CSP
Test connector assemblies that mate with the pads on an integrated circuit's chip size packaging.
See Also: WLCSP
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2D/3D AOI Series
MV-6e
- Exclusive10MP/18MPCameraTechnology- Precision Telecentric Compound Lens Design- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Extremely Simple Programming and Operation- Integrated INTELLI-SCAN® Laser Inspection System- 3D Co-Planarity Inspection of Gull-Wing Leads, BGA and CSP - - -- Devices- Enhanced 3D Solder Paste Height Measurement Capability- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Digital Multi Channel Analyzer
DT5770
The DT5770 is a compact portable 16k Digital MCA for Gamma Spectroscopy, integrating analog front-end with programmable gain and possible AC coupling. It is ideally suited for high energy resolution semiconductor detectors, like HPGe and Silicon, connected to a Charge Sensitive Preamplifier (CSP). The unit can also properly operate directly connected to a PMT with inorganic scintillators (e.g. Nal or Csl scintillators), provided exponential pulse shape and decay time above 200 ns.
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EtherCAT Master Multi-Axis Motion Controllers
DMC-52xx0
The DMC-52xx0 EtherCAT Master is Galil Motion Control's first 32 axis motion controller. It is a pure EtherCAT controller capable of controlling up to 32 drives and 2 IO modules on one EtherCAT Network in a small, space efficient package. The DMC-52xx0 makes configuration and programming easy with just a handful of EtherCAT configuration commands and Galil’s intuitive, two-letter programming language. The DMC-52xx0 is offered in 2, 4, 8, 16, and 32 axis formats. Coordinated moves can be don...show more -
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µHELIX® Test Probes
Series S200, S300, S400, and S500
Test Probes for fine-pitch applications: CSP, BGA, SiP, SoC, flex-circuits, micro pcb, sub-mm center-to-center spacing, half mm, quarter mm spacing. Excellent for use in sockets, fixtures, and contactors for semiconductor testing and in coaxial installations.
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ISL911xx Family Of Buck-Boost/Boost Regulators
The ISL911xx buck-boost regulator family is capable of working with the ultra-small inductors and capacitors to fit within less than 14mm2 board footprint, making them the ideal 2A switching converter solution for space-constrained mobile devices. The advanced wafer-level CSP package requires only a single inductor and very few external components, which minimizes overall space requirements. The ISL911xx regulators’ 2.5MHz switching frequency further reduces the power supply solution size.
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Optical BGA Inspection
Imaging hidden solder joints of BGA, IBGA, FlipChip, CSP, CGA and SMD components
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Pick and Place Test Handler
MT9510 XP / x16
The MT9510 XP / MT9510 x16 is a universal pick-and-place handler for packages such as QFP, BGA, Micro-BGA, CSP, TSSOP, PLCC, PGA, LGA, MLP/MLF.
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Silver Ball Matrix Sockets
SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is r...show more -
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Solar Spectrophotometer
INCUS
INCUS is a portable spectrophotometer that allows the measuring of the receiver tube optical properties in the solar field of a parabolic trough CSP plant.
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Soldering Inspection Video Microscope
MS-1000
The MS-1000 is a highly portable microscope for exclusive use with BGA, CSP, and QFP. It is highly efficient in inspecting portions which cannot be inspected by the X-ray inspection method.Specifically, it is efficient for inspecting the following conditions: fillets of soldered balls, melted condition of soldered parts, cracks, defective soldering, etc.
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Test Sockets & Interposers
Silmat
Innovative technology platforms and multiple product families for BGA, LGA, QFN and CSP packages down to 0.3mm pitch. High frequency bandwidth > 40 GHz..
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Ultra High Speed Pick & Place
MC889
The MC889 is specially designed for the fast and highly precise loading of large batch sizes. This pick and place machine is equipped with an optical centering, "Vision on the Fly" system that guarantees the best possible measurement of SMD components (such as 0201, SOIC, PLCC, BGA, µBGA, CSP & QFP, as well as odd-shaped components) while completing placement at rates of 20,000 CPH.
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Universal Automated Programming System
4900
The 4900 is powered by the newest BPM 9th generation technology, which delivers the fastest programming speeds in the industry for MCU’s, eMMC HS400, NAND, NOR and Serial Flash devices. BPM 9th generation technology produces 200 MHz signals, allowing each byte of data to transfer in up to 2.5 ns. Up to 9 times faster than competing programmers. 3D Vision option inspects BGA, CSP, QFP, TSOP, SOIC and J-Lead devices for coplanarity, bent lead, pitch, width, diameter, standoff and XY errors.
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Universal Programmers
Xeltek engineers work around the clock to maintain the largest device library in the industry, so new devices are being added on a daily basis for EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, and MCUs. The majority of SuperPro universal programmers come equipped with a ZIF socket supporting up to 144 pins for programming a wide range of DIP devices; other chip package supported includes SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, and SCSP.
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Universal Programmer Superpro 6100N
Until now,Support 401 IC manufacturer, 103004 pcs devices and keeps growing.Features:Supports 87454 types of devices from 305 IC manufacturers (by 3/15/2013) and keeps growing.Supports EPROM、Paged EPROM、Parallel and Serial EEPROM、FPGA、PROM、FLASH(NOR & NAND)、BPROM、NVRAM、SPLD、CPLD、EPLD、Firmware HUB、Microcontroller、MCU;Supports devices with Vcc as low as 1.2V. Socket Adaptors available for DIP、SDIP、PLCC、JLCC、PGA、LGA、SOIC、SOJ、SOT、QFP、TQFP、PQFP、VQFP、MQFP、LQFP、TSOP、SOP、TSOPII、PSOP、SSOP、TSSOP、SON、E...show more -
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X-ray Inspection System
NEO-690Z / NEO-890Z
Off-line Microfocus X-ray Inspection System equipped with PONY ORIGINAL Direct Conversion X-ray Camera; SID-A50. Suitable for inspection of BGA, CSP, and LGA on PCB.