 20 mm in thickness, the ultra slim DSP300-318 is sleek enough to fit in a small area behind signage displays and its fanless and cable free design enables easy installation without any environment limitation. The super slim DSP300-318 is designed to be fanless and cableless, which ensures solid reliability and easy maintenance. It supports HDMI and Dual-Mode DisplayPort (DP++) outputs with support for dual displays. The system also has one M.2 Key E 2230 for Wi-Fi and Bluetooth modules, one M.2 Key B 3042 for 4G LTE and one SIM card slots for 3.5G radio connectivity. Additionally, one M.2 Key M 2280 and one optional 64GB eMMC 5.0 are available for storage. The Intel® Apollo Lake-based DSP300-318 offers a cost-effective, compact yet powerful computing platform that allows plenty of digital signage solutions for advertising, brand promotion and digital menu board applications.

  • SMARC Short Size Module with NXP i.MX 6 Multicore Arm® Cortex®-A9

    LEC-iMX6R2 - ADLINK Technology Inc.

    The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W. The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size. To stress on its low power consumption feature, ADLINK has named SMARC products as LEC (Low Energy Computer on module) series.

  • Extensometers for Indirect Tensile Testing of Asphalt

    Model 3911 - Jinan Testing Equipment IE Corporation

    For indirect tensile testing, such as for resilient modulus, these extensometers measure the lateral deformation of specimens. They are self-supporting on the sample and clip on in seconds. The traditional way this deformation has been measured was prone to errors caused by slight rocking of the sample as it is loaded. The self-supporting design of the Model 3911 eliminates this problem. This unit will handle the dynamic pulse requirements of resilient modulus testing.The speed of mounting makes test set-up much faster than with the older method. The pivot mounting used ensures that the specimen contact pads meet the often uneven asphalt surface as well as possible. The measuring range options available allow a wide range of testing, yet can easily measure the sometimes very small displacements required.The Model 3911 extensometers are strain gaged devices, making them compatible with any electronics designed for strain gaged transducers. Most often they are connected to a test machine controller. The signal conditioning electronics for the extensometer is typically included with the test machine controller or may often be added. In this case the extensometer is shipped with the proper connector and wiring to plug directly into the electronics. For systems lacking the required electronics, Epsilon can provide a variety of solutions, allowing the extensometer output to be connected to data acquisition boards, chart recorders or other equipment.

  • 32-CH/64-CH Isolated Digital I/O PCI Express Card With Digital Filter

    AX92351 - Axiomtek Co., Ltd.

    The AX92351 is a 64-ch isolated digital I/O PCI Express card with 2,000VDC isolation protection. This high-density digital I/O card with high-speed PCI Express x1 bus is excellent for use in applications requiring digital control or monitoring, such as semiconductor machinery, PC-based industrial machinery, programmable I/O logic control, and process status monitoring. The AX92351 features 32 isolated digital input channels and 32 isolated digital output channels with isolation protection of 2,000V for industrial applications where high-voltage isolation is required. It is equipped with a board ID feature for easy identification of multiple cards in single system. There is a digital filter function to prevent input signals from carrying noise or a chattering. Each isolated input has a sink or source current which supports dry and wet contact for maximum application flexibility. The card has a wide range of input voltage from 10 to 30V to meet most industrial application needs. The AX92351 also provides two interrupt sources on digital input channels. Digital output has open controller and supports maximum 30VDC. The read-back function is another useful function that allows monitoring each output port.

  • SMA Connectors

    Pasternack Enterprises, Inc.

    Pasternack SMA connector category contains a large selection of part numbers, the majority are RoHS and REACH compliant. SMA connector products in this category will terminate to coax, PCB (printed circuit board) or terminal and are built to precise RF and microwave industry specifications. Our SMA connectors are constructed in male or female gender in standard polarity, reverse polarity (RPSMA / RP-SMA) or reverse thread threads, with 50 Ohm impedance. Connector SMA series from Pasternack are available in straight, radius right angle or right angle versions, as well as, press in, bulkhead, 2 hole panel, 4 hole panel or mountless options. These SMA designs include clamp/solder, compression, crimp/solder, crimp/solder (captive contact), field replaceable, solder, solder (without contact), solder/solder or solder/solder (captive contact) attachment methods. We offer connectors in SMA series with standard or high performance levels manufactured with brass or stainless steel bodies. Other SMA connector options include quick disconnect (QD) or standard configurations. As with the other over 40,000 RF, microwave and millimeter wave products from Pasternack, this SMA connector series is in-stock. But not just in stock, also they will ship the same-day as they are ordered.

  • Carrier - Virtex 7 W/FMC Site

    VPF: 3U VPX - Delphi Engineering Group, Inc

    The VPF is a VPX form factor (VITA 46), FPGA processor board designed to meet the needs of challenging, embedded high‐performance digital signal processing applications at a competitive price point. AMD Virtex 7: VX330 and VX690 population options are available. The Virtex 7 FPGA provides impressive processing capabilities and supports operations such as: FFTs, FIR filters, fixed‐point and repetitive processing tasks. The VPF FPGA node processes input from the FMC HPC (Vita 57.1) site, allowing for maximum application configurability and performance when coupled with DEG’s market leading ADC and DAC FMC modules (250MSPS to 4.0GSPS). The VPF is fully compliant with the OpenVPX standard and accommodates the PCIExpress Gen 3.0 communication protocol. Delphi also offers a VPF FPGA Design kit which allows customers to leverage and modify DEG source code, develop within an open architecture, and rapidly integrate FPGA HDL. The DEG FPGA Design kit includes: Source code, simulation test bench and utilities to support custom algorithm development. Embedded Linux, VX Works and Windows software drivers are available. HPC FMC Site, Fully Compatible with all Delphi ADC and DAC FMC Modules.

  • 8 Channel A/D & D/A Zynq UltraScale+ RFSoC Processor - SOSA Aligned 3U VPX

    Model 5550 - Pentek, Inc.

    - Now available in RFSoC Gen 3 with the Model 5553- Supports Xilinx® Zynq® UltraScale+™ RFSoC FPGAs- 16 GB of DDR4 SDRAM- On-board GPS receiver- 10 GigE Interface- 40 GigE Interface- Optional VITA 67.3C optical interface for backplane gigabit serial communication- Dual 100 GigE UDP interface- Compatible with several VITA standards including: VITA 49, VITA 46, VITA 48, VITA 67.3C and VITA 65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Model 8256 3U VPX SOSA Aligned Development Chassis- Model 6001 unique QuartzXM eXpress module enables migration to other form factors- Video: Model 8256 3U VPX SOSA Aligned Development ChassisPentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Synchronize up to eight modules with Model 5903 High-Speed System Synchronization and Distribution Amplifier - 3U VPX- Please refer to the product datasheet for Installed FPGA IP Module details

  • 8-Channel A/D & D/A Zynq UltraScale+ RFSoC Processor - 3U VPX

    Model 5950 - Pentek, Inc.

    - Now available in RFSoC Gen 3 with the Model 5953- Multi-board synchronization with Quartz RFSoC video- Supports Xilinx Zynq UltraScale+ RFSoC FPGAs- 16 GB of DDR4 SDRAM- On-board GPS receiver- PCI Express (Gen. 1, 2 and 3) interface up to x8- LVDS connections to the Zynq UltraScale+ FPGA for custom I/O- Optional VITA-66.4 optical interface for backplane gigabit serial communication- Dual 100 GigE UDP interface- Compatible with several VITA standards including: VITA-46, VITA-48, VITA-66.4, VITA-57.4 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Model 8257 1-Slot 3U VPX Development Chassis for Quartz Products- Model 4801 Carrier Design Kit for designing custom carrier for the Model 6001 QuartzXM- Model 6001 unique QuartzXM eXpress module enables migration to other form factors- Pentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Synchronize up to eight modules with Model 5903 High-Speed System Synchronization and Distribution Amplifier - 3U VPX

  • COM Express Type 10 Mini Module With Intel® Atom® X5 And X7 Processor

    CEM310 - Axiomtek Co., Ltd.

    The CEM310, a COM Express Type 10 Mini module, supports Intel® Atom® x5 and x7 processors (codename: Apollo Lake) in a board size of 84mm x 55mm. It has 8GB of DDR3L onboard memory and an optional 64GB eMMC memory. The Intel® Atom®-based COM Express Type 10 Mini module comes with a variety of I/O and expansion options including four PCIe x1 lanes, one Gigabit LAN port with Intel® i210IT Ethernet controller, two USB 3.0, eight USB 2.0, two SATA-600, four digital I/O channels, HD Codec audio, one DDI, one LVDS, one LPC, one SPI, two serial TX/RX and one I2C to meet customer requirements. Aside from the rich I/O options, the CEM310 has a wide voltage input range of 4.75V to 20V to meet the varying voltage input requirements for automotive or transportation applications. In addition, it supports an extended operating temperature range from -20ºC to +70ºC or optional -40ºC to +85ºC to ensure stable and reliable operation in harsh environments. The CEM310 supports watchdog timer, hardware monitoring functions, SMBus as well as smart battery (optional).

  • Moisture Testers for Wood

    PCE Instruments

    Here you will find a moisture tester for wood to determine absolute moisture in different wood types. Newly-cut logs can have a moisture content of 80% or more, depending on the type. Since wood shrinks substantially when dried, it must be dried before being used in construction or most other applications. This is most often done using a large furnace called a kiln. The air drying method may also be used, but this is much slower. With the help of the moisture tester for wood you will be able to measure with high accuracy moisture in, not only raw wood, but also rolled paper products, planks, slats, beams, plywood, panels, particle board, main beams, window frames, etc., anything wooden. There are two ways of measuring moisture, these two ways are with or without damaging the material. The majority of types of moisture testers we offer at PCE do not damage the wood, or damage it very slightly.The moisture tester for wood is characterized by the measuring principle and the moisture sensors that can be adapted to it. The moisture tester for wood has special characteristics such as an automatic compensation of temperature. Besides, data can be stored and transferred to a PC or laptop, or characteristic curves can be programmed for specific wood types (only with the model FMD). Our moisture tester are of the highest quality standards in the industry, and are durable and easy to use.

  • Platform for Multi camera systems and Embedded vision

    xiX - XIMEA GmbH

    *Smallest camera featuring Sony Pregius™ - Compact with only 26.4 x 26.4 x 31 mm and 30 grams (1)*Fast CMOS - High speed, high frame rate: from 2.3 Mpix at 166 Fps to 50 Mpix at 33 Fps*Cool economy - Low power consumption with under 3 Watt and minimal heat dissipation*All-around support - support for Windows 7 and 10, macOS, Linux, ARM and embedded platforms*Industry standard - Data and control interface complies with PCI Express External Cabling Specifications*Adaptable potential - Available with two flat ribbon flex cable connectors: parallel and perpendicular *Software interfaces - GenICam / GenTL and highly optimized API / SDK for Image Processing*Connectivity and Synchronization - Programmable opto-isolated input and output, 4 status LEDs*Lens control - EF-mount Interface allows remote control of aperture, focus and image stabilization*Highly Customizable - Variety of sensor options including Sony IMX287, IMX273, IMX249, IMX265, IMX264, IMX267, IMX304 available in board level stack for OEM use and with switches and adapters*Interoperability increase - Continuous embrace of new software and hardware partners*Cost efficient - Excellent value through utilization of the newest technologies including Sony Pregius™

  • STANAG3910/EFEX Modules

    AIM GmbH

    AIM’s STANAG3910/EFEX test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with multiple processors for real time bus protocol and application support, massive memory and IRIG-B time code encoder/decoder functions are standard. The latest versions also support avionics discrete I/O. Configurations with dual redundant concurrent HS/LS Bus Controller (BC), Multiple Remote Terminals, and Chronological/Mailbox Bus Monitor operation with full HS/LS protocol error injection/detection, multi-level triggering, advanced capture/filtering and real time bus recording, time stamping and physical bus replay ensure your bus integrity. Support for EFAbus Direct Digital Links (DDL), Fibre Optic DDL (FODDL) and EFAbus Express extensions (Mixed Mode and Dual Mode operation) are available. To support the French ‘Rafale’ aircraft, modules are available with an Electrical Front End. Single Function variants support cost effective solutions. Each module is delivered with a Board Support Package (BSP) containing the onboard driver software, a full Application Programming Interface (API) and detailed getting started and programming guides. Powerful PBA.pro databus test and analysis software is optionally available for all our STANAG3910 modules.

  • Open Pluggable Specification (OPS) Digital Signage Player With 4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H81 And TPM 1.2

    OPS883-H - Axiomtek Co., Ltd.

    The OPS883-H OPS-compliant digital signage player is powered by the 4th generation Intel® Core™ i7/i5/i3 processor (codename: Haswell) with the Intel® H81 chipset. It has one 204-pin DDR3 SO-DIMM socket with maximum up to 8 GB. It offers stunning 4K Ultra High Definition (UHD) content via a HDMI port. The Intel® Core-based OPS883-H is ideal for multi-display applications in airport information board, shopping mall, corporate, education, hospitality, religious organization, bank, retail store, restaurant, performing art center and many more. This smart pluggable signage module is connected to OPS-compliant display via a standardized JAE TX-25 plug connector, and includes DisplayPort, UART, audio, USB 3.0 and USB 2.0 signals. To fill different application needs, the signage unit reserves a wide choice of I/O ports on front panel, including one USB 3.0 ports, two USB 2.0 ports, one COM port, audio (in/out) and a Gigabit Ethernet port. This slim-type OPS system has one internal PCI Express Mini Card slot to connect Wi-Fi or 3G/ LTE modules to satisfied users wireless needs. It features one easy-to-access 2.5” SATA HDD as storage device. Also, it supports TPM 1.2 feature which is designed to secure system.

  • PCB Systems Vibration and Acceleration Simulation Solution

    Xpedition - Mentor Graphics Corp.

    As the industry’s market share leader in PCB design software, the Mentor Graphics® Xpedition product augments mechanical analysis and physical testing by introducing virtual accelerated lifecycle testing much earlier in the design process. This is the industry’s first PCB-design-specific vibration and acceleration simulation solution targeting products where harsh environments can compromise product performance and reliability, including the military, aerospace, automotive and industrial markets. Traditional, physical HALT (highly accelerated lifecycle testing) is conducted just before volume manufacturing, and requires expert technicians, which can result in costly schedule delays. Bridging mechanical and electronic design disciplines, the Xpedition product provides vibration simulation significantly faster than any existing method. This results in increased test coverage and shortened design cycles to ensure product reliability and faster time to market. The Xpedition component modeling library is the most extensive in the industry, comprised of over 4,000 unique 3D solid models which are used to create highly defined parts for simulation. The 3D library allows users to easily match geometries to their 2D cell database. Designers can assemble the parts models on board and automatically mesh them for performance analysis, including stiffeners and mechanical parts. The system modeling tool is ultra-fast since it can model over 1,000 components per minute.

  • FPGA Image Processing (IP) Development Kit

    ProcVision - Gidel

    Gidel’s Vision Pro Development Kit is an optimal solution for developing,validating, demonstrating and evaluating Image Processing (IP) andpipeline designs on FPGA.The suite is designed to provide a complete and convenient envelop enablingthe developer to focus strictly on the proprietary image processingdesign. The entire Vision Pro flow is within a single FPGA, independentof the final target application(s). The Vision Pro flow is composedof a pipeline that streams simulated data to the user image processingdesign under test (DUT) and then captures the design’s output streamfor displaying, storing, analysis and/or co-processing on host software.The entire process is performed on a single FPGA without the need foradditional peripheral connectivity or tools.Vision Pro suite is plug-and-play enabling the developer to begin at oncethe IP design development and validation. A simple design example providesthe developer immediate hands-on familiarization with the systemflow and supporting tools. The final design can be ported to any IntelFPGA device or other vendors’ devices (FPGA or ASIC) by replacing basiclibraries. To significantly reduce compilation time, initial design developmentmay be on a small FPGA device and later compiled for the targetdevice(s). The target implementation may use any FPGA board. For a fullImaging/Vision system solution, Gidel offers a number of off-the-shelfgrabbers and FPGA accelerators that are designed to utilize these imageprocessing blocks and Gidel Imaging Library (GIL).

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