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Lithography
nano fabrication of circuitry.
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Lithography
With steppers for advanced packaging and flat panel display technology, Onto Innovation's latest fleet will meet today's manufacturing challenges head on. Systems are designed to maximize throughput without limited resolution and overlay.
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Computational Lithography
ASML's industry-leading computational lithography products enable accurate lithography simulations that help to improve chip yield and quality
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EUV Lithography
NXE systems
NXE lithography systems are used in high-volume manufacturing of advanced Logic and Memory chips. The first systems to use ASML’s novel 13.5 nm EUV light source, they print microchip features with a resolution of 13 nm, which is unreachable with deep ultraviolet (DUV) lithography. Chipmakers use our NXE systems to print the highly complex foundation layers of their 7 nm, 5 nm and 3 nm nodes. Read about how EUV lithography went from imagination to reality.
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EUV Lithography
EXE systems
EXE, or ‘High NA’, systems are the latest generation in EUV lithography. With a numerical aperture (NA) of 0.55, their innovative new optics provide higher contrast and print with a resolution of just 8 nm.
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Lithography System
JetStep W2300
The JetStep W2300 System has been specifically designed to meet advanced packaging challenges head on. As resolution, overlay and many more technical specifications become tighter and more sophisticated for semiconductor advanced packaging processes, fulfilling lithography requirements becomes a challenge.
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Lithography System
JetStep S3500
The JetStep S3500 panel lithography system is designed specifically for advanced packaging panel production. The system incorporates advanced features that address requirements for panel-level packaging, such as die shift due to placement accuracy or subsequent processing steps, CTE mismatch, panel warpage and panel handling.
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Lithography System
JetStep X500
The JetStep X500 panel lithography system is optimized for volume manufacturing of high-end AICS and advanced packaging panels. The system incorporates a large field exposure system with advanced features to meet the challenging requirements encountered in production of AICS or panel level packaging, such as; fine resolution to 3µm with large depth of focus (DOF), high overlay accuracy of ±1µm, automatic magnification compensation with independent x and y magnification adjustment of ±100 ppm, and automatic handling of panel substrates of various dimensions, thicknesses, and levels of warp.
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Lithography System
JetStep G35
The Jetstep G35 system is a high volume manufacturing imaging system for up to Gen 3.5 displays.The JetStep G35 system enables high resolution imaging down to 1.5µm combined with registration and stitching accuracy required by most advanced manufacturing of high resolution displays.
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Lithography System
JetStep G45
The JetStep G45 System features <1.5μm resolution capability across a field size diameter of >200mm. Low distortion optics combined with high-speed precision motions enables the system to achieve overlay of <0.5μm.
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Desktop Maskless Lithography
Desktop Size Maskeless (direct-exposure) Lithography System which supports simple lithography operation by its sophisticated software.
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DUV Lithography Systems
ASML's deep ultraviolet (DUV) lithography systems dive deep into the UV spectrum to print the tiny features that form the basis of the microchip.
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Interference Lithography Gratings
Interference lithography is an optical nanolithography technology for the fabrication of extensive periodic nanostructures. Critical dimensions of less than 50 nm can be realized. At AMO two interference lithography tools are installed. One setup for extensive, high quality gratings with fixed periods, the other more flexible tool allows quick prototyping. We offer grating fabrication on silicon, silicon dioxide and other substrates with tailored pitch, etch depth and size.
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EUV Lithography Systems
Using extreme ultraviolet (EUV) light, our NXE and EXE systems deliver high-resolution lithography and make mass production of the world’s most advanced microchips possible
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Electron Beam Lithography System
Spot type Electron Beam Lithography System JBX-8100FS achieved high throughput, small footprint and electric power saving.
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Dry Systems
Chips are made up of many layers stacked on top of one another, and it’s not necessarily the latest and greatest immersion lithography machines that are used to produce these layers. In a given chip, there may be one or two more complicated layers that are made using an EUV lithography machine, but the rest can often be printed using ‘older’ technology such as dry lithography systems. This is certainly more cost-effective for customers, since these older machines are less expensive to purchase and maintain. Read about how dry lithography systems are enabling progress.
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Semiconductor Manufacturing Optics
No lithography without optics. No semiconductors without lithography. Without semiconductors there would be no microchips, without microchips no computers – no high-tech products. As an OEM (Original Equipment Manufacturer) supplier, ZEISS enables the semiconductor industry worldwide with optics and other optical modules.
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Refurbished Systems
Refurbishing ‘classic’ PAS 5500 and TWINSCAN lithography systems for a new life and a new purpose
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Patterning Simulation
KLA’s patterning simulation systems use advanced models to explore critical-feature designs, manufacturability and process-limited yield of proposed lithography and patterning technologies. Our patterning simulation software allows researchers to evaluate advanced patterning technologies, such as EUV lithography and multiple patterning techniques, without the time and expense of printing hundreds of test wafers using experimental materials and prototype process equipment.
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Semiconductor
Aerotech has a long history of engineering and manufacturing motion systems and components for high precision wafer processing, scanning electron microscopy (SEM), wafer bumping, 450 mm wafer manufacturing, lithography equipment and advanced laser micromachining. We also specialize in systems and components for vacuum applications, such as EUV lithography. So whether you need off-the-shelf wafer bumping components or a custom-engineered SEM system manufactured and tested to exacting specifications, Aerotech can provide the optimal solution for your application.
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Laser Head
5517FL
The Keysight 5517FL is used primarily in VME and PC based laser interferometer systems where the velocity of motion is faster, such as semiconductor lithography and flat panel applications. Please contact Keysight for custom requirements.
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Laser Head
5517EL
The Keysight 5517EL is used primarily in VME and PC based laser interferometer systems where the velocity of motion is faster, such as semiconductor lithography and flat panel applications. Please contact Keysight for custom requirements.
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Laser Head
5517GL
The Keysight 5517GL is used primarily in VME and PC based laser interferometer systems where the velocity of motion is faster, such as semiconductor lithography and flat panel applications. Please contact Keysight for custom requirements.
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Laser Head
5517DL
The Keysight 5517DL is used primarily in VME and PC based laser interferometer systems where the velocity of motion is faster, such as semiconductor lithography and flat panel applications. Please contact Keysight for custom requirements.
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Laser Head
5517D
The Keysight 5517D is used primarily in VME and PC based laser interferometer systems where the velocity of motion is faster, such as semiconductor lithography and flat panel applications. Please contact Keysight for custom requirements.
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Laser Interferometers
ZYGO laser interferometers support and enable the most demanding metrology applications in industries from semiconductor and lithography to space-borne imaging systems, cutting-edge consumer electronics, defense-related IR and thermal imaging systems and ophthalmics.
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Reticle/Mask Particle Remover
RP-1
The RP-1 automatically removes particles from the reticle/mask by air (or N2) and vacuum suction. Routinely removing the particles before the lithography process extends the replacement cycle of the pellicle and cleaning cycle of the mask, thereby contributing to a reduction in running costs.
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Automated Measurement System
EVG®40NT
The EVG40 NT (stand-alone tool) and the AVM (HVM-integrated module) enable measurement of lithography relevant parameters like critical dimension, as well as bond alignment accuracy.Because of the high-measurement accuracy, it is possible to verify compliance to tight process specifications and instantly optimize integrated process parameters.
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UV LED Light Source
Model 32
This new UV LED lightsource is designed and engineered by the proven lithography experts at OAI. The lightsource delivers a number of unique benefits, the most consequential of which is consistent intensity over an exceptionally long life. The lightsource is highly energy efficient, requires no maintenance or light replacement, and contains no mercury.
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Electrostatic chucks
Semiconductor substrates such as Si wafers or masks for the next generation of extreme ultraviolet lithography (EUVL) are handled in a vacuum. For nm structures and exact overlay, the reproducibility of the substrate evenness is a crucial factor, as unevenness results in structural distortions. Particles are problematic and heat input as well as thermal expansion must be taken into account.
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CCD Foundry Services
Teledyne DALSA Semiconductor’s 150mm CCD process offers surface or buried channel operation at up to 15V with two or three layers of polysilicon and one, two or three layers of metal. A modular processing approach allows our foundry customers to adjust process parameters to meet the most demanding requirements for CTE (>99.999%), charge storage capacity, and dark current (<1nA/cm2). The base process uses 1X projection lithography with 2.5µm design rules, allowing die sizes of up to 100mm X 100mm. Where required, tighter alignment tolerances and smaller feature sizes can be obtained by using 5X lithography, using a mix and match or all-stepper approach. The maximum die size attainable with the stepper is 22mm X 22mm, but larger sensors can be fabricated using stitching.
