Showing results: 3856 - 3870 of 7546 items found.
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VPX3-663 -
Curtiss-Wright Defense Solutions
The VPX3-663 hybrid switch combines PCI Express 3.1 and 10 Gigabit Ethernet switching in a single 3U VPX module. Ideal for size, weight, and power (SWaP)-constrained platforms, the VPX3-663 provides single-slot connectivity for high-performance processing systems that combine SBC, DSP, GPU, FPGA, I/O, or storage modules.
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PC104p4IP -
Dynamic Engineering
If you want to use IndustryPack modules with your PC/104+ or PC/104-Plus system, the PC104p4IP is the choice for you. The PC104p4IP combines features you need with simplicity and speed. Up to 4 IP modules can be installed. Standard 16 bit IPs plus 32 bit, and double wide modules fit right in. Each slot has independent operation - control, clocking, IO, power filtering and protection. The PC104p4IP is highly integrated with the PCI and IP interfaces closely coupled within the same FPGA.
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IP & MM -
Data Patterns Pvt. Ltd.
Industry Pack (IP) modules are international standards as per ANSI-VITA 4.These are mezzanine modules of approximately the size of a business card (99mm x 45mm). Featuring a 16 or 32 bit wide I/O interface and 50 user defined I/O pins, these modules are ideal for providing the capability for high density I/O.IP carriers provide multiple slots on a single carrier. This allows multiple IP modules to be provided on a single slot in a Compact PCI / VME / VXI / PCI card cage.Industry Pack modules provide some unique advantages in system integration. These include:
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EnsembleSeries™ CCM6020 -
Mercury Systems, Inc.
*First OpenVPX carrier module designed specifically to use the Expansion Plane*PCI/PCI-X interface at up tof 133 MHz on each site*x8, x4 and x1 PCIe interfaces*Advanced OpenVPX system management functionality enables remote monitoring, alarm management, and hardware revision and health management*Conduction-cooled and air-cooled variants available
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EGX-MXM-P2000 -
ADLINK Technology Inc.
The EGX-MXM-P2000 features advanced NVIDIA Quadro GPU with NVIDIA Pascal™ Architecture technology in MXM 3.1 Type A form factor. The EGX-MXM-P2000 has 768 NVIDIA CUDA cores and a peak single-precision floating-point performance of 2.3 TFLOPS. The EGX-MXM-P2000 has 4GB of GDDR5 memory and supports NVIDIA GPUDirect™ RDMA which helps increase data throughput by up to 80% and consequently system responsiveness by up to 60%*. Additionally, 4 UHD display outputs and an extended operating temperature range of -40°C to 85°C are supported. The embedded graphics product is suitable for mission-critical harshenvironment edge computing applications with size, weight, and power (SWaP) and network connectivity constraints.
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51-921A-001 -
Pickering Interfaces Ltd.
The use of the StarFabric interface operating at 2.5Gb/s minimizes the impact on system speed. The PCI interface of the 51-921A supports both 32 bit and 64 bit operation and backplane speeds of 33MHz and 66MHz, ensuring the highest speed operation under all conditions. The StarFabric interface ensures the modules perform seamlessly with no impact on the test system software.
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FiberLabs Inc.
Optical amplifier Gain Blocks are compact in size and suitable for built-in use. FiberLabs provides a wide wavelength range of optical amplifier Gain-Blocks over the O-, S-, C- and L-bands. These Gain Blocks can be used for B-PON system using three wavelengths of 1.31 μm, 1.49 μm, and 1.55 μm (ITU-T [compliant with G.983.3]), DWDM system and 100 GbE (IEEE 802.3ba) using the 1.3 μm band.
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VXI NM-M -
Holding Informtest
HM-M is a carrier of mezzanine modules in the VXI standard, it is a VXI module of the size C-1. NM-M ensures the functioning of various modules installed in it, made in the form of mezzanines. NM-M is intended for use as a mezzanine carrier in multichannel systems for collecting / issuing information, both digital and analog. The carrier of the NM-M mezzanine modules is used as part of information measuring systems based on the VXIbus trunk. Made on a C size board in accordance with the requirements of the IEEE Std 1155-1992 standard.
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EGX-MXM-P1000 -
ADLINK Technology Inc.
The EGX-MXM-P1000 features advanced NVIDIA Quadro GPU with NVIDIA Pascal™ Architecture technology in MXM 3.1 Type A form factor. The EGX-MXM-P1000 has 512 NVIDIA CUDA cores and a peak single-precision floating-point performance of 1.8 TFLOPS. The EGX-MXM-P1000 has 4GB of GDDR5 memory and supports NVIDIA GPUDirect™ RDMA which helps increase data throughput by up to 80% and consequently system responsiveness by up to 60%*. Additionally, 4 UHD display outputs and an extended operating temperature range of -40°C to 85°C are supported. The embedded graphics product is suitable for mission-critical harsh-environment edge computing applications with size, weight, and power (SWaP) and network connectivity constraints.
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EGX-MXM-A1000 -
ADLINK Technology Inc.
GPUs can boost the performance of a wide range of workloads, including image processing and analysis, compute acceleration, and artificial intelligence (AI). As requirements for responsiveness and accuracy become more demanding for edge systems, the combination of CPUs and GPUs is becoming more mainstream in order to deliver optimal efficiency in performance per watt and dollar.
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PCI113 -
Vadatech Inc
PCI113 is VadaTech second generation PCIe expansion module. The PCI113 is a high-speed 20Gbps bridge from the host PCIe bus to VadaTech’s carrier and Rear Transition Module (RTM) products such as the ATC104/114/118/117/119, ART114, μTCA chassis, etc. The different carriers host different I/O modules such as PMC/PrPMC, AMC, PCI-X and PCIe edge modules. This concept allows any of the available I/O modules in these standard form factors to be integrated quickly and easily into an AdvancedTCA or μTCA subsystem. The PCI113 allows expansion among multiple μTCA chassis or expansion into other chassis that are not ATCA or μTCA based.The PCI113 is a single module PCIE based on the PCISIG specification. The PCI113 provides a PCIe x4 link infiber/copper via front panel QSFP. The dual front I/O allows expansion into two separate systems independently. The upstream port must not have spread spectrum PCIe clock enabled.
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Mercury Systems, Inc.
Our switch fabric modules provide full service switching through hardware accelerating ASICs from leading device makers including Mellanox or may be software defined for upgradability. These high bandwidth switches include system management capabilities including full compliance with VITA 46.11.
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ARK-6300 Series -
Advantech Co. Ltd.
The Fanless PC ARK-6300 series is integrated with a Mini-ITX motherboard with reserved iDoor module for diverse applications .This compact, rugged industrial Embedded System is a convenient yet reliable custom system focused on machine automation, industrial plants, and the IoT market.
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MaxiCheck MX808TS -
Autel
Together with the ability to quickly read and clear DTCs for all available modules of the majority of the makes and models on the market, MaxiCheck MX808TS provides you with superior special functions, including Oil Reset, EPB (Electronic Parking Brake), SAS (Steering Angle Sensor), BMS (Battery Management System), DPF (Diesel Particulate Filter) and IMMO. In addition to OBD II diagnostics and special service, MX808TS enables you to carry out complete TPMS functions, including TPMS health check, sensor activation & programming and TPMS relearn.
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NI
The Temperature Input Module for Remote I/O features a features a thermocouple input range of ±100 mV and a voltage input range of ±5 V. It also has an adjustable filter time for improved measurement quality and optional external CJC or PT100 RTD measurements.A remote I/O system consists of an EtherCAT bus coupler and individual modules mounted on a DIN rail. You control the Temperature Input Module for Remote I/O from a real‐time controller, such as a CompactRIO Controller or an Industrial Controller. You can use remote I/O hardware to add low‐cost I/O for simple tasks while your controller handles advanced tasks such as image processing, motion control, and high‐speed or specialty measurements.
