Filter Results By:

Products

Applications

Manufacturers

Showing results: 256 - 270 of 283 items found.

  • ARINC HSI / ADI Test Fixture

    TA-2000 - Tech-Aid Products

    The TA-2000 test fixture is a combination panel that incorporates all the standard capabilities of the legacy CTS-11(ADI) and CTS-12(HSI) panels and much more. This panel is married to our model TA-1001 dual synchro transmitter/API panel thus allowing for local stimulus and alignment of the instruments synchros and resolvers. The panel provides for testing of both superflag(28v) and low level meters through a matrix of switching that will allow testing of all meters simultaneously or just individually. The low level meter drive circuit also incorporates an automatic mode that will continuously oscillate the L/R and Up/Dn pointers.

  • Analog Laser Power Probes

    Macken Instruments, Inc

    Laser power measurements should be quick and easy. They should not involve time consuming set-up and alignment problems. Ideally, the measurements should also be able to be made at any point in an optical system where losses are likely to occur. Unfortunately, most laser power meters have sacrificed ease of use to gain continuous power readings. However, in most laboratory and production situations, the usual requirement is for a quick spot-check of power with a minimum of disruption. Even when tuning up a laser, researchers have found that it is best to tune for a desirable mode pattern.

  • Muzzle Velocity Radars

    MVR Series - Innovative Technical Systems

    The MVR Series of Muzzle-Velocity Radars are Doppler-CW transceivers that measure the velocity of viewed objects such as projectiles. They use phase-locked millimeter-wave transmitter-receivers along with an integrated radome-protected antenna to illuminate objects under investigation. An optical boresighting aid provides alignment assistance for the narrow radiation patterns. Reflected signals from the target are received by the antenna and mixed to produce a video output equal to the Doppler spectrum of the target. A low-noise, variable gain video amplifier can drive a 50-ohm cable up to +1 volt output. The video amplifier has a feed-forward DC offset compensation circuit that extends the Doppler frequency response from under 1 Hz to over 2 MHz. An integrated DMM and LCD display on the front panel monitors various test points within the sensor to verify proper operation. The extremely rugged design allows the MVRs to withstand high acousitic shock environments so they can be located in close proximity to the projectile source.

  • Signal Level Meter

    XR-3 - Applied Instruments, Inc.

    From satellite dish alignment, to UHF off-air antenna pointing, to cable TV MER measurements, the XR-3 is the meter for you! The XR-3 is the most capable meter offered by Applied Instruments. It's more durable than the popular Super Buddy meter, and has added features and performance. The XR-3's modular design with field swappable modules provides wide versatility to fit different measurement applications, including DBS satellite (i.e. Dish Network, DIRECTV, Bell TV, Shaw Direct), VSAT satellite (i.e. iDirect, Hughes Ku band, and more), VHF/UHF off-air (analog and ATSC digital), and CATV (QAM and analog). The XR-3 is great for installing and troubleshooting DISH SmartBox, Blonder Tongue, and other SMATV headend systems often used in hotels, multi-dwelling units, and institutional facilities. Modular Test Instrument. Satellite Finder. Installer Signal Meters. CATV Analyzer. Modules.

  • Confocal FLIM System

    DCS-120 - Becker & Hickl GmbH

    *FLIM Upgrade for Existing Conventional Microscope*Two Fully Parallel TCSPC FLIM Channels*Compact bh Simple-Tau or Power-Tau System*Scanning by Fast Galvanometer Mirrors*Channel Seperation by Dichroic or Polarising Beamsplitters*Individually Selectable Pinholes and Filters*One or Two BDL-SMN or BDS-SM ps Diode Lasers*Two Fully Confocal Detection Channels*Two HPM-100-40 GaAsP Hybrid Detectors*Optional: Two HPM-100-06 Hybrid Detectors, IRF Width < 20 ps FWHM*Optional: HPM-100-50 Hybrid Detectors for NIR FLIM*Optional: Multi-Wavelength FLIM*Excellent Time Resolution: Electrical IRF Width 6.5 ps FWHM*Time Channel Width Down to 813 fs*Megapixel FLIM, Up to 2048 x 2048 Pixels at 256 Time Channels*Simultaneous FLIM/PLIM*Wideband Version, Compatible with Tuneable Lasers*Electronic Pinhole Alignment*Z-Stack FLIM Acquisition with Zeiss Axio Observer Z1*Optional: Spatial Mosaic FLIM via Motorized Sample Stage

  • Multiphoton FLIM System

    DCS-120 MP - Becker & Hickl GmbH

    *Multiphoton FLIM Upgrade for Existing Conventional Microscope*Two Fully Parallel TCSPC FLIM Channels*Compact bh Simple-Tau or Power-Tau System*Scanning by Fast Galvanometer Mirrors*Channel Seperation by Dichroic or Polarising Beamsplitters*Individually Selectable Pinholes and Filters*Excitation by Ti:Sa Laser*Two Non-Descanned Detection Channels*Two HPM-100-40 GaAsP Hybrid Detectors*Optional: Two HPM-100-06 Hybrid Detectors, IRF Width < 20 ps FWHM*Optional: HPM-100-50 Hybrid Detectors for NIR FLIM*Optional: Multi-Wavelength FLIM*Excellent Time Resolution: Electrical IRF Width 6.5 ps FWHM*Time Channel Width Down to 813 fs*Megapixel FLIM, Up to 2048 x 2048 Pixels at 256 Time Channels*Simultaneous FLIM/PLIM*Electronic Pinhole Alignment*Z-Stack FLIM Acquisition with Zeiss Axio Observer Z1*Optional: Spatial Mosaic FLIM via Motorized Sample Stage*Laser Control via SPCM Software

  • Static Load Cells

    2580 Series - Instron

    Instron® load cells are a key part of a materials testing system. Instron is the only global materials testing supplier that designs and manufactures its own load cells. This ensures that Instron load cells meet the unique requirements of materials testing such as; high accuracy over a wide measurement range, high stiffness, resistance to offset loads, accurate alignment and excellent zero stability. The 2580-xxxN Series load cells are specifically designed for use with 5900 testing systems; offering exceptional performance with the ability to measure forces as low as 1/1000th of the force capacity to an accuracy of 0.5% of reading.The load cells can withstand loads up to 150% of their force capacity without damage and 300% without mechanical failure. Automatic transducer recognition and electrical calibration, makes them easy to use.  The load cells allow the user to zero out the tare weight of a grip or fixture that weighs up to 10% of the force capacity, while still maintaining the full specified accuracy.

  • Confocal FLIM for Macroscopic Objects

    DCS-120 Macro - Becker & Hickl GmbH

    *FLIM of Macroscopic Objects*Scan Field Up to 15 mm Diameter*Two Fully Parallel TCSPC FLIM Channels*Compact bh Simple-Tau or Power-Tau System*Scanning by Fast Galvanometer Mirrors*Channel Seperation by Dichroic or Polarising Beamsplitters*Individually Selectable Pinholes and Filters*One or Two BDL-SMN or BDS-SM ps Diode Lasers*Tuneable Excitation by Super-Continuum Laser with AOTF*Two Fully Parallel Detection Channels*Two HPM-100-40 GaAsP Hybrid Detectors*Optional: Two HPM-100-06 Hybrid Detectors, IRF Width < 20 ps FWHM*Optional: HPM-100-50 Hybrid Detectors for NIR FLIM*Optional: Multi-Wavelength FLIM*Excellent Time Resolution: Electrical IRF Width 6.5 ps FWHM*Time Channel Width Down to 813 fs*Megapixel FLIM, Up to 2048 x 2048 Pixels at 256 Time Channels*Simultaneous FLIM/PLIM*Wideband Version, Compatible with Tuneable Lasers*Electronic Pinhole Alignment*Optional: Spatial Mosaic FLIM via Motorized Sample Stage

  • SOI Bonding Systems

    EV Group

    An accurate wafer bonding process is the key factor in obtaining high quality single crystalline silicon films on insulating substrates. The EVG850 SOI/Direct Wafer Bonding systems are designed to fulfill a wide range of fusion/molecular wafer bonding applications, with main focus on SOI substrates manufacturing. Ultra clean handling of wafers throughout the bonding process assures high-yield and void-free bonds. All essential steps, from cleaning and alignment to pre-bonding and IR-inspection are combined in one high volume production system. EVG850 is the only production bonding system built to operate in high throughput, high-yield environments and guarantees void-free SOI wafers up to 300 mm.The EVG300 series single wafer cleaning systems are designed for efficient removal of particles. In semiconductor processing, efficient cleaning and particles removal prior to critical process steps enables maximum yield. Wafer Bonding is a process which is strongly affected by particles: each particle on the wafer surface produces a void orders of magnitude larger than its diameter, contributing to a dramatic yield loss.

  • Absolute Quantum Gravimeter

    Muquans, SAS

    The Absolute Quantum Gravimeter is the only quantum gravity sensor available on the market place. Thanks to its disruptive technology, this instrument offers unique features:*Absolute gravity measurement at the µGal level.*Automated Continuous Data Acquisition for several months. No long-term drift.*Excellent immunity to ground vibrations thanks to an active compensation system (no mechanical isolation).*Easy and quick operation : the AQG is ready to measure within 1h (no laser alignment nor mechanical assembling, no preliminary pumping, no superspring). User-friendly software requiring no knowledge in quantum physics.*Compact and transportable sensor.*Low maintenance constraints (in particular, no moving parts in our vacuum chamber).*Station to station repeatability of the absolute measurement within a few μGal.

  • MPI SiPH Probe Systems

    MPI Advanced Semiconductor Test

    MPI designed dedicated SiPH upgrades for its well known 200 and 300 mm probe systems, which includes:*Various options of high-precision fiber alignment systems for ultra-fast scanning routines*Multiple measurement capabilities for O-O, O-E, E-O and E-E device configuration*Integrated Z-sensing for detecting the fiber to wafer contact point*Crash protection when using two optical fiber arms*Wide temperature range from -50°C to 200°C*Optional dark box for testing in light tight environment*Extensive software package for supporting easy integration to operator’s test executive*Probe system compatibility: TS2000-IFE, TS2000-SE, TS3000, TS3000-SE, TS3500 and TS3500-SE

  • 3U VPX SOSA Aligned Development Chassis

    Model 8256 - Pentek, Inc.

    - Video: AOC 2021 Mercury's Model 8256 SOSA Aligned Dev. Platform and RFM3202 Microwave Transceiver- Video: Model 8256 3U VPX SOSA Aligned Development Platform, multi-vendor operation demonstration- Video: Model 8256 3U VPX SOSA Aligned Development Chassis- Developed in alignment with the SOSA™ Technical Standard- Ideal development platform for Pentek's- Model 5550 8-Channel A/D & D/A Zynq UltraScale+ RFSoC Processor - SOSA Aligned 3U VPX- Model 5553 8-Channel A/D & D/A Zynq UltraScale+ RFSoC Processor - SOSA Aligned 3U VPX- 8-slots provide space for a range of acquisition and processing boards- Optional rear panel RF and optical connections- Compatible with the Quartz product family

  • Bare Fiber Aligner

    1120 - Photon Kinetics

    The Photon Kinetics 1120 Bare Fiber Aligner makes it possible to reduce test setup time to seconds, thereby reducing overall testing cost. Just strip the fiber, scribe and break it (or use a more precise fiber cleaver, if desired) and then insert the prepared end into the 1120. In an instant, the fiber is coupled to your OTDR or chromatic dispersion test system with low optical loss and low reflectance. The 1120's compact, ergonomic industrial design is well-suited for low to moderate volume fiber and cable testing applications where automated fiber alignment systems are less economical. It is particularly useful as part of an in-process or finished cable test station employing either the 8000i or 8000 OTDR, and the OASYS.net OTDR Automation Software.

  • Industry-Standard, Automated Precision Inspection Systems

    Circuit AOI 4.0 - Machvision

    Circuit AOI 4.0 is a set of industry-standard, automated precision inspection systems that combine precision, robust construction and line-of-sight technology for assembly and production under stringent regulatory standards and is ideal for PCB / HDI line inspection.It uses innovative alignment detection logic to detect defects such as short / open circuit, protrusion / depression, scratch, pinhole, residual copper, line width / line distance violation, missing objects, unwanted objects, and so on. The system can be used with off-line set-up station and off-line re-check station to enhance the detection capacity.Circuit AOI 4.0 uses multi-angle LED light source, compared to the traditional single angle light source design, can obtain the best image contrast, widely used in different plate inspection.

  • Near Field Scanning Optical Microscope

    MCL-NSOM - Mad City Labs Inc.

    The MCL-NSOM is a fully operational near field scanning optical microscope. It has been built on Mad City Labs versatile RM21™ inverted optical microscope which allows users to convert between NSOM, SPM, and fluorescence optical microscopy techniques. The MCL-NSOM builds on our successful resonant probe SPM and incorporates common elements such as the MadPLL® phase lock loop controller. The NSOM also exploits our expertise in precision motion control by including six axes of motorized positioning, for the sample and NSOM probe, and three axes of closed loop nanopositioning to provide exceptional position resolution and accuracy. The MCL-NSOM also includes a 635nm laser excitation source, fiber launch, oil immersion objective lens (100x, 1.25 N.A.), CMOS alignment camera and avalanche photodiode detector. The microscope configurable design allows researchers to tailor the instrument for many different optical microscopy techniques including near field spectroscopy. The MCL-NSOM is operated in aperture mode with shear force feedback. The standard 5 modes are supported: illumination, collection, illumination and collection, reflection and reflection collection. We supply a LabVIEW™ based software package which automates the motion control features.

Get Help