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Defect
other than specified, imperfection .
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Halt Hass Chambers
HALT and HASS chambers from WEIBER provide extreme temperature & vibration capabilities used during the product design and manufacturing cycles to compress the time normally required to identify design and process weaknesses. HALT techniques are important in uncovering many of the weak links inherent to the design and fabrication process of a new product. HASS techniques are incorporated during the production phase to find manufacturing process defects that could cause product failures in the field.
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Partial Discharge Testing Equipment
AR700
PD Defect Location in High-Voltage Equipment Insulation by Acoustic Sensors To act on deteriorating insulation the source of PD must be known.The insulation defects produce partial discharges, which emits electrical impulses, radiation of electromagnetic waves as well as acoustic signals.The AR700 measures acoustic signals with multiple sensors spread over the transformer. Then the software determines the failure location using the time difference of all incoming signals. Finally, these coordinates are shown in a 3D model of the transformer. AR700 device is used for measuring of acoustic signals on the external surfaces of gas-insulated breakers and substations, power transformers and other tank high-voltage equipment. The acoustic signals are caused by partial discharges in the insulation, which is the sigh of the defects.The advantage of “AR700” device is the quick installation of the acoustic PD sensors on the external surface of high-voltage equipment tank. The sensors have magnetic holder that is why there is no need to de-energize the equipment for the sensors installation. “AR700” device has 4 syn-chronic channels for acoustic signal measurement. This gives the possibility not only to find the defects in the insulation, but also to locate them. The location function of the “AR700”device is unique for acoustic devices.
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Dinger™
The Dinger is a fast yet sensitive NDT (non-destructive test) system used for batch or 100% inspection of raw or machined metal cast, fabricated, sintered, forged, die cast, or ceramic parts. It’s built on our IQC foundation that’s in daily production use by customers worldwide, and has tested over a million parts. Dinger allows you to dramatically improve the shipped quality, by quickly and reliably identifying parts with either global or local manufacturing defects.
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3D Sensors (Main Screen)
surfaceCONTROL
surfaceCONTROL sensors are used for 3D measurements and surface inspections. The sensors use the fringe projection principle to detect diffuse reflecting surface and to generate a 3D point cloud. This point cloud is subsequently evaluated in order to recognize geometry, extremely small defects and discontinuities on the surface. Sensors with different measurement areas are available. This enables the inspection of the finest of structures on components as well as shape deviations on large-area attachments. Powerful software packages are available for evaluation and parameter setting.
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Static Analysis
SAST
Coverity® is a fast, accurate, and highly scalable static analysis (SAST) solution that helps development and security teams address security and quality defects early in the software development life cycle (SDLC), track and manage risks across the application portfolio, and ensure compliance with security and coding standards.
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Ceramics and Glass Inspection Systems
Due to their special material properties, ceramic and glass components are the basis of many high-tech products. The same properties make the production complex and costly. Substrate defects that lead to failure of finished components should be avoided at all costs. For this reason, early automated optical inspection is essential.For the inspection of sapphire and quartz glass Intego has developed systems to detect both external and internal defects and can also provide cutting suggestions. Using index matching it is possible to test rough or uneven glass profiles.For the inspection of ceramic components Intego offers solutions specifically tailored to the respective testing task. Our modular design uses standard components that have already been developed and tested and in most cases only requires minimal adaptation.
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Reliability Testing
ELES Semiconductor Equipment SpA
ELES designs and manufacturers reliability test solutions to verify the performance of integrated circuits from concept validation to high volume production during all the test phases. No other company can provide universal equipment for all the reliability tests, or can guarantee a seamless data flow between phases or can apply on chip embedded reliability engineering for data tracking and failure investigation. Clients use our functional test data to proactively analyse variations between lots, between temperature extremes and during lifetime (often these defects escape ATE). The improvements to products and processes needed to arrive at zero defects cannot be driven by the quantity of Big Data alone, the quality of reliability data is a strategic advantage that only ELES can provide.
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Automated Testing System
PV-LIT
Thermographic solutions ensure high quality of solar cells and modules.Usable for all types of solar cells and modules (silicon-based or thin-layered)Testing in laboratory and in-line in the course of the manufacturing processTesting of various solar cells and modules through contact and non-contact measurementCell-specific system configuration and determination of test criteria and kind of defects
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Variable Frequency High-Current Multifunctional Ground Impedance Test System
SFJ044
Shanghai Launch Electric Co., Ltd.
The system complies with DL/T621-1997 standards of Grounding of AC Electrical Equipment , used to test grounding system, connected resistance and soil resistivity of large power plants and substations. It makes up for the defect of traditional measuring approaches, offering complete test items and reliable test for large grounding system
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PXI Fault Insertion / Signal Insertion Switch Modules
Pickering's PXI Fault Insertion / Signal Insertion Switch Modules feature a breakout arrangement that allows faults to be attached to the sensor lines, this includes the breaking of a connection or the adding of defect all of which can simulate connectivity problems in the system. Two switching topologies are available: *Single signal paths with series switches and switches to connect to one or more fault buses*Pairs of signals with series switches, shorting switches between the signal pairs and switches to connect either signal to an external fault input.
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MPI Sorter Series
MPI’s Sorter Series are improving production efficiency and yields for market sectors related to LED chip, package production, discrete device handling, and IC substrate manufacturing. Deploying MPI’s Pick & Place technology, the Sorter Line offers dedicated sorting and defect inspection solutions particularly suited for GaN, GaAs, Vertical LED Chip, Flip Chip, and Laser Diode applications. With a proven heritage of and market-advanced technologies, MPI offers competitive and differentiated solutions that are scalable and cost-effective.
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Circuit Breaker Time Interval Meter
Measuring contact timings is useful for finding the contact bounces and non-simultaneity of contacts. This helps in finding the possible electrical or mechanical defects in the circuit breaker contacts. Timing analysis also make it possible to detect incorrect mechanical adjustments and wear phenomena of the circuit breaker by measuring the differences between the fastest and slowest phases.
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PD Surveyor with RFI & EMI Diagnostics
PDS200
The Doble PDS200 is a combination survey tool that uses radio frequency interference and electromagnetic interference diagnostics to find signs of partial discharge.This hand-held instrument is an ideal tool for a condition based maintenance program, allowing you to quickly find insulation defects in motors, generators, transformers, cable terminations and additional substation components.
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kSA Emissometer
The kSA Emissometer is designed to quickly and easily generate high-resolution diffuse and specular reflectance and total emissivity maps of MOCVD carriers. Carrier emissivity variation means temperature non-uniformity, which can lead to reduced device yield and possibly complete growth run failure. With the kSA Emissometer, emissivity changes can be tracked to determine carrier end-of-life, without wasting growth runs. The kSA Emissometer also detects unwanted residual deposits after baking, and easily identifies carrier surface defects, scratches, microcracks and pits that are not visible to the eye.
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Panaya Release Dynamix
Release Dynamix
Panaya Release Dynamix (RDx) enables organizations to drive innovations by enabling the continuous delivery of business-driven changes with speed and simplicity. Traceability – Users can map tests and defects to business change request and development requirements, increasing quality and business assurance. Agility – Change delivery managers can enable continuous delivery through visibility into requirements, user stories and tasks. Compliance - Organizations can employ a requirement approval workflow to comply with internal as well as regulated change introduction processes while continually managing the change lifecycle process.
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Automated Optical Inspection (AOI)
TR7700 SIII
TR7700 SIII is the newest generation of TRI's AOI solutions, delivering precise multi-phase inspection at full speed. By combining an ultra-fast camera, intelligent auto conveyor, and new GUI, the TR7700 SIII offers a powerful and easy to use AOI solution with fast programming, optimized board loading, production line integration and support for offline programming. TRI's new color algorithm combined with multiple lighting phases increase defect coverage and help deliver highly accurate inspection results with a minimum of false calls.
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Wafer Level Test
Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
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Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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Diode & Rectifier Test Systems
D&V’s diode and rectifier test systems provide a quick, accurate and easy to use interface to check and measure all main parameters of regular and avalanche rectifiers. Real life conditions are simulated to maximize diagnostic capabilities. Additionally, analysis of the rectifier’s thermal resistance can be performed to detect poor internal diode connections and related defects.
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Test Services For Circuit Board
Acculogic Contract Testing Services group with multiple locations in United States, Canada, Germany and China provides Cost Effective, On-Demand (Quick-Turn) testing service. Our circuit board assembly test services include defect analysis, In-Circuit, Boundary Scan JTAG and Functional testing on industries most widely used test platforms.
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Battery Element Testers
1652/1653
All STS Battery Element Testers provide a unique method for the detection of assembly level insulation defects in lead-acid batteries, including missing and damaged separators. Detection of such faults prior to filling and charging the battery minimizes costly reclamation. Traditional AC dielectric tests can detect such faults, but may produce damaging heat in moist cell applications.
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Thermal Imager with App
testo 872
The testo 872 thermal imager is ideally suited for professional industrial and building thermography - at the same time it ensures your work is both quick and easy. It is versatile to use, for example in industrial and mechanical maintenance or for detecting structural defects. You can generate error-free and objectively comparable infrared images using its handy functions. The IFOV warner, testo -Assist and testo ScaleAssist mean you can avoid measurement errors and not only effortlessly achieve optimum setting of emissivity () and reflected temperature (RTC) for building thermography, but also of thermal image scale.
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Miniature Single Axis Accelerometers
Miniature piezoelectric accelerometers are required for applications demanding high frequency range, small size, and low weight. Product testing is necessary in today’s competitive marketplace in order to optimize designs, reduce defects, and improve customer acceptance and satisfaction. Shock and vibration testing offers a structured approach for verifying survivability in environmental influences that may be encountered during service and for precipitating incipient failures so they are not encountered by the end-user. PCB® accelerometers are used extensively for monitoring an object’s response to a programmed vibration input and for controlling the vibration profiles during testing.
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Substrate Manufacturing
KLA’s substrate manufacturing portfolio includes defect inspection and review, metrology and data management systems that help substrate manufacturers manage quality throughout the wafer fabrication process. Specialized wafer inspection and review tools assess wafer surface quality and detect, count and bin defects during production and as a critical part of outgoing wafer qualification. Wafer geometry systems ensure the wafer shape is extremely flat and uniform in thickness, with precisely controlled wafer shape topography. Data analysis and management systems proactively identify substrate fabrication process excursions that can lead to yield loss. KLA’s substrate manufacturing systems support process development, production monitoring and final quality check of a broad range of substrate types and sizes including silicon, prime silicon, SOI, sapphire, glass, GaAs, SiC, GaN, InP, GaSb, Ge, LiTaO3, LiNBO3, and epitaxial wafers.
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Bench PIM Tester - iBA series
iBA
Passive Intermodulation (PIM) occurs when multiple RF signals encounter defects in materials or workmanship in an RF path. These defects behave like a mixer causing noise to be generated at mathematical combinations of the original carrier frequencies. PIM interference that falls in the receive band of a wireless system elevates the noise floor resulting in high dropped call rates, call blocking, slow data transmission speeds and decreased system capacity.Kaelus is the industry leader in Passive Intermodulation test solutions. Since 1996 Kaelus has supplied RF equipment manufacturers around the world with precision IEC compliant test equipment to perform this critical test. From initial product design through high-volume manufacturing, Kaelus offers a wide range of PIM test solutions that enable equipment manufacturers to quickly and confidently verify the performance of their products.
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Security Testing Services
You're building more-complex software faster than ever before, but does your team have sufficient application security skills and resources to test it for security defects? Synopsys security testing services provide continuous access to security testing experts with the skills, tools, and discipline needed to cost-effectively analyze any application, at any depth, at any time.
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Flying Probe Tester
FA1817
Flying Probe Tester FA1817, an automatic testing system designed to inspect printed wiring on bare boards. The FA1817’s features and capabilities make it ideal for use in inspecting high-density printed wiring boards. With support for a broad range of test types, from low-resistance measurement to high-insulation-resistance measurement, the system reliably detects the latent defects that trouble end-users.
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Automated Optical Inspection (AOI)
Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew). It is commonly used in the manufacturing process because it is a non-contact test method.
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Impulse Winding Tester
TH2882AS-5
Changzhou Tonghui Electronic Co., Ltd.
Due to the influence of coil wire material, magnetic material, framework and manufacture technics etc., coil products (such as transformers, motors, etc.) may have defects of low insulation between coil layers, circles and leads. TH2882A series impulse winding tester, adopting high-speed sampling technique, is a new generation analysis test instrument for insulation performance of coil products.
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Impulse Winding Tester
TH2882A-3
Changzhou Tonghui Electronic Co., Ltd.
Due to the influence of coil wire material, magnetic material, framework and manufacture technics etc., coil products (such as transformers, motors, etc.) may have defects of low insulation between coil layers, circles and leads. TH2882A series impulse winding tester, adopting high-speed sampling technique, is a new generation analysis test instrument for insulation performance of coil products.