Showing results: 2551 - 2565 of 7546 items found.
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Infrared Thermometer -
MEET International Ltd.
External Wireless Connectivity Infrared Thermometer is compact in size and easy to use. It can determine the surface temperature by measuring the amount of infrared energy radiated by the target's surface or by contact using a thermocouple probe as well as ambient temperature. IR Thermometer is specially designed for use in heating ventilating, air conditioning (HVAC), plumbing, electrical, electronic, machinery and food / catering applications.
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PTM-1000 -
Advanced Thermal Solutions, Inc.
The PTM-1000, Pressure Transducer Module, is a four-channel test instrument for measuring differential pressure in enclosures where air flow integrity is critical to proper performance. As the demand for more energy efficient cooling grows, the need for measuring the pressure at each source of heat generation will follow.
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SX-23BT -
Silex Technology
The SX-32BT is a Bluetooth® 5.0 Low Energy compatible microcomputer module based on a 32-bit RX microcomputer, the "RX23W", from Renesas Electronics. Certified for North America, Europe, and Japan, the module's design also includes a PCB antenna. Furthermore, it adopts a 0.7mm pitch LGA package, ideal for OEM's looking to increase the efficiency of their manufacturing process while lowering the total BOM cost of their product.
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Apogee Instruments, Inc.
Apogee silicon-cell pyranometers feature a monocrystalline silicon-cell detector that has the same spectral response as a PV module. The sensors quantify shortwave radiation being harnessed as electricity.
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XTA Series -
Acromag, Inc.
These modules are intended for use with BusWorks XT Series discrete I/O or other digital output modules for the purpose of driving high energy loads.
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COMSOL, Inc.
The design and modeling of microelectromechanical systems (MEMS) is a unique engineering discipline. At small length scales, the design of resonators, gyroscopes, accelerometers, and actuators must consider the effects of several physical phenomena in their operation. Consequently, COMSOL Multiphysics is ideally suited for MEMS applications. To this end, the MEMS Module provides predefined user interfaces with associated modeling tools, referred to as physics interfaces, for a variety of coupled physics, including electromagnetic-structure, thermal-structure, or fluid-structure interactions. You can include a variety of damping phenomena in your model: thin-film gas damping, anisotropic loss-factors for solid and piezo materials, anchor damping, and thermoelastic damping. For elastic vibrations and waves, perfectly matched layers (PMLs) provide state-of-the-art absorption of outgoing elastic energy.
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King Design Industrial Co., Ltd.
*Shock amplifier is mainly used to small object, and can reach the pulse duration and high acceleration that shock table couldn’t achieve.*Equipped with shock table or different shock module (the theory is to amplify impact energy through second impact), shock amplifier can reach the requirement of high acceleration.
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A100SMR-100SMR-9A100 -
Pickering Interfaces Ltd.
This 1m long male to male 100-Pin SCSI Style Micro-D Cable Assembly is constructed from 7/36 (28 AWG) Tinned Copper twisted pair wiring with Polyolefin insulation to minimise crosstalk. Screwlocks are provided to secure the connectors to their associated products. This cable assembly is suitable for use with Pickering BRIC modules that use the 100-pin Micro-D connector.
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40-295-021-5/16 -
Pickering Interfaces Ltd.
The 40-295 is a Programmable Resistor module with up to 18 channels of 8-bit resolution resistor chains in a single 3U PXI module. The flexible architecture allows these modules to also be supplied as 12, 16 or 24-bit resolution versions for applications requiring finer resolution, greater resistance range or higher channel count.
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CM22202 -
LinkedHope Intelligent Technologies Co.,Ltd.
CM22202 is a Type 6 COM Express® module developed by LinkedHope® based on China local x86 architecture ZX® KX-6000 series Processors. This module pinout is compliant with PICMG COM.0 R3.0 specification. CM22202 contains all kinds of high-speed interfaces such as SATA III, USB 3.0 and PCIe 3.0. CM22202 provides dual-channel SO-DIMM, supporting DDR4-2666 MHz memory and the capacity up to 32GB.CM22202 supports KX-6000 series 4 core processors which TDP from 25W to 55W. CM22202 provides high performance computing with balanced power consumption. CM22202 works well in a wide range temperature environment. It is ideal for the high-bandwidth and processing intensive requirements of industrial and edge computing applications.
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COM-HPC -
ADLINK Technology Inc.
The PCI Industrial Computer Manufacturers Group (PICMG) is now entering the final stages in the development of the new COM-HPC computer-on-module specification that will address the needs of the very high end of the industrial edge computing market.
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ADLINK Technology Inc.
One of the most fundamental innovations of the COM Express Type 7 pinout is the support of up to four 10GbE interfaces, essential for the next generation of edge node appliances. Type 7 modules are headless (no graphics), which is why they are also referred to as “Server Level COM Express”.
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cExpress-AR -
ADLINK Technology Inc.
The cExpress-AR, featuring the new AMD Ryzen™ V2000 APU with its high performance integrated Radeon™ graphics, is the first Type 6 module on the market to support an octa-core (8-core) embedded SoC, with up to 16 threads and an impressive turbo boost up to 4.2 GHz. Compared to earlier embedded quad-core V1000 processors, the additional cores combined with AMD's Zen 2 architecture result in a more than two-fold performance increase and double the performance-per-watt efficiency.
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cExpress-TL -
ADLINK Technology Inc.
ADLINK cExpress-TL,based on the 11th Gen Intel® Core™ i7/i5/i3 and Celeron™ processor, is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of previous generations. Additionally if features support for 2.5GbE Ethernet, leveraging existing Cat5e cable infrastructure being used for 1GbE Ethernet, it supports four USB 3.2 ports with transfer rates up to 10Gb/s. The modules have a configurable power range of 15 to 28 watts, which suits them for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI. cExpress-TL features the Intel® Iris® Xe, a new graphics core, and supporting AVX-512 Vector Neural Net Instructions (VNNI) can significantly improve the number of elements processed per cycle, providing AI inferencing performance that is up to 3x that of previously available from non-VNNI platforms. Intel® Iris® Xe provides 96 execution units and is able to be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP). Additional support includes In-Band ECC (IBECC), providing ECC level error correction on DDR4 SODIMM memories for mission critical or rugged applications.
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Axiomtek Co., Ltd.
Axiomtek COM Express Type 2 modules are designed with all components necessary and offer the most updated bus interfaces. The COM Express modules satisfy a wide range of vertical embedded applications with features of great computing performance and rich I/O capabilities, and reduce customers' time-to-market and ownership cost.