Showing results: 6541 - 6555 of 10250 items found.
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40-294-034 -
Pickering Interfaces Ltd.
These PXI Programmable Resistor modules are available with either two channels of 16-bit, two channels of 12-bit or four channels of 8-bit resistor chains in a single 3U PXI module. The module is ideal for simulating sensors for control and management systems under test, allowing the user to verify system response in design verification or manufacturing test applications.
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AMC734 -
Vadatech Inc
The AMC734 is a 10-Gigabit Ethernet (10GbE) AdvancedMCTM (AMC) module which includes an on-board line rate multi-core packet processor based on Cavium CN67XX CPU. VadaTech offers this product in a mid size form factor with AMC.2 specification (option full size design, see ordering options).The AMC734 is based on the Cavium OCTEON CN67xx processor which has been specifically designed to intelligently process Ethernet packets at line rate. The number of processor cores, speed grade, and amount of DDR3 memory is customizable based on customer needs.The module has an RTC on board.The SDK for the processor as well as additional software stacks are available from Cavium or third party.
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NI
CompactDAQ Chassis feature USB, Ethernet, or WiFi connectivity and come in multiple slot counts to provide the right amount of I/O for various applications. You use these models with a combination of C Series I/O modules to create a mix of analog I/O, digital I/O, and counter/timer measurements. CompactDAQ Chassis can include multiple general-purpose counters/timers that you can access through an installed, hardware-timed digital C Series module for applications that involve quadrature encoders, PWM, event counting, pulse train generation, and period or frequency measurement. CompactDAQ Chassis also offer multiple timing engines, which allow you to run multiple hardware-timed operations simultaneously with independent rates for analog input.
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ADLINK Technology Inc.
ADLINK remote IO and serial communication cards are suitable for handling multiple digital signal types for IoT and other industrial applications such as facility monitoring, environmental monitoring, and industrial process control.Remote IO - NuDAM modules provide direct communication with various sensors, including performing signal conditioning, scaling, linearization and conversion to obtain temperature, pressure, flow, voltage, and current measurements. The new ND6100 series modules use Modbus/RTU remote data transmission protocols, providing customers with a comprehensive product portfolio. ADLINK's serial communication cards provide a PCI/PCIe interface and support RS-232 and CAN communication interfaces, allowing customers to choose the most suitable communication card for various automation equipment needs.
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SparkFun Electronics
With GNSS you are able to know where you are, where you're going, and how to get there anywhere on Earth within 30 seconds. This means the higher the accuracy the better! GNSS Real Time Kinematics (RTK) has mastered dialing in the accuracy of their GNSS modules to just millimeters, and that's why we had to put it on this board! With the flexibility of the MicroMod's M.2 connector, you can easily test and swap out different MicroMod processor boards for your application. Simply match up the key on your board's beveled edge connector to the key on the M.2 connector and secure the boards with a screw. This means solderless access to the ZED-F9P modules features via UART1, UART2, SPI, and I2C ports!
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GHI Systems
The GHI Windows version of our powerful SRS module has been made even more powerful by the addition of new processing modes. These include: 1. Statistical SRS - This mode provides MEAN and Positive STANDARD DEVIATION plots which can be used when tailoring shock specifications based on environmental measurements. 2. Max-I-Max Envelope SRS - This module plots succeeding SRS's on one screen while at the same time plotting an 'envelope' that bounds all SRS's processed. 3. Overlay Plot - This mode allows overlaying plots of multiple SRS's. The user may plot Positive and Negative Max-I-Max spectra on the same screen. The foregoing are in addition to our traditional features
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Pickering Interfaces Ltd.
The 96 Pin 1.27mm Pitch Micro-D Connector is used on high-density PXI modules that require 1A current rating and voltage handling up to 150Vdc. If you would like to develop your own cabling solutions, we offer mating connectors and connector hoods that allow you to create either your own cable based solutions, or a PCB header solution. Connector Blocks directly terminate the module connector and convert the connection to arrays of screw terminal blocks, or you can select to use a remote DIN rail mounted breakout to terminate the cables at the end of a cable assembly. You can also try our Cable Design Tool to graphically design a customized cable assembly.
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IFB-10001 -
Playing With Fusion Inc
Easily connect Arduino or other 5V microcontrollers to ~3.3V sensors. Based on the TI TXB0108 auto-sensing, bi-directional level translator, this module provides access to all 8 channels of the TXB0108 and has a built-in 300mA LDO with 200mV max dropout voltage at full load. Regulated 3.3V output allows this single board to both interface withandpower 3.3V sensors. An important feature of this module is the ability to operate SPI and other digital lines (not including I2C) at high-speed, whereas the 'NXP level shifter' maxes out at 400kHz and resistor dividers fail much earlier. The TXB0108, integrated with the LP3981 LDO, provide a fast, reliable solution to mismatched interface voltages that exceeds the performance of other solutions.
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40-617-021 -
Pickering Interfaces Ltd.
The 40-617 18-Bank, 3-Channel, 1-Pole Multiplexer Module forms part of the System 40 PXI Programmable Switching system. The Module consists of 18 electrically isolated banks of multiplexers controlled by a PXI/PCI interface. Each bank is a 1 to 3 multiplexer and operates with break-before-make action when a new channel is selected. Any Individual multiplexer bank can have a channel set by itself, alternatively, multiple banks can have channels selected simultaneously. Inter-bank linking relays allow multiplexer size to be increased in multiples of 3 by joining the common terminals of adjacent banks. Closing one linking switch produces a 6 channel multiplexer, closing all linking switches produces an 54 channel multiplexer.
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SFT3226SA -
Hangzhou Softel Optic Co., Ltd.
SOFTEL SFT3226SA multi-channel encoder is our newest professional SD audio & video encoding and multiplexing device with powerful functionality. It adopts the slot structure with one device supporting maximum 2 SFT3226SA modules. Each module can support 16 channels and work standalone. It is equippedwith 16/32 CVBS channels input. It can multiplex the 16/32 encoded TS to generate a MPTS and 16/32 SPTS output through GE output port and one MPTS output through 2 ASI output ports. In conclusion, its high integration and cost-effective design make this device widely used in variety of digital distribution systems such as CATV digital head-end, satellite and terrestrial digital TV, etc.
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MAKO -
ADVINT, LLC
The Mako platform is based upon use of NI CompactDAQ (cDAQ) product line consisting of a chassis, NI C Series I/O modules, and a Windows host computer connected over USB, Ethernet, or Wi-Fi. Mako systems provide an easy, flexible, expandable platform to meet the needs of any electrical or sensor measurement system. They control the timing, synchronization, and data transfer between a host computer and up to eight (8) C Series I/O modules. A single Mako can manage multiple timing engines to run up to seven separate hardware-timed I/O tasks at different sample rates in the same system. Multiple units can also be daisy changed together for larger applications.
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ADLINK Technology Inc.
ADLINK USB DAQ modules leverage the expertise of ADLINK's analog design capability, enhancing convenience of data acquisition. Simply plug the ADLINK USB DAQ into a USB port on your computer or notebook for performance equaling or even exceeding that of ADLINK PCI/PCIe DAQ cards, with no need to power down or open the chassis. As well as providing basic voltage measurement, ADLINK USB DAQ modules feature built-in signal conditioning to directly receive measurement from most commonly used sensors, with no need for extra signal processing. From basic testing to high-accuracy measurement, from portable application to industrial automation, the ADLINK USB DAQ series delivers easy, efficient, and accurate measurement every time.
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ADLINK Technology Inc.
ADLINK is a global provider of leading edge computing solutions and an NVIDIA® Quadro® Embedded Partner and Jetson™ Elite Partner. To enable edge systems to tap into the power that can be provided by GPU computing, ADLINK offers a comprehensive portfolio of optimized heterogeneous computing solutions including embedded MXM GPU modules and PCI Express graphics cards based on NVIDIA® Quadro® GPUs, edge AI platforms based on NVIDIA® Jetson™ modules, GPU computing platforms and other embedded form factors that can accelerate edge computing and AI workloads to satisfy a wide range of embedded requirements based on performance, long life cycle, power consumption, and form factor.
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Teledyne Marine DGO
​This Electrical Feedthrough System design provides a high-reliability circuit for transmitting electrical signals from downhole gauges through the wellhead and Subsea Tree to the Subsea Control Module (SCM) for topside monitoring. The system incorporates Teledyne DGO's high integrity glass-seal technology in three critical pressure barriers for maximum long-term reliability. The feedthrough system creates a permanent connection to the Subsea Control Module when the tree is installed onto the wellhead. In addition, a permanent rig-based DHG cable termination is completed to connect the control line to the feedthrough system. The DHG connector is available with a variety of sealing packages, including fully testable, dual metal-to-metal sealing of all downhole tubing hanger interfaces.
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Model 200IR -
OAI
The OAI Model 200IR Mask Aligner is a tabletop system that requires minimal clean room space. It is a cost-effective alternative for R&D or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The Model 200IR Mask Aligner is capable of one micron resolution and alignment precision. It has an alignment module which features mask insert sets and quick-change wafer chucks that enable the use of a variety of substrates and masks without requiring tools for reconfiguration. The alignment module incorporates micrometers for X, Y, and z-axis.
