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DUV Lithography Systems
ASML's deep ultraviolet (DUV) lithography systems dive deep into the UV spectrum to print the tiny features that form the basis of the microchip.
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DUV Mask Aligner
Model 200E
OAI’S Model 200E DUV Mask Aligner performs all the functions of the tabletop Model 200 Mask Aligner but utilizes a 185nm Excimer Lamp as the UV light source. It is used for Biotechnology Processing.
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Micro-spot DUV Spectroscopic Reflectometry
FilmTek 2000 PAR
Scientific Computing International
A low-cost solution for high-throughput, fully-automated mapping of patterned wafers for development and production environments. Utilizes patented parabolic mirror technology to measure wavelengths from DUV to NIR with a spot size as small as 13µm. Fully user-customizable wafer mapping capabilities rapidly generate 2D and 3D data maps of any measured parameter.
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Micro-spot DUV Reflection and Transmission Spectrophotometry
FilmTek 3000 PAR
Scientific Computing International
Metrology system with a 50µm spot that delivers high-performance transmission and reflection measurement of patterned films deposited on transparent substrates. Ideally suited for measuring the thickness and optical constants of very thin absorbing films.
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UV-VIS-NIR Spectrophotometer
SolidSpec-3700i/3700iDUV
The SolidSpec-3700i/3700i DUV have three detectors which cover the range from ultraviolet to near-infrared.
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Deep Ultraviolet Observation System for Microscope
U-UVF248
Model Capable of High-magnification/High-contrast Deep Ultraviolet (DUV) Observation. A Semiconductor / FPD Inspection Microscopes.
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Custom Metrology Solutions
4D custom interferometers and laser interferometers overcome difficult environments, complex setups and one-of-a-kind measurement problems, at wavelengths from DUV through IR.
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Benchtop Metrology Solution
FilmTek 2000 PAR-SE
Scientific Computing International
Our most advanced benchtop metrology solution, engineered to meet the needs of nearly any advanced thin film measurement application, from R&D to production. Combines spectroscopic ellipsometry and DUV multi-angle polarized reflectometry with a wide spectral range to deliver the highest accuracy, precision, and versatility in the industry. Patented parabolic mirror technology allows for a small spot size down to 50µm, ideal for direct measurement of product wafers and patterned films.
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Reflection/Transmission Spectrophotometry
FilmTek 3000 PAR-SE
Scientific Computing International
Engineered to meet the needs of any advanced thin film measurement application, excelling at material characterization on both transparent and non-transparent substrates. Combines spectroscopic ellipsometry, DUV multi-angle polarized reflectometry, and transmission measurement with a wide spectral range to meet the most challenging of measurement demands in both R&D and production. Patented parabolic mirror technology allows for a small spot size down to 50µm, ideal for direct measurement of product wafers and patterned films.
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Birefringence Measurement Technology
Hinds Instruments Birefringence Measurement technology has been adopted by industry leaders world wide to measure birefringence and characterize stress birefringence in materials with unsurpassed accuracy, resolution and repeatability. Capable of measuring optical retardation at 0.001nm resolution with noise floors as low as 0.005nm, these systems are robust, dynamic and scalable to fit the demanding requirements of your application. We provide measurement systems across the light spectrum (DUV, VIS and NIR) and are able to measure virtually all optical materials.
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Optical Thin-Film Metrology for Advanced Thin Films
FilmTek 6000 PAR-SE
Scientific Computing International
Production-proven metrology system for film thickness, refractive index and stress measurement for a broad range of film layers at the 1x nm design node and beyond. Accommodates 200 or 300 mm wafer metrology. Combines spectroscopic ellipsometry and DUV multi-angle polarized reflectometry with a wide spectral range to meet the challenging demands associated with multi-patterning and other leading-edge device fabrication techniques.
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EUV Lithography
NXE systems
NXE lithography systems are used in high-volume manufacturing of advanced Logic and Memory chips. The first systems to use ASML’s novel 13.5 nm EUV light source, they print microchip features with a resolution of 13 nm, which is unreachable with deep ultraviolet (DUV) lithography. Chipmakers use our NXE systems to print the highly complex foundation layers of their 7 nm, 5 nm and 3 nm nodes. Read about how EUV lithography went from imagination to reality.
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Portable CCD Spectroradiometer
LMS-6000
The Portable CCD Colorimeter Spectroradiometer has the following versions which can measure different parameters: • LMS-6000: illuminance (lux), E(Fc), Ee(W/m2), Tc (K), Duv Correlated Color Temperature (CCT), Chromaticity Coordinates, CRI, Purity, Peak Wavelength, Dominant Wavelength, Half Bandwidth, Center Wavelength, Centroid Wavelength, Total Color Difference, Brightness Difference, Red-Green Degree, Yellow-Blue Degree, CCT Difference, SDCM Diagram, Spectrum Diagram • LMS-6000L: cd/m2, fL, Tc (K), Duv Correlated Color Temperature (CCT), Chromaticity Coordinates, CRI, Purity, Peak Wavelength, Dominant Wavelength, Half Bandwidth, Center Wavelength, Centroid Wavelength, Total Color Difference, Brightness Difference, Red-Green Degree, Yellow-Blue Degree, CCT Difference, SDCM Diagram, Spectrum Diagram • LMS-6000P: LMS-6000 Parameters+PAR, PPFD, YPFD, Blue-purple irradiance Eb, Yellow-green irradiance Ey, Red-orange irradiance Er, Ratio of red and blue radiation Erb_Ratio • LMS-6000S: LMS-6000 Parameters+PAR, PPFD, YPFD, Blue-purple irradiance Eb, Yellow-green irradiance Ey, Red-orange irradiance Er, Ratio of red and blue radiation Erb_Ratio, Rf and Rg according to TM-30 • LMS-6000F: LMS-6000 Parameters+Flicker test • LMS-6000B: LMS-6000 Parameters+Blue Light Hazard Weighted Irradiance according to GB/T20145, CIE S009/E:2002 • LMS-6000BF: LMS-6000 Parameters+Flicker test, Blue Light Hazard Weighted Irradiance according to GB/T20145, CIE S009/E:2002
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Film Thickness Mapping Systems
Angstrom Sun Technologies, Inc.
Spectroscopic reflectometer mapping (SRM) tools are for industry or lab routine thin film uniformity measurement. This is relatively low cost and easy to use setup. Mapping size can be configured from 2" to 18" if needed. Dependent on film thickness range, a broad wavelength range can be configured within DUV, Vis and/or NIR range. A user-friendly software interface allows you to define various mapping patterns to map. A CCD array based detecting and data acquisition mechanism offers fast measurements. 2D/3D data presentation gives user option to quickly generate reports.
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Ultra-High Vacuum Ф4 Scanning Kelvin Probe
The Ф4 Ultra-high Vacuum Scanning Kelvin Probe system gives the user full access to work function measurements under vacuum with the ability to alter the temperature from 77 K to 860 K. The Kelvin Probe measurement has resolution of 1 - 3 meV for a 2 mm tip on a conducting sample. The sample is mounted on a plate that is located on a motorized (x, y, z) translator attached to a stainless-steel vacuum chamber. Phi 4 also comes with a photoemission spectroscopy system with a tuneable source (3.4 - 7.0 eV). The deep ultra-violet (DUV) light spot measures approximately 3 x 4 mm. Absolute work function measurements can be obtained with this system in the range of 4.0 - 6.5 eV with an accuracy of 0.05 - 0.1 eV.
