Showing results: 16 - 30 of 538 items found.
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Eurofins E&E
Helping you determine the root cause of product failures and evaluate products against industry competition and standards.We provide third-party verification and support for claims related to performance versus competition, root product failure cause, and benchmark industry performance. As an independent laboratory with over 60 years of product testing experience, our expertise helps you evaluate products for a variety of performance related characteristics. Additionally, we can provide expert witness legal testimony for insurance claims, CPSC filings, and civil/criminal court cases through our testing results and data.
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Sentris -
OptoTherm, Inc.
Due to the continued decrease in integrated circuit feature size and supply voltages, detecting and locating the miniscule amount of heat generated by failure sites has become increasingly difficult. Sentris pinpoints low-level infrared thermal emissions from IC faults such as short circuits and leakage current.
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Maintenance Reliability Group, LLC
Root Cause Analysis of Grease Lubricated Components: Root cause analysis includes a complete root-cause failure report and recommendations for further monitoring and corrective actions. MRG will test for grease consistency, oxidation, product contamination and wear metals utilizing Grease Thief® Analyzer die extrusion test, FTIR, RULER and RDE Spectroscopy. Testing includes Analytical Ferrography and Rheometer testing. Testing can include the submission of a failed component for extraction of grease from failed component and visual inspection for Root Cause Analysis.Root Cause Analysis of Grease Lubricated Components: Root cause analysis includes a complete root-cause failure report and recommendations for further monitoring and corrective actions. MRG will test for grease consistency, oxidation, product contamination and wear metals utilizing Grease Thief® Analyzer die extrusion test, FTIR, RULER and RDE Spectroscopy. Testing includes Analytical Ferrography and Rheometer testing. Testing can include the submission of a failed component for extraction of grease from failed component and visual inspection for Root Cause Analysis.
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NX20 -
Park Systems Corp.
There's no room for error in the data provided by your instruments. Park NX20, with its reputation as the world's most accurate large sample AFM, is rated so highly in the semiconductor and hard disk industry for its data accuracy.
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DPA Components International
DPACI's component analysis laboratory performs major analytical functions, such as destructive physical analysis, failure analysis, counterfeit analysis, and material analysis on components & devices. Our destructive physical analysis techniques are performed in accordance with standards and methods used in most military and space program requirements. Solutions for difficult production problems are resolved through our failure analysis procedures.
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Micro Magnetics
Micro Magnetics offers failure analysis services on a contractual basis. We maintain two current density metrology systems at our headquarters in Fall River and can produce maps of current flow in a wide variety of ICs and packages, usually with initial results delivered within 48 hours. Our engineers will work closely with you to understand and interpret the results in order to determine the root cause of the failure.
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Materials Analysis Technology Inc.
MA-tek provides wide span of materials analysis, structure analysis, surface analysis, and failure analysis. By technology segment, MA-tek provides 9 major service lines:1. Electrical Failure Analysis (EFA). 2. Physical Failure Analysis (PFA). 3. Structure Analysis. 4. Surface Analysis. 5. FIB Circuit Editing6. Reliability Testing. 7. Reverse Engineering of Benchmark Analysis. 8. IP Consultancy. 9. Quality Management Training Course.
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National Technical Systems
From cheap toys and smartphones to sophisticated computers and radar detector systems, printed circuit boards (PCB) are critical components for today’s electronic and industrial technology. Almost every electronic device has one of these self-contained modules of complex interconnected electronic components, which include resistors, capacitors, transistors, diodes and fuses.
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National Technical Systems
Destructive Physical Analysis (DPA) is the process of disassembling, testing, and inspecting electronic components to verify the internal design, materials, construction, and workmanship. This process of sample inspection is used to help ensure that electronic components are fabricated to the required standards. Destructive Physical Analysis is also used effectively to discover process defects for identification of production lot problems.
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BAT-200 -
Amprobe Test Tools
Check the batteries! Battery failure is often the common cause for the sensor or instrument failure. Simple to use, portable universal battery tester for the standard and rechargeable batteries.
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Teseda Corporation
The original Teseda system for bench-top stimulus, test pattern debug, validation, device failure mode stimulation in-situ with other Failure Analysis lab equipment such as an EMMI, etc.
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Materials Evaluation and Engineering
Some problems require solutions beyond the standard test methods and procedures routinely performed at MEE. Replicating the suspected cause of failure on an exemplar part can provide valuable information about the likelihood of that failure case. Likewise, intentionally causing component failures in a variety of ways can provide insight into possible failure scenarios. Wondering how (or if) a design or part can be tested? Give us a call – the engineers and technicians at MEE enjoy the hands-on experience of designing customized testing plans for your unique challenges.
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BLASTGUARD -
Kelvatek Ltd.
BLASTGUARD mitigates against the effect of Underground Distribution Box (UDB) failures by safely absorbing and dispersing the kinetic energy, while protecting against the heat energy from an explosive failure.
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Iris Power LP
Online monitoring of shaft and bearing vibration to identify various failure mechanisms including unbalance, misalignment, looseness, bearing wear, rubbing, hydraulic problems, electrical problems, resonance, and eccentricity of rotating parts prior to failure.
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X-COM Systems
The Monitor family includes a range of products that not only measure power and VSWR but also provide hard contact alarms to protect your system in the event of a system failure – the IP-enabled, BPME is even capable of emailing a failure notification.