Showing results: 181 - 195 of 10250 items found.
-
Tabor Electronics Ltd.
The Proteus Arbitrary waveform generator Module is Based on PXI Express industry-standard modular architecture and can easily scale to hundreds of channels while keeping the required space to a minimum. Its compact size enables up to 4 generator output channels in two PXIe slots and adding the optional 2 channel digitizer only 3 PXI slots.
-
LT Laser Tools GmbH
Available under the brand name FLEXPOINT®, our laser modules are produced in house, making it possible for us to create almost any design and customer-specific housings. An in-house series for use in digital image processing is also available.FLEXPOINT® MV line lasers were developed for digital image processing. ALBALUX is a series of white light sources.
-
XM Bond HR -
Viscom AG
Viscom AG offers the new XM Bond HR camera module for dependable inspection of wire bonds. Its characteristics include a 21 mm x 21 mm field of view size and exceptionally fine detail resolution. It is ideally suited for the most precise inspection of thin wires in the production line. With the new XM Bond HR camera module, Viscom advances the configuration possibilities in wire bond inspection for higher in-line inspection quality. This module is particularly recommended for safety-relevant electronics, where thin wires with diameters of e.g. only 20 µm are installed. Products of this kind find use, among others, in various types of signal processing in the automotive and aerospace sectors. The high-quality optical components and sensor chips with first-class resolution and sensitivity achieve superb image quality and sharp detail resolution. Together with its 21 mm x 21 mm field of view size, the XM Bond HR offers a resolution of 4.5 µm per pixel. A telecentric lens ensures that regardless of the distance to an object, an inspection window has the same image scale; for example, the end points of an inspected thin wire are always located at the same positions in the inspection window. In addition, the telecentric optics also prevent areas on the electronic assembly next to tall components from being hidden.
-
LDM200 -
Artifex Engineering GmbH & Co. KG
The LDM200 series of laser diode modules are specialized units for high-end applications. The fibre coupled design allows flexible installation and separation of the electrical and optical sections. High quality optics and precision adjustment provide for excellent beam quality and very long collimation distances up to 100m. Customized fixed focus distances may also be provided. The option of choice of pola
-
SX-23BT -
Silex Technology
The SX-32BT is a Bluetooth® 5.0 Low Energy compatible microcomputer module based on a 32-bit RX microcomputer, the "RX23W", from Renesas Electronics. Certified for North America, Europe, and Japan, the module's design also includes a PCB antenna. Furthermore, it adopts a 0.7mm pitch LGA package, ideal for OEM's looking to increase the efficiency of their manufacturing process while lowering the total BOM cost of their product.
-
SMT-FMC510L -
Sundance Multiprocessor Technology Ltd.
The SMT-FMC510L is an FMC module with a low pin count connector (LPC). It is primarily designed to attach to the EMC2-DP FMC PCIe104 carrier board and provide analogue video and serial interfaces. Connectivity is via BNC connectors on the main FMC PCB, BNC connectors on an adaptor PCB, and two 20-way latching DIL pin headers. The adapter PCB is optional and only required if interfaces other than analog video are needed.
-
ETX® -
ADLINK Technology Inc.
ETX is one of the earliest successful computer-on-module form factors. Today it is still widely used in applications such as industrial automation, transportation and medium and low level medical appliances. While high-end Intel® Core™ applications have mostly migrated to COM Express, ETX is still very much alive in the lower power segment, mostly notably using Intel Atom® SoCs.
-
DS-MPE-CAN2L -
Diamond Systems Corp
The module implements a CAN protocol bus controller that performs serial communications according to the CAN 2.0A and CAN 2.0B specifications. The protocol uses a multi-master bus configuration for the transfer of frames between nodes of the network and manages error handling with no burden on the host processor. Error analysis features enabling diagnostics, system maintenance, and system optimization. A listen-only mode enables CAN bus traffic analysis and automatic bit-rate detection.
-
PCI-IPC -
ALPHI Technology Corporation
The PCI-IPC module provides a high performance flexible I/O scheme, that supports industry standard Industry PacksÔ. For application requiring low cost, high density I/O or unique combinations, the PCI-IPC is the perfect solution.The Local DSP can be used to simply move data to and from the PCI bus or provide pre processing functions such as local PID controls, FFT’s, digital filtering, etc. Custom application software can be downloaded to the DSP via the PCI bus.
-
COM Express Compact -
Advantech Co. Ltd.
Advantech COM-Express Compact includes Intel core i, Intel 5th Generation, Intel atom processor, which are all designed with low power consumption processors. They perform the same functions and same pin definitions as the COM-Express Basic module but with smaller board dimensions of 95 x 95 mm. And COM Express Compact series provide from Intel core i, Intel 5th Generation, Intel atom processors, and is the best solution for mobile applications.
-
pixus technologies
Pixus Technologies can help you configure your MicroTCA system based on your requirements. We help you select the best modules in the industry for your application that meet your budget and performance goals. For simplicity, you can order your full OpenVPX system and boards through Pixus or we will refer you to the best fit for your application. Our flexible approach leaves the choice to you, and helps ensure you are getting the best performance and value required for your system.
-
CPCI-QIPC-6U -
ALPHI Technology Corporation
The CPCI-4pack-6U module provides a high performance flexible I/O scheme, that supports industry standard Industry PacksÔ. For application requiring low cost, high density I/O or unique combinations, the CPCI-4pack-6U is the perfect solution. The Local DSP can be used to simply move data to and from the CPCI bus or provide pre processing functions such as local PID controls, FFT’s, digital filtering, etc. Custom application software can be downloaded to the DSPvia the CPCI bus or the local serial port.
-
PCI-4pack-2 -
ALPHI Technology Corporation
The PCI-4pack module provides a high performance flexible I/O scheme, that supports industry standard Industry PacksÔ. For application requiring low cost, high density I/O or unique combinations, the PCI-4pack is the perfect solution. The Local DSP can be used to simply move data to and from the CPCI bus or provide pre processing functions such as local PID controls, FFT’s, digital filtering, etc.Custom application software can be downloaded to the DSP via the PCI bus. Windows 95 and WinNT drivers are standard.
-
510104118 -
Virginia Panel Corporation
Blank modules are for unused module slots. The blank shielding module fills a module slot and shields signals between the modules. Blank modules fit in either ITA or receiver positions.
-
SMARC -
ADLINK Technology Inc.
SMARC form factor is the only computer-on-module form factor that truly is capable of supporting both ARM and x86 designs. With 314-pins on a high speed MXM3 connector, SMARC can fully cover both typical x86 interfaces as well as typical ARM type low level signals. Using ARM SoCs opens the possibility to leverage the product ecosystem of familiar devices such as tablet computers and smart phones. Alternative low power SoCs and CPUs, such as tablet oriented x86 devices and other RISC CPUs may be used as well.
