Showing results: 76 - 90 of 105 items found.
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UNIVANS Co., Ltd.
IC Package It is a device to install INTERFACE between TESTER and DEVICE during TEST to check electrical defects such as O / S (Open, Short) test, mounting test, BURN-IN TEST and RLC TEST, The device
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Amkor Technology, Inc.
With knowledge gathered from decades of supporting Tier 1 and emerging industry leaders, Amkor understands test solutions must address advanced technology, quality, performance and cost of test. We offer full turnkey solutions including wafer processing, advanced bump, wafer probe, assembly, final test, system-level test, burn-in and end-of-line services.
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Reltech Limited
The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
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Plastronics Socket Company
We’ve taken our QFN expertise and combined it with the versatility and performance of the H-Pin® to leverage an LGA socket platform that serves the demanding requirements of today’s market. Plastronics LGA sockets using the H-Pin provide a high-performance socket that is affordable for all burn-in operations. These LGA sockets meet the power, temperature and signal performance needs of the higher density, larger package outline, and sometimes mix-pitch LGA designs. The LGA platform serves package sizes from as small as 2.0mm X 2.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm packages.
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IST Engineering, INC.
Burn-in generally involves the extended operation of a product in a temperature-controlled environment. With possible humidity and supply voltage margining - the burn-in process can then be extended to include power stress (levels and on/off cycles) tests, high humidity environmental simulation as well as the classic "four corner test" of high voltage + high temperature, high voltage + low temperature, low voltage + high temperature and low voltage + low temperature.
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Yelo Ltd.
Laser reliability testing consists of a series of tests that laser diodes can be put under in order to ensure their reliability for post-production use. There are different types of tests that can be carried out and there are multiple measurements that can be taken in order to evaluate the reliability of the device. One of these tests is laser diode burn-in.
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INCAL Technology, Inc.
Incal Offers A Line Of State-Of-The-Art Burn-In Testing Hardware And Software For Retrofit And/Or Total, Customized Burn-In System Configurations.
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SC924 -
Frothingham Electronics Corporation
The SC924 is an electromechanical device for testing diodes loaded on burn-in boards.A set of Kelvin contacts is indexed from diode to diode. The contacts move over a range of 24 inches in the X direction and the table holding the boards moves over a range of 9 inches. This allows scanning of multiple burn-in boards or boards with multiple rows of diodes.
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Sonoma -
INCAL Technology, Inc.
High power burn-in system with advanced testing functionality at DUT level for substantially lower cost and high performance using State-of-the-Art technology
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FOX-15 -
Aehr Test Systems
Up to 15 wafers at a time Known Good Die solution Lowers production cost
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Komeg Technology Ind Co.,Ltd
Isolated type of burn-in room features: ●Separate the product and loading area, easy to control temperature and maintain. ●Temp. range: 40-70ºC±3/±5ºC, ●Temp. constancy: ±0.5ºC ●Uniformity: ±3ºC ●Test frame materials: painted stainless steel or a combination of forming aluminum ●Insulation: with PU foam ( doors with double glazing ) insulation, so that the internal temperature is not subject to external factors, to achieve power saving effect ●Product hierarchy placement, Selection of layer height in accordance with the requirements, convenient access ●Computer monitoring system is optional. ●Noise level:≤75dB Application Suitable for all kinds of electronic products, especially for products with heating characteristics Product and loading area should be separated Large-scale production
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7000 Series -
Arroyo Instruments
The new 7000 Series MultiSource Multi-Channel Controller is designed for applications requiring a large number channels in a cost-effective and compact solution. With both laser driver and temperature controller options, the MultiSource is an excellent building block for system applications such as device burn-in and characterization.
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KDM -
Bemco Inc.
The Bemco KDM is similar to the Bemco Koldburn KDR except it has a circular air flow conditioning system located on the chamber ceiling, and is optimized for shelf supported temperature cycling, burn-in, stress screening, and storage of valuable pharmaceutical products or medical devices.
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NEOSEM TECHNOLOGY INC
The N3500 is Neosem Technology’s fourth generation memory test system. Specifically designed for Flash Components and Flash Cards, the N3500 tester-on-a-board architecture targets the broadest range of DUT technologies in various form factors and packages. Each Tester Board (or “Blade”) contains 288 I/O pins and 32 DPS supplies. Up to 64 Blades populated in one test head can test over 2000 DUTs in parallel. Neosem Technology’s high parallel DUT count architecture, combined with low capital cost, provides the absolute lowest HVM cost of test.