Showing results: 91 - 105 of 108 items found.
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SideChek / SideChek PLUS Series -
Mettler-Toledo, LLC
The SideChek range of single beam x-ray systems are designed to meet the high speed and high coverage needs of the food processing and packaging industries. Dedicated x-ray systems for a wide range of container sizesDepending on the largest container size that will run on a production line either the 300 or 400 model of the SideChek x-ray system range can be selected. The x-ray beam geometry is fixed on these two models and any container that fits inside the fixed beam angle can be inspected.
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ARAMIS -
GOM GmbH
ARAMIS is a non-contact and material-independent measuring system based on digital image correlation (DIC). It offers a stable solution for full-field and point-based analyses of test objects of just a few millimeters up to structural components of several meters in size. The system performs high-precision measurements with a 3D image resolution in the submicrometer range, regardless of the specimen’s geometry and temperature. There is no need for a time-consuming and expensive preparation. For statically or dynamically loaded specimens and components, ARAMIS provides accurate
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Thorlabs, Inc.
Thorlabs' GL16 End Face Interferometer measures and images the end face geometry of single- and multi-fiber connectors. A non-contact technique called scanning white-light interferometry (SWLI) provides high accuracy, repeatability, and reliability for fiber connector testing, particularly for pass/fail testing using IEC or Telcordia requirements. The system can be controlled locally through the touchscreen display or remotely through a browser-based application (see Software tab for details), allowing it to be easily integrated on the production floor.
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S14 -
Photon Kinetics
The S14 Refractive Index Profiler complements optical fiber preform analysis measurements by providing highly accurate and precise characterization of the refractive index profile of drawn single-mode, multimode, and specialty fibers using the RNF (Refracted Near Field) technique. The S14 index profile data produces fiber geometry information directly. Manufacturers can also use S14 data for the prediction of fiber transmission parameters such as mode field diameter, cut-off wavelength, and chromatic dispersion.
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Phoenix Aerial Systems
The RANGER-ULTRA is an airborne laser scanner with an impressive combination of weight, range, accuracy and pulse rate. It is equipped with a unique forward and rear looking FOV designed to minimize laser shadowing and provide geometry on complex vertical structures on a single pass. With its wide field of view of 100 degrees and an extremely fast pulse repetition rate of up to 1.8 MHz, the RANGER-ULTRA is perfectly suited for high point density corridor mapping applications such as power line, railway track and pipeline inspection.
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7000 Series -
Reltech Limited
With ever decreasing geometries, the way we perform HTOL requires careful consideration. In lower geometry device leakage currents are not only higher but vary greatly. Temperature control at DUT level – required to achieve correct junction temperature at every DUT. For higher geometries, HTOL can be performed in a more traditional way but with devices consuming more power, the ambient temperatures required varies greatly. Multiple temperature zones are required – multi zones system or multiple smaller HTOL systems.
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DRK8620 -
Shandong Drick Instruments Co., Ltd.
WSC-S Colorimeter measurement is a superior performance, versatile and convenient operation colorimeter,suitable for the determination of various objects reflection color, whiteness test, chromaticity and color object with two objects. It is equipped with a geometry test head, that the provisions of CIE 0 / d. WSC-S Colorimeter measurement with two portable desktop, digital display, and available for print. The instrument can be widely used in textiles, dyes, printing and dyeing, paper, building materials, ceramics, food, printing, metrology and other departments.
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ASTM D257 -
National Technical Systems
These test methods cover direct-current procedures for the measurement of dc insulation resistance,volume resistance, and surface resistance. From such measurements and the geometric dimensions of specimen and electrodes, both volume and surface resistivity of electrical insulating materials can be calculated, as well as the corresponding conductances and conductivities. These test methods are not suitable for use in measuring the electrical resistance/conductance of moderately conductive materials. Use Test Method D4496 to evaluate such materials. This standard describes several general alternative methodologies for measuring resistance (or conductance). Specific materials can be tested most appropriately by using standard ASTM test methods applicable to the specific material that define both voltage stress limits and finite electrification times as well as specimen configuration and electrode geometry. These individual specific test methodologies would be better able to define the precision and bias for the determination.
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PP007-WS-1 -
Teledyne LeCroy
The PP007 embodies leading technology in passive probe design. The small probe is optimized for maximum waveform fidelity, including high frequency signal components, in a rugged probe suitable for every day.The sharp probe tip* is spring loaded, allowing it to retract into the narrow probe head. The tip does not slip off the object being probed—important when probing small geometry surface-mounted components. Probing dense circuits is easier with the small 2.5 mm ground sleeve, which provides much better visibility than 5 mm and 3.5 mm probes.
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PP007-WR-1 -
Teledyne LeCroy
The PP007 embodies leading technology in passive probe design. The small probe is optimized for maximum waveform fidelity, including high frequency signal components, in a rugged probe suitable for every day.The sharp probe tip* is spring loaded, allowing it to retract into the narrow probe head. The tip does not slip off the object being probed—important when probing small geometry surface-mounted components. Probing dense circuits is easier with the small 2.5 mm ground sleeve, which provides much better visibility than 5 mm and 3.5 mm probes.
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WIKA Alexander Wiegand SE & Co. KG
When the compression force transducer has a through hole, it is called a ring force transducer (donut load cell) or a force measuring ring. These force transducers are extremely robust and are suitable for the detection of very high (static) forces. Furthermore, they are suitable for many installation situations. The ring geometry is used in force measurement for a wide variety of spatial conditions. The main fields of application are found in spindle presses, in screw force measurement or even in geotechnology. WIKA offers electrical and hydraulic ring force transducers in diameters from 12 millimetres up to 430 millimetres as well as in various installation heights. Discover our portfolio now.
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Kistler Instrument Corp.
In universities and industry, for basic research or quality assurance: Kistler torque sensors guarantee precise definition of the power and friction values of drives, transmissions and pumps. Strain gage technology (DMS) is a powerful solution for measurements on rotating shafts, and also for long-term dynamic and static measurements. Maximum precision, the most rigid structure possible and high temperature stability: thanks to these assets, DMS sensors can accomplish the most demanding tasks. Piezoelectric reaction torque sensors offer convincing features such as exceptional overload protection, high signal resolution and a wide frequency range. They are ideal for measurement tasks when conditions are difficult due to geometry, temperature range or dynamics.
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AEC -
Altair Engineering, Inc.
Altair's architecture, engineering, and construction (AEC) solutions offer unparalleled productivity for building and non-building structures with their advanced versatility, integration, and data management capabilities. Our analysis and design solutions simulate responses to a range of dynamic, nonlinear loading conditions, including wind, snow, water, seismic, blast, dead, live, and moving loads – all while ensuring design resiliency and regional code compliance. Extensive data transfer links enable seamless import and export cycles between analysis and design solutions, building information modeling (BIM) systems, and CAD platforms. Design and optimize concrete, steel, and mass timber structures for report-ready results. In addition, evaluate complex geometry and structural models that go beyond standard building code designs, ensuring strength and safety for any model.
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Titan Enterprises Ltd
Titan’s small turbine flowmeter range use a radial flow principle based on the Pelton wheel technique. This well proven method is the ideal way of measuring low rates of flow of low viscosity liquids. For these mini flowmeters, a jet of fluid is directed at a turbine that is mounted on robust low friction sapphire bearings. The geometry of the turbine and the fluid chamber ensures that the rotational speed of the rotor is proportional to the flow rate through the device. The use of this radial arrangement allows more energy to be imparted into the turbine, so the bearing drag is far less important. Furthermore, because more energy is available the bearings themselves can be a lot stronger so increasing the life of the flowmeter. For larger flows, some of the liquid can bypass the turbine chamber, which then behaves as a “shunt” to the metered fluid. Accuracy is still maintained and the output remains linear.
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KLA-Tencor Corp
KLA’s substrate manufacturing portfolio includes defect inspection and review, metrology and data management systems that help substrate manufacturers manage quality throughout the wafer fabrication process. Specialized wafer inspection and review tools assess wafer surface quality and detect, count and bin defects during production and as a critical part of outgoing wafer qualification. Wafer geometry systems ensure the wafer shape is extremely flat and uniform in thickness, with precisely controlled wafer shape topography. Data analysis and management systems proactively identify substrate fabrication process excursions that can lead to yield loss. KLA’s substrate manufacturing systems support process development, production monitoring and final quality check of a broad range of substrate types and sizes including silicon, prime silicon, SOI, sapphire, glass, GaAs, SiC, GaN, InP, GaSb, Ge, LiTaO3, LiNBO3, and epitaxial wafers.
