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Showing results: 4966 - 4980 of 5162 items found.

  • COM Express Type 6 Basic Module With Intel® Xeon® & 8th Gen Intel® Core™ Processors And Intel® CM246/QM370/HM370

    CEM520 - Axiomtek Co., Ltd.

    The CEM520 is a high-performance COM Express Type 6 basic module featuring triple independent displays, industrial operating temperatures and rich expansions. The CEM520 is based on the Intel® Xeon® E-2176M and 8th generation Intel® Core™ i7/i5/i3 processors (codename: Coffee Lake) with the Intel® CM246/QM370/HM370 chipset. The system-on-module is equipped with dual DDR4-2666 SO-DIMM slots for up to 32GB of system memory. Its wide operating temperature range of -40°C to +85°C strengthens the adaptability of harsh operating conditions. Integrated with Intel® Gen 9 graphics, and with the support of DX11/12, OCL 2.0 and OGL 4.3/4.4, the Intel® Xeon® and Core™-based computer-on-module presents excellent graphics performance with a resolution up to 4K. Three independent displays are supported through one LVDS, one VGA and two DDI ports for HDMI, DisplayPort. The CEM520 comes with multiple I/O connectors including four SATA-600 interfaces with RAID 0/1/5/10, one Gigabit LAN port with Intel® i219-LM controller, four USB 3.0 ports, eight USB 2.0 ports, and 4-In/Out DIO port. Also, the system-on-module is expandable with one PCIe x16 slot and eight PCIe x1 slots, as well as LPC and SMB expansion buses. Trusted Platform Module 2.0 (TPM 2.0) is supported to provide efficient hardware-based data protection. This new powerful COM Express Type 6 module is compatible with Windows® 10 and Linux operating systems. It also supports AMS.AXView – Axiomtek’s exclusive software for smart device monitoring and remote management applications.

  • Advanced Thermal Imaging Camera

    FLIR E76 - Teledyne FLIR

    The FLIR E76 offers complete coverage of near and distant targets through a range of interchangeable AutoCal™ lenses, with fields of view for everything from wide-angle roof inspections to electrical inspections performed from a safe distance. A step up from the FLIR E54, the E76 includes an optional temperature range to 1000°C (1832°F), laser-assisted autofocus, and 3 area measurement boxes. The 320 × 240 thermal resolution produces crisp, vibrant imagery that can be enhanced with patented FLIR MSX® technology for added detail and perspective. The onboard FLIR Inspection Route runs pre-planned routes to help you stay organized when surveying large or multiple locations. FLIR Ignite provides automatic uploading of E76 images directly from the camera to the cloud for easy, secure storage and sharing.

  • Multi-Channel Anemometer

    1550/1560 Series - KANOMAX USA, Inc.

    Kanomax Multi-Channel Anemometers are research-grade airflow measuring instruments designed for high performance and precision. When coupled with our highly accurate probes this four-channel anemometer provides highly accurate and reliable data readings. It features a LCD display that displays the data from each channel. The Our 1550 & 1560 models house module bays for the connection of up to 24 channels (model 1560) or 64 channels (model 1550) of simultaneous air velocity measurements. Each bay accepts one of five unique modules allowing for a wide variety of custom configurations for air velocity, temperature, and humidity measurement. For a larger system, you can connect up to 5 units in a cascade for up to 320 air velocity channels and transfer the data to your company computer.

  • Wafer Bonder

    AML - OAI

    Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.

  • 3.5” Embedded SBC With Intel® Celeron® Processor J1900/J1800, DisplayPort, LVDS, VGA, 3 GbE LAN And Audio

    CAPA84R - Axiomtek Co., Ltd.

    The CAPA84R is powered by the Intel® Celeron® processor J1900 quad-core or J1800 dual-core. The CPU is located at the rear side of the motherboard, which further aids the heat-extraction process and simplifies maintenance procedures. This fanless embedded board was designed for operational efficiency in rugged architecture with a wide operating temperature range of -20°C to +70°C. The CAPA84R supports one 204-pin DDR3L-1333 SO-DIMM socket with up to 8GB of system memory. There are also one SATA-300 port and one M.2 Key B supporting SATA for storage. The 3.5-inch embedded SBC with the Intel® integrated Gfx graphics is made to bring a true high definition visual experience with dual display configurations through the DisplayPort, 18/24-bit dual-channel LVDS and VGA.

  • Programmable Low-Ohm Meter

    DU5210/5211 - Delta United Instrument Co., Ltd.

    20m ~ 2Mtest range, 0.1% accuracy Provided Level and Pulse measurement modes, can be lower temperature influence in Pulse Mode Provided HI/LOW limit and BIN Sorting comparator function, to meet your needed 100 sets of memory, can be saved test parameter and comparator setting, easy to use. Auto Calibration Program Function, to easier your calibration procedure. (Specificity calibrator needed) Cover up free, system firmware upgrade can be update via RS-232, easy to maintenance High speed FADC, max. test speed up to 80 meas./sec, faster your automation equipment 240*64 Graphic LCD display, can be read the reading clearly and easier. User friendly programmable interface, easy to use Provided RS-232C and Handler combinatorial interface option, to meet your needed

  • Sensors

    Panasonic Industrial Devices Sales Company of America

    Panasonic Sensor Solutions offer a wide and constantly evolving range of technologies that provide design engineers with the flexibility to easily choose and implement the Sensor technology best suited for existing and ever-emerging new applications all from a single, world class supplier. Panasonic built-in Sensors contribute to energy savings, safety and comfort. With high-functionality and high-performance, Panasonic has solutions for sensing and detecting rotational speed and angle, position, flow, velocity, temperature, magnetism, currents and much more! Panasonic Sensor products combine the latest technologies with plug-and-play devices such as Grid-EYE® Thermopile Array Sensors, the Ultrasonic Gas Flow Sensor, the highly accurate and flexible 6in1 Sensor (6DoF Automotive Inertial Sensor), a wide array of Passive Infrared Motion Sensors (PIRs), and highly specialized and accurate Industrial Sensors.

  • COM Express Type 10 Mini Module With Intel® Pentium® Processor N4200 & Celeron® Processor N3350

    CEM311 - Axiomtek Co., Ltd.

    The CEM311 is designed to support the Intel® Pentium® N4200 quad-core and Celeron® N3350 dual-core processors (codename: Apollo Lake). Integrated with Intel® Gen 9 graphics, the CEM311 with the support of DX12.0, OCL 2.0, OGL 4.3 delivers outstanding graphics computing, 4K resolutions and media performance. The rugged system on module supports a wide operating temperature range from -20°C to +70°C to ensure stable operation in harsh environments. The embedded platform offers onboard 4GB or 8GB of DDR3L memory and an optional eMMC flash up to 64GB. Overall, the CEM311 can be served as an excellent solution for graphics-intensive applications over the Industrial IoT, including industrial control, medical imaging, digital signage, gaming machines, military, and networking.

  • USRP Software Defined Radio Reconfigurable Device

    NI

    The USRP Software Defined Radio Reconfigurable Device is built on the LabVIEW reconfigurable I/O (RIO) and universal software radio peripheral (USRP) architectures. It includes a powerful FPGA for advanced DSP that you can program with the LabVIEW FPGA Module. The device includes 2x2 MIMO transceivers or four-channel superheterodyne receivers, supporting center frequencies from 10 MHz to 6 GHz, with up to 160 MHz of instantaneous bandwidth. The USRP Software Defined Radio Reconfigurable Device also optionally includes a GPS‐disciplined oven-controlled crystal oscillator (GPSDO), which provides greater frequency accuracy than temperature- compensated crystal oscillators. Prototyping applications include LTE and 802.11 prototyping, spectrum monitoring, signals intelligence, military communications, radar, direction finding, and wireless research.

  • Regenerative Battery Pack Test System

    17040 - Chroma ATE Inc.

    Conforms to international standards for battery testing: IEC, ISO, UL, and GB/T, etc.Regenerative battery energy discharge (Eff. >90%, PF >0.95, I_THD <5%)Multiple voltage and current ranges for auto ranging function to provide optimum resolutionHigh accuracy current/voltage measurement (0.05%FS/0.02%FS)2ms current slew rate (-90% ~ 90%)Dynamic (current/power) driving profile simulation tests for NEDC, FUDS, HPPCTest channel parallel functionTest data analysis functionData recovery protection (after power failure)Automatic protection for error conditionBattery simulator (option)High power testing equipment- Voltage range : 80~1000V - Current range : 0~750A - Power range : 0~300kWCustomized integration functions- Integrated temperature chamber - BMS data analysis - Multi-channel voltage/temperature recording

  • SFP Based Fiber Optic Test Solution

    Eye-BERT Micro - Spectronix

    The Eye-BERT Micro is a low cost, easy to use, all-in-one SFP based fiber optic test solution offering high performance bit error rate testing at a fraction of the cost while providing a rich set of features not found in other bit error rate testers. Features include: variable bit rate, user programmable patterns, and optical power and temperature monitoring (per SFP capability). Additionally, with a click of a button, the Eye-BERT Micro will automatically test an SFP module based on the information it reads from the module and generate a detailed test report complete with manufacturer, part number, serial number, date code, fiber type, link length, speed, and test results. The Unit is supplied with anti-skid bumpers and is small enough to be integrated into larger systems for dedicated link verification.

  • Burner Control Flame Sensors

    SPECTRA BC11 IR and BC11 UV - Ametek Power Instruments

    The SPECTRA™ BC (burner control) sensors are extremely robust, compact, solid-state optical flame sensors that offer a host of features and provide maximum performance and reliability. SPECTRA flame sensors feature IR or UV detectors making them suitable for a wide variety of fuels, including coal, oil and gas. These units are 100% solid-state which enable the SPECTRA BC11 to be among the most compact industrial flame sensors available. There are no tubes or shutters to fail. Installation is simplified as the loop powered design only requires a single twisted pair cable for wiring connections. The 4-20 mA analog output provides direct connection to burner management systems eliminating the need for separate signal conditioners. High-temperature electronics enables the sensor to function at elevated operating temperatures.

  • 16 Channel WDM Mux/DeMux

    S-106 - Notice

    16CH WDM Mux/DeMux module of FOTS system offers a function of multiplexing or demultiplexing up to 16 channel of WDM signals. This module offers low insertion loss, low crosstalk, and high temperature stability. An internally built-in AWG module functions as 1 X N optical Multi/Demultiplexers. The bi-directional feature of this module is ideal for wide range of applications. In combination with an optionally built-in circulator or C/L-band WDM coupler, this module can be applied to the WDM-PON test. User can easily make his or her test set-ups for FTTX-PON systems, especially for WDM-PON test, by combining this module with other FOTS modules such as SLED Driver, SOA Driver, C+L-FOTS modules such as SLED Driver, SOA Driver, C+L-band ASE source, Wavelingth meter, Transceiver Driver and so on.

  • Automatic Metallic Pendulum Impact Testing Machine

    Jinan Testing Equipment IE Corporation

    JB-450/750A automatic type pendulum impact tester is used to determine the impact resistance of metal materials under dynamic load and is capable of doing a large number of impact tests continuously. The automatic type pendulum impact tester can display the impact power, impact toughness, and the pendulum's rotation angle. All the testing reports can be printed out. JB-450/750A can be equipped with fully automated sample feeding system, which greatly improves the test efficiency, and reduce labor intensity. The crygenic cooling device is available for impact tests under the lowest temperature down to -196 C. The automatic type pendulum impact testing system is the essential quality control equipment for metal material manufacturers and QC departments, as well as the necessary instrument of research institutes for new material research.

  • Mechanical Creep and Rupture Testing Machine

    MRC Series - Jinan Testing Equipment IE Corporation

    MRC series mechanical creep and rupture testing machine with single-lever structure is designed for long-term creep and stress rupture test applications. The series mechanical creep and rupture testing system is mainly for the metallic materials under room or elevated temperature according to GB/T2039, GB/T 20120, EN ISO 204-2009 and ASTM E139. The creep and rupture testing machine can also maintain constant loads for extended periods of time. Through the mechanical advantage of the lever arm loading system, constant loads can be maintained with a high degree of accuracy for long duration. This creep and rupture tester uses dead weights without continuous operation and the dependency of a mechanically powered drive. The creep and rupture testing system is an ideal equipment for metallurgy manufacturer, research institute, colleges and other relevant factories and mines.

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