Showing results: 226 - 227 of 227 items found.
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Model 5950 -
Pentek, Inc.
- Now available in RFSoC Gen 3 with the Model 5953- Multi-board synchronization with Quartz RFSoC video- Supports Xilinx Zynq UltraScale+ RFSoC FPGAs- 16 GB of DDR4 SDRAM- On-board GPS receiver- PCI Express (Gen. 1, 2 and 3) interface up to x8- LVDS connections to the Zynq UltraScale+ FPGA for custom I/O- Optional VITA-66.4 optical interface for backplane gigabit serial communication- Dual 100 GigE UDP interface- Compatible with several VITA standards including: VITA-46, VITA-48, VITA-66.4, VITA-57.4 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Model 8257 1-Slot 3U VPX Development Chassis for Quartz Products- Model 4801 Carrier Design Kit for designing custom carrier for the Model 6001 QuartzXM- Model 6001 unique QuartzXM eXpress module enables migration to other form factors- Pentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Synchronize up to eight modules with Model 5903 High-Speed System Synchronization and Distribution Amplifier - 3U VPX
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MIC-6330 -
Advantech Co. Ltd.
Based on the Intel® Xeon® E3 Lv5 and Lv6 embedded platform, the MIC-6330 builds on the success of Advantech’s 6U VPX boards, and is the first 3U VPX product launched by Advantech. Together with the Intel® processor, the MIC-6330 offers intense computational ability in a very compact form factor. The MIC-6330 provides configurable connectivity (up to four ports) of PCI Express via the backplane to the highest performance mainstream peripherals and I/O cards, and vast I/O functions for extended interconnectivity and controllability. The MIC-6330 meets various computing needs, including vPro™ and workstation capabilities, by using the Intel® CM236/CM238 PCH. The MIC-6330 offers high storage capacity at up to SATA 6Gbps transfer speed. Four USB2.0 ports and one USB 3.0 port to the backplane fulfill requirements for extra I/O ports or storage, up to 5Gbps data rate. Four GbE ports (two ports configurable as SERDES) support system level IP connectivity, and the UART interfaces (RS-232/422/485 selectable) can be leveraged as an interface to legacy devices and consoles. Like Advantech’s 6U VPX products, the MIC-6330 supports multiple displays, and the maximum resolution of the MIC-6330 is 4K, empowered by the Intel® integrated graphics engine. The MIC-6330 also offers a High Definition Audio to the backplane interface for media demands. With the standard ruggedized convection cooled heatsink or the optional air-cooled heatsink, the MIC-6330 is tailored for harsh environmental applications and adaptable to various chassis designs. The industrial NAND Flash, and the soldered onboard DDR4 ECC memory chips are appropriate for a variety of vehicle applications for the maximum reliability. The MIC-6330 is sophisticated and suitable for various purposes. An onboard X8D XMC site with PCIE x8 gen.3 connectivity can host high speed offload or I/O mezzanines for project-specific applications. For applications that need the maximum expandability, the XMC interface can be modified to add another DisplayPort and the 2 more UART. The optional front I/O module facilitates the development and qualification process, and also enables the possibility of the front panel access.
