Showing results: 586 - 600 of 1289 items found.
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Evident Scientific
The objective lens is the most complex and the most important component in a microscope. The multi-element design of these lenses works to produce the real image, which is then seen through the ocular lens. With Olympus’ range of microscope objective lenses, we provide outstanding optical performance from visible light to near infrared.
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E-CAM130_CUXVR -
e-con Systems Inc.
e-CAM130_CUXVR is a synchronized multiple 4K camera solution for NVIDIA® Jetson AGX Xavier™ development kit that has up to four 13 MP 4-Lane MIPI CSI-2 camera boards. Each camera is based on the camera module e-CAM137_CUMI1335_MOD, 1/3.2" AR1335 color CMOS image sensor from ON Semiconductor® and integrated high performance Image Signal Processor (ISP). All these four cameras are connected to the base board using 30 cm micro-coaxial cable. These four 4-lane MIPI camera modules can be synchronously streamed in 4K resolution, which will be best fit for high end multi camera solution. Customers can opt to purchase anything between single camera to four cameras as according to their requirement.
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e-CAM31_MI0330_MOD -
e-con Systems Inc.
e-CAM31_MI0330_MOD is a high performance, small form factor, 3.4 MP Autofocus Low Light Camera Module with Liquid Lens. It is based on AR0330 CMOS Image sensor from ON Semiconductor®. This Autofocus Liquid Lens Camera Module has slave mode for precise frame-rate control and for synchronizing two sensors. e-CAM31_MI0330_MOD – Liquid lens camera module has superior low light performance. It supports Full HD @ 60fps for maximum video performance. It also has a support for external mechanical shutter and an on-chip phase-locked loop (PLL) oscillator. The dedicated ISP performs the entire Auto functions like auto white balance, auto exposure control in addition to complete image signal processing pipeline.
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e-CAM40_CUMI4682_MOD -
e-con Systems Inc.
The e-CAM40_CUMI4682_MOD is a 4 MP RAW RGB-IR MIPI OV4682 camera module with the M12 S-mount lens holder. The e-CAM40_CUMI4682_MOD RGB IR camera module is based on OmniVision's OV4682 1/3" Optical format CMOS Image sensor, that captures high-resolution images and videos as well as IR information. Its dual RGB-IR Camera capabilities allow it to bring a host of additional features to machine vision applications and by combining RGB - IR in a single camera module reduces the total cost and saves space. Customers can evaluate e-CAM40_CUMI4682_MOD with See3CAM_CU40 over USB 3.0 interface and e-CAM40_CUTK1 over MIPI interface. e-CAM40_CUMI4682_MOD camera module can stream the 4MP(2688x1520) unprocessed 10-bit RAW data video upto 40 fps.
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FLIR E86 -
Teledyne FLIR
The FLIR E86 is packed with the high-performance features needed for fast, accurate detection of hot spots and hidden deficiencies. This 464 × 348 pixel thermal camera has an expanded temperature measurement range for easier detection of hot spots and hidden anomalies on electrical and mechanical assets. Interchangeable AutoCal™ lenses offer complete coverage of near and distant targets, while FLIR imaging technology such as UltraMax® and MSX® ensure crisp, vibrant thermal images. The onboard FLIR Inspection Route runs pre-planned routes to help you stay organized when surveying large or multiple locations. FLIR Ignite provides automatic uploading of E86 images directly from the camera to the cloud for easy, secure storage and sharing.
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CB160MG-LX-X8G3 -
XIMEA GmbH
4K at 500 Fps High speed, compact, fast camera for: Vehicle Impact, Airbag Deployment and Safety Restraints Testing, Digital Image Correlation (DIC), Projectile, Explosives, Ballistics, Combustion and Missile Launch Tracking, Fluid and Flow Visualization, Sports Broadcasting, Commercial Film, Television and Studio Production, Fluidics and Particle Image Velocimetry (PIV), Flat panel inspection (FPD), printed circuit board (PCB) examination and more.
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CB160CG-LX-X8G3 -
XIMEA GmbH
4K at 500 Fps High speed, compact, fast camera for: Vehicle Impact, Airbag Deployment and Safety Restraints Testing, Digital Image Correlation (DIC), Projectile, Explosives, Ballistics, Combustion and Missile Launch Tracking, Fluid and Flow Visualization, Sports Broadcasting, Commercial Film, Television and Studio Production, Fluidics and Particle Image Velocimetry (PIV), Flat panel inspection (FPD), printed circuit board (PCB) examination and more.
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CB019MG-LX-X8G3 -
XIMEA GmbH
Full HD, High speed, compact, fast camera for: Vehicle Impact, Airbag Deployment and Safety Restraints Testing, Digital Image Correlation (DIC), Projectile, Explosives, Ballistics, Combustion and Missile Launch Tracking, Fluid and Flow Visualization, Sports Broadcasting, Commercial Film, Television and Studio Production, Fluidics and Particle Image Velocimetry (PIV), Flat panel inspection (FPD), printed circuit board (PCB) examination and more.
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CB019CG-LX-X8G3 -
XIMEA GmbH
Full HD, High speed, compact, fast camera for: Vehicle Impact, Airbag Deployment and Safety Restraints Testing, Digital Image Correlation (DIC), Projectile, Explosives, Ballistics, Combustion and Missile Launch Tracking, Fluid and Flow Visualization, Sports Broadcasting, Commercial Film, Television and Studio Production, Fluidics and Particle Image Velocimetry (PIV), Flat panel inspection (FPD), printed circuit board (PCB) examination and more.
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Linkam Scientific Instruments
Standard upright microscopes were not designed to work with temperature controlled stages. Microscopes are optimized to get the best possible image for a number of different techniques (phase contrast, DIC, polarized etc...) Unfortunately due to the confines of the standard microscope frame, it is not easy to get samples under the objective lens and into the stage.
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Pepperl+Fuchs GmbH
Image processing is one of the most crucial and challenging sensor technologies of the future. Until recently, integrating vision sensors into practical applications was difficult and extremely expensive. Today, vision sensors can be implemented in a wide variety of industries and applications, offering cost advantages over standard solutions in difficult sensing environments.
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Chameleon3 USB3 -
Teledyne FLIR
The Chameleon®3 camera family combines the ease-of-use of USB3, small size, flexibility of board-level versions, and popular CCD and CMOS image sensors into an affordable package. For FLIR cameras with the latest sensors and most advanced feature sets, please refer to Blackfly S and Oryx camera families.
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Curtiss Wright IMR Test Labs
The metallurgical group is well equipped and staffed (9 full-time metallurgists and technicians) to evaluate materials ranging from cast iron to superalloys to composites. They are experienced in classical metallographic techniques, as well as the latest preparation methods. Advanced analytical tools such as image analysis and scanning electron microscopy (SEM) are used in their evaluations.
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Teledyne DALSA
The Xtium2 series leverages the PCIe Gen3 x8 platform to deliver high- speed image transfers to host memory without CPU overhead. Featuring Camera Link HS® interface standards, supports Active Optic Cable and SFP+ modules, CoaXpress® 12, and Camera Link®.
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Landviser, LLC
The resistivity survey method is more than 100 years old and is one of the most commonly used geophysical exploration methods (Reynolds, 1997). It has been used to image targets from the millimeter scale to structures with dimensions of kilometers (Linderholm et al., 2008; Storz et al., 2000).