Showing results: 16 - 30 of 69 items found.
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PN-12α -
NAPSON Corp.
*Thermo electrode and cold electrode is mounted detecting part of measuring probes*Possible to check most figure of sample such as single crystalline silicon wafer, bulk, ingot and so on*Please select from 2 types;1) 2 probe ver.(Hot probe, Cold probe),2) 1 probe ver.(Hot & Cold probe)
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ES62X-CMPS -
ESDEMC Technology LLC
The ES62X-CMPS compact manual probe station is a rugged wafer probing solution designed for high reliability, compact size and low investment cost. It enables manual wafer level measurements up to 300 mm wafers. The probing station can also be used for TLP, HMM, HBM, LV-Surge, RF, S-parameter and DC-measurements. Micro positioners with vacuum as well as magnetic base can be attached. The chuck has a vacuum interface for the wafer and is electrically isolated. Multiple 4 mm connectors can be used to connect a voltage potential to the wafer backside.
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Materials Development Corporation
Materials Development Corporation offers the complete line of Four Point Probe systems from AIT. Systems are available to measue up to 12" diameter (300 mm) wafers as well as specialty systems for Photovoltaic wafers and substrates. For more information on these systems, contact MDC.
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HS-PSRT -
HenergySolar
It use Four Probe to test the resistivity and P/N type of wafers、ingots and all type of silicon materials.It can be used by Solar and Semiconductor industry.
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T90™ Series -
Celadon
The 90 mm tile was designed for mounting on a standard 4.5″ probe card holder for multi-site wafer level reliability testing. The 1.6 mm (0.062″) thick rails allow the chassis to slip into planarity adjustable probe card holders for most analytical probe stations.
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Materials Development Corporation
MERCURY PROBES are precision instruments that enable rapid, convenient, and non-destructive measurements of semiconductor samples by probing wafers with mercury to form contacts of well-defined area.
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Smiths Interconnect
Smiths Interconnect offers Wafer Level Chip Scale Package (WLCSP) Probe Heads utilizing spring probe technology which provide high parallelism in test, superior signal integrity and high speed / RF testing capability.
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Model CRX-4K -
Lake Shore Cryotronics, Inc.
The Model CRX-4K is a versatile cryogen-free micro-manipulated probe station used for non-destructive testing of devices on full and partial wafers up to 51 mm (2 in) in diameter.
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Model TTPX -
Lake Shore Cryotronics, Inc.
The Model TTPX is a versatile cryogenic micromanipulated probe station used for non-destructive testing of devices on full and partial wafers up to 51 mm (2 in) in diameter.
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Model FWPX -
Lake Shore Cryotronics, Inc.
The Model FWPX is a versatile cryogenic micro-manipulated probe station used for nondestructive testing of devices on full and partial wafers up to 102 mm (4 in) in diameter.
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Creative Design Engineering, Inc.
*Type: Table Top*Wafer load: open cassette*Wafer size: 4" to 8"*Mini Environment: N/A *Probe Changer: N/A *Aligner: N/A*Size: 12" x 28" x 10"*Range: 1m/ to 10M/*Accuracy: 0.5%*Repeatability: 0.02% *Static Repeatability: 0.1% dynamic
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TestEdge, Inc.
TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
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Model EMPX-HF -
Lake Shore Cryotronics, Inc.
The Model EMPX-HF is a versatile cryogenic electromagnetbased micro-manipulated probe station used for nondestructive testing of devices on full and partial wafers up to 25 mm (1 in) in diameter.
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Model CPX-VF -
Lake Shore Cryotronics, Inc.
The Model CPX-VF is a versatile cryogenic micromanipulated probe station used for non-destructive magnetic testing of devices on full and partial wafers up to 51 mm (2 in) in diameter.
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VIEW Micro-Metrology
VIEW offers a full line of optical metrology systems for wafer, photomask, slider, MEMS, semiconductor package, HDD suspension, probe card, and micro-component process measurements.