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Defect
other than specified, imperfection .
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Atomic Force Microscope
HDM Series
The task of identifying nanoscale defects is a very time consuming process for engineers working with media and flat substrates. Park NX-HDM is an atomic force microscopy system that speeds up the defect review process by an order of magnitude through automated defect identification, scanning and analysis. Park NX-HDM links directly with a wide range of optical inspection tools, thus significantly increasing the automatic defect review throughput. In addition, Park NX-HDM provides accurate sub-angstrom surface roughness measurements, scan after scan. Park NX-HDM, together with its industry's lowest noise floor, and its unique True Non-Contact™ technology, it is the most accurate AFM for surface roughness measurement in the market.
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WireChop
A cost-effective, proven defect chopper system that works with both bench presses and automatic machines
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Relay and Protection Testing
HAOMAI Electric Test Equipment Co., Ltd.
These tests are done to show that protection relays are free from defects during manufacturing process.
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Exploratory Testing
Exploratory testing traditionally has been all about the people and not the tools. Free from dependency on requirements or test cases, exploratory tests can be performed much earlier in the QA process. Power users apply their deep knowledge of a system within a given time block to identify defects that script-based testing will miss. Targeted defects include incorrect requirements or the inability for a user to navigate a UI. While this activity can catch defects other tests miss, the value of exploratory testing has traditionally been limited for several reasons:
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Solder Paste Inspection Machine
3D SPI
The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
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Portable Eddy Current Flaw Detectors
Portable eddy current (EC) flaw detectors inspect metallic parts and perform highly reliable and advanced flaw detection of surface and near-surface defects. Olympus offers portable eddy current equipment to meet a broad range of applications, including the detection of surface or near-surface defects, and the inspection of bolt holes.
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Exploratory Testing & Documentation Tool
qTest eXplorer
Intelligent capture technology tracks all interactions from the testing session and automates defect documentation.
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Pinhole Detection Devices
ElektroPhysik Dr. Steingroever GmbH & Co. KG
The coating control by means of pore testing makes use of electrical voltage in order to uncover microscopically small defects (> 20 μm) in the coating of a surface. If even a small defect can be detected during pore testing of surface coatings, urgent action is required. Minimal flaws in the coating are sufficient to cause great damage.
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High Resolution Microscope For Multi-fiber Connector
D SCOPE MT LWD
Designed for inspection of MPO connectors, patch-cords or bulkheads, the D Scope MT LWD checks the cleanliness of the connector face and precisely measures the defects on the optical fiber end-faces. Using Deep Learning technology associated with a high-resolution optical bench, the scratch and defect detection thresholds are significantly improved compared to traditional software.
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Scanning Acoustic Microscopy (CSAM)
Scanning Acoustic Microscopy, also known as C-SAM or Acoustic Micro Imaging or AMI, outstanding benefit is its ability to find hidden defects within assemblies and materials that can occur during manufacturing or environmental testing. Defects such as delaminations, voids and cracks can be identified and analyzed more effectively using Acoustic Microscopy than with any other inspection method.Unlike other non-destructive techniques such as X-Ray and Infrared Imaging, Acoustic Microscopy is highly sensitive to the elastic properties of the materials it travels through. Because of this, the ability of Acoustic Microscopy to find and characterize these physical defects is clearly superior. Typical applications include production control, failure analysis, and product development.Through the use of ultra-high frequency ultrasound, C-SAM non-destructively finds and characterizes physical defects—such as cracks, voids, delaminations and porosity— that occur during manufacturing, environmental testing or even under normal component operation. Because of the unique aspects of the technology, AMI can locate these defects better than any other inspection method.
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Test Management App
Test Management goes mobile with the new Kualitee App. Now, simply use your Kualitee mobile app to manage your testing activities by viewing multiple projects, creating defects, approve or reject test cases and view your Kualitee Dashboard to get the latest status reports on the defects being reported.
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Code Analysis
Kiuwan
Identify code defects & vulnerabilitesto manage your remediation effortsBlazingly fast analysis in a collaborative and unlocalized environment.
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Holiday Detectors
Holiday Detectors are devices used to minimize the effects of corrosion by detecting the presence of “holidays” or “defects” in non-conductive coatings.
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DI Lab System™
Comprehensive Product Engineering and Failure Analysis Lab system for complete device analysis and physical defect isolation.
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Environmental Stress Screening
E.S.S
King Design Industrial Co., Ltd.
E.S.S system could find most potential and hiding defects earlier by checking the physical property of allmaterials and components, and make use of their nature response under Environmental Stress. Through our screening will to pick out all potential and hiding defects in advance and improving the product's reliability inling. It benefits the manufacturer and customer mutually.
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Battery Boxes Testing Equipment
Battery boxes can be tested for faults by placing the box on a metal plate. By applying a test voltage to an electrode inside the box, the moulding can be checked thoroughly - particularly at the injection points - and any faults found. Defects will be identified by a spark passing from the electrode, through the defect itself, to earth (the conductive material placed outside the battery box.
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Contour Check Shape
Contour Check Shape has proven itself in hot rolling of long products and is an essential part of the rolling process in many factories. It checks hot and cold steel profiles with the help of three-dimensional surface reconstruction. Thus, it records geometrical errors due to rolling defects including surface defects like scale seams, shells or roller outbreaks.
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Automatic Optical Cell/Wafer Inspection System
7200
Among several factors for PV to achieve grid-parity, Reliability of the PV Modules plays an important role. Since its known that some of the cell defects such as edge chips/ flakes, bumps of cell surface were proved to be source of infant mortality of the c-Si PV modules, therefore, to detect those defects is very important for c-Si cell manufacturers.
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Low Frequency Test Systems
Ingenieurbüro Dr. Hillger Ultrasonic-Techniques
Our imaging low-frequency inspection systems are excellently suited to displaying internal defects with high resolution and high dynamics.
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E-beam Metrology And Inspection
Our HMI e-beam solutions help to locate and analyze individual chip defects amid millions of printed patterns.
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3D CT AXI
PCB manufacturers can enjoy comprehensive, high-speed inspection with Omron’s revolutionary technology that reliably captures defects in hidden areas.
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EasySegment
Unsupervised mode: train only with “good” images to detect and segment anomalies and defects in new imagesSupervised mode: learn a model of the defects for better segmentation and detection precisionWorks with any image resolutionSupports data augmentation and masksCompatible with CPU and GPU processingIncludes the free Deep Learning Studio application for dataset creation, training and evaluationOnly available as part of the Deep Learning Bundle
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AI ANALYZER
Nanotronics uses artificial intelligence to give our customers’ unprecedented freedom and control for defect detection. We offer an AI based Anomaly Detection Algorithm (ADA) toolkit that automates the work of writing computer vision algorithms to detect and classify defects on bare substrate and epi wafers as well as on thin films, glass and any other material with a uniform background.
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Test Systems
Testing is more than just finding defects on Printed Circuit Boards. It is also about how to predict defects before they occur. A true economy can only be achieved when you see testing as an integrated part of manufacturing. To achieve this we provide Advanced Diagnostic Tools and Electronic Manufacturing Systems (EMS) that integrate testing with design, manufacturing, and repair.
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Eddy Current Testing
And the eddy current generated on the specimen by the specimen by the action of the magnetic field can not be detected (defect) and the change due to the influence of the material is detected.
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Scanning Acoustic Microscope
Pulse2
This industry-leading scanning acoustic microscope provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.
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SlipFinder
YIS and SF Series
The YIS and SF Series metrology systems are designed for optical detection of wafer defects such as crystaldislocations, slip and other defects. The YIS-300HM (for 300 mm wafers) and YIS-200HM (for 200 mm wafers) utilizeMakyoh optics technology (Magic Mirror) and integrated robotic wafer handler provided by Hologenix.The SF300M and SF300N systems offer a low cost functionally equivalent alternative to the YIS series.
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Reject Station for X-Ray Image Analyser
IV-110I
IV-11OI is a reject station for X-Ray Image Analyser known for having an X-Ray Image Wire Defect Detection and a compact and space-saving dimension.
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Non-destructive Eddy Current Testing of Long Products such as Tubes, Rods, Wire, and Profiles
DEFECTOMAT® Product Familiy
Foerster Instruments, Incorporated
The DEFECTOMAT systems by FOERSTER were specially developed for quality testing and process monitoring of long products. From hot testing to all bright steel processing steps, the surfaces of semi-finished products made from austenitic, (non) ferromagnetic metals can be tested for defects. The DEFECTOMAT systems operate in a contactless and non-destructive manner in accordance with the eddy current method and are used for detecting short defects, such as holes or localized defects and transverse defects. The systems detect defective materials fully automatically and reliably. Defects can be marked, classified, and automatically discarded. the test speed of up to 150 m/s facilitates 100% testing, even at high production speeds. The systems benefit from low operating costs and frugal energy consumption as well as low maintenance costs, few wear parts, and low use of materials.
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Multi-Channel Automotive Noise Finder
7633A
Peaceful Thriving Enterprise Co Ltd
Multi-Channel automotive noise finder is a portable equipment to diagnose the defect of the vehicle. When the generator is running, it can detect the impact and vibration due to the defect and failure of bearing, gear, valve, crank, cylinder, gear box, and vehicle body…etc. With this equipment, the repairer can clearly locate which part of the machine cause the noise and how serious is it; even though the repairer operates the equipment in a very noisy environment.