Showing results: 31 - 45 of 144 items found.
-
MPI Probe Card Technology
The Osprey probe card is MPI’s solution to demand for ever finer pitch. It is designed for smaller Al pad, and is ideal for tiny pitch application with peripheral and full array pattern. With precise alignment and better planarity control, Osprey can reach higher productivity by multi-DUT design. The forming wire (FW) type needle produced with MPI’s own micro fabrication process not only delivers high-quality performance but also allows easy needle replacement and shortens maintaining cycle time.
-
ViProbe® -
FEINMETALL GmbH
FEINMETALL ViProbe® is based on the original "buckling beam" technology providing a truly vertical contact.The beams are precisely held in position by guiding plates. The low deviation of force versus overdrive ensures a high insensitivity to planarity differences.
-
Onto Innovation
Automated probe card test and repair is used to monitor probe card health to ensure cards are ready and capable of testing semiconductor devices. In cases where the card is not meeting performance specification, repairs may be performed such as tip adjustment or card cleaning, thus returning the card quickly to a production state.
-
Celadon
Over the last 20 years the Celadon Engineering team has developed an expertise in cryogenic materials which has resulted in a solid reputation in the industry for producing extremely stable cryogenic on-wafer probe cards as well as DUT probing solutions. These Cryogenic probe cards have all the benefits of Celadon’s Crash Resistant™ probe technology but with the ability to probe as cold as humanly possible. Celadon’s cryogenic solutions vary from standard VersaTile™ footprints which interface to positioners to innovate custom PCB based designs to allow for flexibility when testing at these very cold temperatures. Lakeshore cryogenic wire is used in standard DC solutions for high density cable-out designs to support high pin count applications. During the development process, Celadon works closely with the cryogenic prober vendor to ensure the integrated solution is optimized for current and future testing needs.
-
SpringTouch -
SV Probe, Inc.
Wafer Level Chip Scale Package is fast becoming popular because of its small form factor utilized in such applications as Wifi, Bluetooth and GPS units. The WLCSP is also very cost-effective with a simplified manufacturing process that eliminates the need for the final or package test step..
-
VC20TM Fab -
Celadon
*Maximum channel count: 48*Tester platforms: Keysight 4062, 4072, 4080, Keithley S600, S530, Rack and Stack configurations.*Minimum Pad Size: 30ux30u (tunable scrub)*Contact Resistance: less than 1 ohm*Temperature range: -65C to 200C*Leakage: Less than 5 femto Amps per volt. If you require faster settling time*Repairable*Lifetime Performance: Production customers are experiencing 10M+ million touchdowns on Aluminum and Copper pads. Few to no rebuilds due to pobe wear
-
Integrated Technology Corp.
ITC has a complete range of probe card metrology products that address all probe technologies, probe card sizes and probe counts.
-
Test Spectrum, Inc.
Test Spectrum can provide generic Probe Cards, Probe Interface Boards (PIB), and loadboards. Choose from existing configurations already designed, or a generic test board for your specific tester configuration can be designed quickly.Teradyne J750 Probe Card and PIB; Teradyne Integra Flex PIB; Teradyne Ultra Flex PIB; Teradyne Catalyst PIB; Credence Quartet PIB (Probe Interface Board); Advantest 93K 1024 PIB
-
VC Series -
Japan Electronic Materials Corp.
*Vertical contact Probe Card*No limitation by Pad layout*Large probe area (Suitable for 200mm wafer 1-shot)*Small scrub mark*Suitable for High/Low Temperature Test
-
CE Series -
Japan Electronic Materials Corp.
*Standard Cantilever Probe Card*Low Contact force*Stable Contact*High accuracy of alignment*Suitable for variety of Devices
-
GX5642 -
Marvin Test Solutions, Inc.
The GX5642 is a 3U PXI instrument card that can be used for general data acquisition, process control, Automatic Test Equipment (ATE), Functional Test, and factory automation applications. The GX5642 consists of 64 bi-directional TTL-to-differential LVDS I/O channels. Each channel has two ports (TTL and LVDS) and can be individually set to operate in either conversion or static I/O modes.
-
-
Quadro-E PEG P4000 -
ADLINK Technology Inc.
The Quadro-E PEG P4000 perfectly balances performance, features, and compact form factor to deliver exceptional creative experience and productivity across a variety of 3D applications. The Pascal GPU with 1792 CUDA cores, 8GB GDDR5 onboard memory and support for up to four 8K (7680×4320 @ 60 Hz) native displays accelerate product development and creation workflow demanding fluid interactivity for large, complex 3D workpieces.
-
Quadro-E PEG P2200 -
ADLINK Technology Inc.
The Quadro-E PEG P2200 perfectly balances performance, features, and compact form factor to deliver exceptional creative experience and productivity across a variety of 3D applications. The Pascal GPU with 1280 CUDA cores, 5GB GDDR5 onboard memory and support for up to four 5K (5120x2880 @ 60Hz) native displays accelerate product development and creation workflow demanding fluid interactivity for large, complex 3D workpieces.
-
GX3232 Series -
Marvin Test Solutions, Inc.
The GX3232 is a multi-channel 16-bit, analog input and output cPCI module, supporting 32 single-ended or 16 differential input channels and four analog output channels. The inputs can be software configured for differential or single-end operation and are sequentially scanned with a maximum aggregate scan rate of 300 kS/s. Three input ranges are software-selectable: ±10 V, ±5 V or ±2.5 V. Optionally, the GX3232 is available with a high voltage input configuration and supports three ranges: ±60 V, ±30 V and ±15 V. The high voltage configuration supports 16 single-ended or 8 differential input channels for high voltage and 16 single-ended or 8 differential inputs for low voltage measurement. Four analog output channels provide software-selectable output ranges of ±2.5 V, ±5 V or ±10 V. The outputs can be updated either synchronously or asynchronously and support waveform generation. Each output can be clocked at rates up to 300 kS/s. A 16-bit digital I/O port is also provided, which supports 16 bidirectional data lines. Note that when used with a TS-700 system only 8 of these digital I/O lines are available at the test system's receiver interface.